• 제목/요약/키워드: thermal degradation temperature

검색결과 577건 처리시간 0.027초

Study on the Thermal Degradation Behavior of FKM O-rings

  • Lee, Jin Hyok;Bae, Jong Woo;Choi, Myoung Chan;Yoon, Yoo-Mi;Park, Sung Han;Jo, Nam-Ju
    • Elastomers and Composites
    • /
    • 제53권4호
    • /
    • pp.213-219
    • /
    • 2018
  • The degradation mechanism and physical properties of an FKM O-ring were observed with thermal aging in this experiment. From X-ray photoelectron spectroscopy (XPS) analysis, we could observe carbon (285 eV), fluoro (688 eV), and oxygen (531 eV) peaks. Before thermal aging, the concentration of fluoro atoms was 51.23%, which decreased to 8.29% after thermal aging. The concentration of oxygen atoms increased from 3.16% to 20.39%. Under thermal aging, the FKM O-ring exhibited debonding of the fluoro-bond by oxidation. Analysis of the C1s, O1s, and F1s peaks revealed that the degradation reaction usually occurred at the C-F, C-F2, and C-F3 bonds, and generated a carboxyl group (-COOH) by oxidation. Due to the debonding reaction and decreasing mobility, the glass transition temperature of the FKM O-ring increased from $-15.91^{\circ}C$ to $-13.79^{\circ}C$. From the intermittent CSR test, the initial sealing force was 2,149.6 N, which decreased to 1,156.2 N after thermal aging. Thus, under thermal aging, the sealing force decreased to 46.2%, compared with its initial state. This phenomenon was caused by the debonding reaction and decreasing mobility of the FKM O-ring. The S-S curve exhibited a 50% increase in modulus, with break at a low strain and stress state. This was also attributed to the decreasing mobility due to thermal aging degradation.

Survivability assessment of Viton in safety-related equipment under simulated severe accident environments

  • Ryu, Kyungha;Song, Inyoung;Lee, Taehyun;Lee, Sanghyuk;Kim, Youngjoong;Kim, Ji Hyun
    • Nuclear Engineering and Technology
    • /
    • 제50권5호
    • /
    • pp.683-689
    • /
    • 2018
  • To evaluate equipment survivability of the polymer Viton, used in sealing materials, the effects of its thermal degradation were investigated in severe accident (SA) environment in a nuclear power plant. Viton specimens were prepared and thermally degraded at different SA temperature profiles. Changes in mechanical properties at different temperature profiles in different SA states were investigated. The thermal lag analysis was performed at calculated convective heat transfer conditions to predict the exposure temperature of the polymer inside the safety-related equipment. The polymer that was thermally degraded at postaccident states exhibited the highest change in its mechanical properties, such as tensile strength and elongation.

Thermal Characteristics: Gap of LED Devices and LED's Lighting Application

  • Liu, Muqing;Zhang, Wanlu;Zhu, Xiaojing
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
    • /
    • pp.1347-1348
    • /
    • 2008
  • The efficacy and its degradation of light emitting diode(LED) are related to its PN junction's temperature(Tj). Currently efficacy in certain temperature and thermo-resistant are defined for the depending. However, the definitions are quite inconvenient for lighting application. The paper focuses on the issue and presents a method to evaluate the thermal characteristics of LED efficay.

  • PDF

Lifetime Assessment for Oil-Paper Insulation using Thermal and Electrical Multiple Degradation

  • Kim, Jeongtae;Kim, Woobin;Park, Hung-Sok;Kang, Ji-Won
    • Journal of Electrical Engineering and Technology
    • /
    • 제12권2호
    • /
    • pp.840-845
    • /
    • 2017
  • In this paper, in order to investigate the lifetime of oil-paper insulation, specimens were artificially aged with thermal and electrical multiple stresses. Accelerated ageing factors and equivalent operating years for each aging temperatures were derived from results of tensile strengths for the aged paper specimens. Also, the evaluation for the multi-stress aged specimens were carried out through the measurement of impulse breakdown voltage at high temperature of $85^{\circ}C$. The lifetimes of the oil-paper insulations were calculated with the value of 66.7 for 1.0 mm thickness specimens and 69.7 for 1.25 mm thickness specimens throughout the analysis of impulse BD voltages using equivalent operating years, which means that dielectric strengths would not be severely decreased until the mechanical lifetime limit. Therefore, for the lifetime evaluation of the oil-paper insulation, thermal aging would be considered as a dominant factor whereas electrical degradation would be less effective.

옥내용 에폭시 수지의 열화 특성 (Degradation Properties of Epoxy Resin Used in Indoor)

  • 남기동;정중일;연복희;허창수;박영두
    • 한국항해항만학회:학술대회논문집
    • /
    • 한국항해항만학회 2000년도 추계학술대회논문집
    • /
    • pp.57-60
    • /
    • 2000
  • In this paper, study on the properties of the thermal degradated epoxy resin which is used in indoor insulation apparatus is performed to investigate the problems of the decreasing insulation characteristics and crack in the indoor insulation apparatus. As a parameter of variation, SEM, contact angle, surface resistivity, relative dielectric constant and weight loss are measured. As the results of the above measurements, the contact angle and surface resistivity of the epoxy resin has increased to 200$^{\circ}C$ in but at the above 200$^{\circ}C$ the values have decreased. The relative dielectric constants the thermal treated samples have increased on with the temperature increase. We find the volatile components of the epoxy resin compound has disappeared during thermal degradation by SEM. The insulation properties of the epoxy resin have increased by the 200$^{\circ}C$ but decreased in the above 200$^{\circ}C$.

  • PDF

옥내용 에폭시 수지의 열화 특성 (Degradation Properties of Epoxy Resin Used in Indoor)

  • 남기동;정중일;연복희;허창수;박영두
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2000년도 추계학술대회 논문집
    • /
    • pp.57-60
    • /
    • 2000
  • In this paper, study on the properties of the thermal degradated epoxy resin which is used in indoor insulation apparatus is performed to investigate the problems of the decreasing insulation characteristics and crack in the indoor insulation apparatus. As a parameter of variation, SEM, contact angle, surface resistivity, relative dielectric constant and weight loss are measured. As the results of the above measurements, the contact angle and surface resistivity of the epoxy resin has increased to 200$^{\circ}C$ in but at the above 200$^{\circ}C$ the values have decreased. The relative dielectric constants the thermal treated samples have increased on with the temperature increase. We find the volatile components of the epoxy resin compound has disappeared during thermal degradation by SEM. The insulation properties of the epoxy resin have increased by the 200$^{\circ}C$ but decreased in the above 200$^{\circ}C$.

  • PDF

Poly(methyl methacrylate)와 Poly(acrylonitrile butadiene styrene)와의 혼합에 의한 열분해속도에 관한 연구 (Kinetic Study on the Thermal Degradation of Poly(Methyl Methacrylate) and Poly(Acrylonitrile Butadiene Styrene) Mixtures)

  • 문덕주;김동건;설수덕
    • Elastomers and Composites
    • /
    • 제24권1호
    • /
    • pp.11-18
    • /
    • 1989
  • The thermal degradation of Poly(methyl methacrylate) (PMMA) and poly(acrylonitrile butadiene styrene)(ABS) terpolymer as well as their mixtures were carried out using the thermogravimetry and differential scanning calorimetry(DSC) in the stream of nitrogen and air with 50 ml/min at the various heating rate from 4 to $20^{\circ}C/min$ and temperature from 200 to $300^{\circ}C$ The values of activation energies of thermal degradation determined by TG and DSC in the various PMMA/ABS mixtures were $34{\sim}58Kcal/mol,\;35{\sim}54Kcal/mol$ in the stream of nitrogen. The values of activation energy of ABS20% mixture was appeared high in camparison with addition rule. According to increasing the composition of ABS, the temperatures of glass transition and initial decomposition temperature were increased. PMMA/ABS mixtures by the analysis of infrared spectrophotometer were decomposed by main chain scission in the stream of nitrogen.

  • PDF

Assessment of temperature effect in structural health monitoring with piezoelectric wafer active sensors

  • Kamas, Tuncay;Poddar, Banibrata;Lin, Bin;Yu, Lingyu
    • Smart Structures and Systems
    • /
    • 제16권5호
    • /
    • pp.835-851
    • /
    • 2015
  • This paper presents theoretical and experimental evaluation of the structural health monitoring (SHM) capability of piezoelectric wafer active sensors (PWAS) at elevated temperatures. This is important because the technologies for structural sensing and monitoring need to account for the thermal effect and compensate for it. Permanently installed PWAS transducers have been One of the extensively employed sensor technologies for in-situ continuous SHM. In this paper, the electro-mechanical impedance spectroscopy (EMIS) method has been utilized as a dynamic descriptor of PWAS behavior and as a high frequency standing wave local modal technique. Another SHM technology utilizes PWAS as far-field transient transducers to excite and detect guided waves propagating through the structure. This paper first presents how the EMIS method is used to qualify and quantify circular PWAS resonators in an increasing temperature environment up to 230 deg C. The piezoelectric material degradation with temperature was investigated and trends of variation with temperature were deduced from experimental measurements. These effects were introduced in a wave propagation simulation software called Wave Form Revealer (WFR). The thermal effects on the substrate material were also considered. Thus, the changes in the propagating guided wave signal at various temperatures could be simulated. The paper ends with summary and conclusions followed by suggestions for further work.

Small Punch Test for the Evaluation of Thermal Aging Embrittlement of CF8 Duplex Stainless Steel

  • Cheon, Jin-Sik;Kim, In-Sup;Jang, Jae-Gyoo;Kim, Joon-Gu
    • 한국원자력학회:학술대회논문집
    • /
    • 한국원자력학회 1996년도 춘계학술발표회논문집(3)
    • /
    • pp.79-84
    • /
    • 1996
  • Small punch test was performed on CF8 duplex stainless steel aged at 370 and 400$^{\circ}C$ up to 5,000 h to evaluate the degree of the thermal aging embrittlement. At room temperature, the SP load-displacement curve was in a similar shape to those of ferritic steels and had a good reproducibility in spite of two-phase structure. The aging heat treatment resulted in a slight increase of the yield strength. As test temperature was lowered, the SP load showed a sudden drop followed by serrations before the SP specimen was fractured, resulting from the cracking of ferrite phase. The extent of thermal embrittlement was assessed in terms of the SP energy. Aging treatment at higher temperature led to a larger shift in the transition temperature and the corresponding change in the fracture mode. The main cause of the degradation was the embrittlement of ferrite phase. Additionally the phase boundary separation profoundly contributed to the degradation of the specimen aged at 400$^{\circ}C$.

  • PDF

3-성분 종입자법으로 제조된 ZnO-Varistor의 열화기구 (Degradation Mechanism of the ZnO-Varistor Fabricated with the content of a 3-Composition Seed grain)

  • 장경욱;박춘배;이준웅
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 1992년도 춘계학술대회 논문집
    • /
    • pp.97-100
    • /
    • 1992
  • The Degradation mechanism of the ZnO-varistor fabricated with the content of a 3-Composition seed grain is discussed using the method of Thermally Stimulated Current (TSC). The spectra of TSC is measured in the temperature range of -130~270$^{\circ}C$ with a various forming electric fields E$\sub$f/, temperature T$\sub$f/ time tf, and a various rising rate of temperature. It is observed that there are appeared the peaks of ${\alpha}$, ${\alpha}$$_2$, ${\beta}$ and ${\gamma}$from high temperature in a TSC spectrum. It seems that ${\alpha}$$_1$ peak is due to thermal depolarization of donor ions forming the space charge in the depletion layer, and ${\alpha}$$_2$peak is due to the detrapping of trapped electrons in deep trap level of intergranular layer, and ${\beta}$ peak is due to the thermal exciting of carrier existing in the donor level of grain itself, and ${\gamma}$ peak is due to the thermal exciting of trapped carrier in all shallow trap site randomly distributed in the inner of sample and/or a intrinsic impurity existing in it.

  • PDF