• Title/Summary/Keyword: thermal cycles

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The metameric effect of monolithic zirconias with varying yttrium ratios

  • Mehmet Ejder Guven;Ozlem Kara
    • The Journal of Advanced Prosthodontics
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    • v.16 no.1
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    • pp.48-56
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    • 2024
  • PURPOSE. To evaluate the metameric disparities among monolithic zirconia materials with differing yttrium compositions across various lighting conditions. MATERIALS AND METHODS. Thirty-six square-shaped zirconia samples measuring 10 × 10 × 0.5 mm were prepared from monolithic zirconia materials with three different yttrium contents. A 0.2 mm thick layer of polymerized dual-polymerizable self-adhesive resin cement was created using a silicone mold with the same dimensions as the prepared zirconia specimens. To evaluate metamerism, color measurements were conducted using a spectrophotometer device on a neutral gray background in a color measurement cabinet that offers four different illumination environments. All samples underwent aging by subjecting them to 10000 thermal cycles using a thermal cycle tester. Following thermal aging, color measurements were taken once more, and the data were recorded using the CIE L*, a*, b* color system. Two-way ANOVA and Post-hoc Bonferroni tests were employed to analyze the data. RESULTS. It was observed that there was no statistical difference among the color measurements made in different illumination environments of the monolithic zirconia ceramics used to evaluate metamerism (P > .05). This observation remained consistent both before and after thermal aging. After thermal aging, the color of monolithic zirconia materials exhibited a tendency towards red and yellow hues, accompanied by a decrease in brightness levels. CONCLUSION. It can be stated that different illumination conditions did not affect the metamerism of monolithic zirconia materials, but there was a color change in monolithic zirconia materials after a thermal aging period equivalent to one year.

Improvement of Efficiency of Kalina Cycle and Performance Comparison (Kalina 사이클의 효율 향상 방안 및 성능 비교)

  • Yoon, Jung-In;Son, Chang-Hyo;Choi, Kwang-Hwan;Son, Chang-Min;Seol, Sung-Hoon;Lee, Ho-Saeng;Kim, Hyeon-Ju
    • Journal of the Korean Solar Energy Society
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    • v.35 no.5
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    • pp.11-19
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    • 2015
  • In this paper, EP-Kalina cycle applying liquid-vapor ejector and motive pump is newly proposed. In this EP-Kalina cycle, the liquid-vapor ejector is used to increase pressure difference between inlet and outlet of the turbine. Also the motive pump enhances the performance of liquid-vapor ejector, resulting in increase of system efficiency of OTEC cycles. The comparison cycles in this study are basic, Kalina, EKalina and EP-Kalina ones. The pump work, net power, APRe, APRc, TPP and system efficiency of each cycle are compared. In case of net power, EP-Kalina cycle is lowest among the cycles due to the application of the motive pump. But, the net power difference of cycles seems to be minor since the pump work of cycles is merely about 1kW, compared to turbine gross power of 20kW. The system efficiency of EP-Kalina cycle shows 3.22%, relatively 44% higher than that of basic OTEC cycle. Therefore, the system efficiency is increased by applying the liquid-vapor ejector and the motive pump. Additional performance analysis is necessary to optimize the proposed EP-Kalina cycle.

Color Characteristics of 3D-Printed TPU Material Applied with Ultra-Violet Curable Digital Printing Process (자외선 경화형 디지털 프린팅을 이용한 3D 프린팅 TPU 소재의 색채 특성)

  • Lee, Sunhee;Park, Soyeon;Jung, Imjoo;Lee, Jungsoon
    • Journal of the Korean Society of Clothing and Textiles
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    • v.45 no.6
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    • pp.1052-1062
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    • 2021
  • This study aims to confirm the possibility of Ultra-Violet (UV)-printed 3D printing materials using thermal polyurethane (TPU) with CMYK colors by applying an eco-friendly UV digital printing process. A UV-printed 3D printing TPU material was prepared with cycles of UV printing and CMYK colors. Dyeability of the 3D TPU samples with cycles of UV printing and CMYK were analyzed for thickness, weight, surface roughness, reflectance, colorimetry, and K/S values. The thickness and weight of 3D-printed TPU samples with cycles of UV printing are increased with overprints from 1 to 5. The surface roughness of 3D-printed TPU samples with increasing UV prints were decreased, meaning that the surface of TPU samples becomes gradually smoother. The reflectance spectra of CMYK UV-printed TPU samples showed the surface reflectance within each characteristic wavelength of CMYK. The 3D-printed TPU samples, subjected to UV printing twice or more, showed low surface reflectance. After examining the L*a*b* of the 3D-printed TPU samples by the cycles of UV printing, the study found that the more UV got printed more than 2 times, the closer the color to each CMYK.

A Study on Change of Texture During Thermal Cycling in Cu-Zn-AI Shape Memory Alloy (Cu-Zn-AI 형상기억 합금의 열사이클에 따른 집합조직의 변화에 관한 연구)

  • Hong, D.W.;Park, Y.K.
    • Journal of the Korean Society for Heat Treatment
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    • v.5 no.3
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    • pp.179-185
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    • 1992
  • The shape memory effect results from the martensite transfomation of each individual grain. Thus it is necessary to study the texture and its variation. In this study the change of texture during thermal cycling and it's effect on shape memory ability are investigated. The major component of the rolling texture in the parent phase is identified (001) [110], and minor components are (112) [110], (111) [112], {hkl}<100> fiber texture is developed at $45^{\circ}$ from rolling direction. In the case of martensite phase, it is estimated that the major component is (011) [100] and the minor components are (105) [501], (010) [101] and (100) [001]. According to thermal cycling. severity of texture, especially (001) [110] component in parent phase and (011) [100] component in martensite phase are increased. The shape memory ability is increased with increase of thermal cycles and also increased as the direction of specimen approach to $45^{\circ}$ from rolling direction. After first thermal cycling the temperature of transformation can be define clearly and Ms and As are raised by thermal cycling.

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A Study on the Fracture Mode Characteristics of Automotive Application Component Lead-free Solder Joints (자동차 전장부품 무연솔더 접합부의 파괴모드 특성에 관한 연구)

  • Jeon, Yu-Jae;Kim, Do-Seok;Shin, Young-Eui
    • Transactions of the Korean Society of Automotive Engineers
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    • v.19 no.6
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    • pp.90-96
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    • 2011
  • In this study, the characteristic of fractured portion and shape on solder joints were investigated according to the thermal shock test for Automotive Application Component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as Lead-free solder. The value of pull and shear strength was decreased in principle after 432 cycles thermal shock test. In addition, fracture mode was verified by using EDS and SEM to observe fractured shape on the solder joints before and after thermal shock. In before thermal shock test, the fracture mode revealed typically solder layer's fracture mode. In after thermal shock test, we identified multiple fracture mode of the ductile and brittle fracture. Even though same composition of solder was used to experimental for estimating. the fracture mode varied on the fracture portion's height and the directional angles of shear strength. In conclusion, we identified that mechanical strength was affected on the solder layer's fracture mode.

Numerical simulation of a regenerative thermal oxidizer for volatile organic compounds treatment

  • Hao, Xiaowen;Li, Ruixin;Wang, Jiao;Yang, Xinfei
    • Environmental Engineering Research
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    • v.23 no.4
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    • pp.397-405
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    • 2018
  • As regulations governing the control of volatile organic compounds (VOCs) have become increasingly stringent in China, regenerative thermal oxidizers (RTOs) have been more frequently applied in medium- and high-concentration VOCs treatments. However, due to the lack of existing RTO-related research, experience remains a dominant factor for industrial application. This paper thus aimed to establish a model for industrial RTOs, using a transient simulation method and thermal equilibrium model to simulate the internal velocities and temperature distributions of an RTO across multiple cycles. A comparison showed an error of less than 5% between most correlating simulated and experimental measurement points, verifying that the simulation method was accurate. After verification, the velocity and temperature fields inside the RTO were simulated to study the uniformity of temperature and velocity within the packed beds: both fields displayed high uniformity after gas flowed through the honeycomb regenerator. The effects of air volume, VOCs concentrations, and valve switching times on the oxidation chamber temperature, RTO outlet temperature, and thermal efficiency (as well as their averages) were studied. The VOCs removal rate in this study was constantly above 98%, and the average thermal efficiency reached 90%.

Contact Resistance and Thermal Cycling Reliability of the Flip-Chip Joints Processed with Cu-Sn Mushroom Bumps (Cu-Sn 머쉬룸 범프를 이용한 플립칩 접속부의 접속저항과 열 싸이클링 신뢰성)

  • Lim, Su-Kyum;Choi, Jin-Won;Kim, Young-Ho;Oh, Tae-Sung
    • Korean Journal of Metals and Materials
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    • v.46 no.9
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    • pp.585-592
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    • 2008
  • Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.

Effects of Accelerated Thermal Aging on Dynamic Properties of Laminated Rubber Bearings (적층고무받침의 가속 열 노화 동적특성 영향)

  • Oh, Ju;Jung, Hie-Young
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.30 no.5A
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    • pp.417-424
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    • 2010
  • The dynamic properties of laminated rubber bearings used as isolators in structures could be significantly deteriorated because of the change of microstructure in rubber caused by thermal aging. As a result, a catastrophic failure of bridges and buildings unexpectedly occurs when they are subjected to earthquake attack. Here, the dynamic properties of laminated rubber bearings before and after different of compression-shear loading and repeated cycles loadings, ultimated failure test with thermal aging were first measured and compared to each other. The experimental results, the effects of thermal aging on the shear stiffness, energy absorption, and equivalent damping coefficient of laminated rubber bearings are investigated. It is found that the deterioration of dynamic properties of laminated rubber bearings caused by thermal aging is significant and should be taken into account in designing rubber bearings.

A Study of Sports Socks Varying Knitted Fabrics on Hygienic and stability Properties (각종 편성소재에 따른 스포츠양말의 위생성과 형태안정성에 관한 연구)

  • 이명자;김칠순
    • The Research Journal of the Costume Culture
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    • v.7 no.5
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    • pp.165-176
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    • 1999
  • The purpose of this study was to evaluate the effect of various knitted fabrics of sports socks on their properties of hygiene and stability. Seventeen men\`s sports socks to represent five groups with different fiber content, knit structure, yarn fineness, and finishing were used. Properties of hygiene and stability of socks were determined. The results were as follows ; 1. Evaluation of Water, vapor and heat transport properties in socks with varing fiber content showed that cotton 100% socks had the highest drop absorbency, wickability, water absorbency and water retention. Polypropylene 100% socks had an excellent wickability and moisture permeability. Acrylic blend socks had the highest thermal resistance. 2. The greatest knit stretch and knit growth of socks having lower power were found to be with cotton 100% socks had the lowest stretch. Acrylic blend socks had a excellent stretch but low fabric growth, which could give a good fir sensation during wear. 3. The commerical antimicrobial finished socks showed excellent durability after repeated cycles of laundering. 4. Length and width shrinkages were found in all laundered samples during initial cycles due to rearrangement by mechanical relaxation. Shrinkages showed no further changes and reached equilibriums after 5 cycles. Cotton 100% or cotton blend socks showed lower dimensional stability than other socks during fabric care.

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Large Displacement Polymer Bimorph Actuator for Out-of-Plane Motion

  • Jeung Won-Kyu;Choi Seog-Moon;Kim Yong-Jun
    • Journal of Electrical Engineering and Technology
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    • v.1 no.2
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    • pp.263-267
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    • 2006
  • A new thermal bimorph actuator for large out-of-plane displacement is designed, fabricated and tested. The deflecting beam is composed of polyimide, heater, and polyvinyl difluorides with tetrafluoroethylene (PVDF-TrFE). The large difference of coefficient of thermal expansion (CTE) of two polymer layers (polyimide and PVDF-TrFE) can generate a significant deflection with relatively small temperature rise. Compared to the most conventional micro actuators based on MEMS (micro-electro mechanical system) technology, a large displacement, over 1 mm at 20 mW, could be achieved. Additionally, we can achieve response time of 14.6 ms, resonance frequency of 12 Hz, and reliability ability of $10^5$ cycles. The proposed actuator can find applications where a large vertical displacement is needed while maintaining compact overall device size, such as a micro zooming lens, micro mirror, micro valve and optical application.