• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.27-32
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• 2010

For the flip chip joints processed using Cu pillar bumps and Sn pads, thermal cycling and high temperature storage reliabilities were examined as a function of the Sn pad height. With increasing the height of the Sn pad, which composed of the flip chip joint, from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance of the flip chip joint decreased from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$. Even after thermal cycles of 1000 times ranging from $-45^{\circ}C$ to $125^{\circ}C$, the Cu pillar flip chip joints exhibited the contact resistance increment below 12% and the shear failure forces similar to those before the thermal cycling test. The contact resistance increment of the Cu pillar flip chip joints was maintained below 20% after 1000 hours storage at $125^{\circ}C$.

• Journal of Photoscience
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• v.9 no.2
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• pp.194-196
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• 2002

While ultraviolet radiation alters various cutaneous cell functions, little is known about photo-immunological and photobiological effects of infrared radiation (IR) on the skin except its local thermal effects. The fIrst part of this study demonstrated that single exposure of mouse skin to near IR (0.7 - 1.3 $\mu$m) reversibly suppressed the proliferating activity of the epidermis, the density of Langerhans cells, and the ability of skin to induce contact hypersensitivity reaction. The second part demonstrated that the rate of wound closure was significantly accelerated by repeated exposures in animal models. The production of transforming growth factor-$\beta$l and matrix metalloproteinase-2, which are responsible for the wound healing processes, was significantly upregulated by irradiation, as shown by enzyme immunoassay, zymography, and reverse transcription polymerase chain reaction. Thermal controls were negative. The results suggest that near-IR irradiation can modulate the epidermal proliferation and part of the skin immune system, and stimulate the wound healing processes, presumably by non-thermal effects.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.1959-1963
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• 2007

SMES systems need cryogenic cooling systems. Conduction cooling system has more effective, compact structure than cryogen. In general, 2 stage GM cryocoolers are used for conduction cooling of HTS SMES system. 1st stages of cryocoolers are used for the cooling of current leads and radiation shields, and 2nd stages of cryocoolers for HTS coil. For the effective conduction cooling of the HTS SMES system, the temperature difference between the cryocooler and HTS coil should be minimized. In this paper, a cryogenic conduction cooling system for HTS SMES is analyzed to evaluate the performance of the cooling system. The analysis is carried out for the steady state with the heat generation of the HTS coil and effects of the thermal contact resistance. The results show the effects of the heat generation and thermal contact resistance on the temperature distribution.

• Journal of the Korean Society of Safety
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• v.23 no.3
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• pp.25-29
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• 2008

In automotive disc brake system, friction heat is not uniformly distributed due to various reasons such as thermal expansion and imperfections in geometry. It is well known that thermoelastic distortion due to fictional heating affects the contact pressure distribution and can lead to thermoelastic instability, where the contact load is concentrated in one or more small regions on the brake disc surface. These regions then take very high temperatures and passage of hot spots moving under the brake pads can cause low frequency vibration called brake judder. This paper presents the FEM(finite element method) result for the temperature distribution of ventilated disc brake. A steady state two-dimensional model of disc brake system predicts the surface temperatures during a multi-stop driving schedule.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2000.11a
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• pp.57-60
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• 2000

In this paper, study on the properties of the thermal degradated epoxy resin which is used in indoor insulation apparatus is performed to investigate the problems of the decreasing insulation characteristics and crack in the indoor insulation apparatus. As a parameter of variation, SEM, contact angle, surface resistivity, relative dielectric constant and weight loss are measured. As the results of the above measurements, the contact angle and surface resistivity of the epoxy resin has increased to 200$^{\circ}C$ in but at the above 200$^{\circ}C$ the values have decreased. The relative dielectric constants the thermal treated samples have increased on with the temperature increase. We find the volatile components of the epoxy resin compound has disappeared during thermal degradation by SEM. The insulation properties of the epoxy resin have increased by the 200$^{\circ}C$ but decreased in the above 200$^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.50-53
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• 2001

In this study, gate leakage current mechanism has been analyzed for GaAs MESFET with different temperatures ranging from 27$^{\circ}C$ to 300$^{\circ}C$ . It is expected that the thermionic and field emission at the MS contact will dominate the current flow. Thermal cycle is applied to test the reliability of the device. From the results, it is proved that thermal stress gradually increases the gate leakage current at the same bias conditions and leads to the breakdown and failure mechanism which is critical in the field equipment. Finally the gate contact under the repeated thermal shock has been tested to check the quality of Schottky barrier and the current will be expressed in the analytical from to associate with the electrical characteristics of the device.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.7
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• pp.975-980
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• 2001

The thermal analysis of the hot roller in a dry film laminator is studied numerically by steady-state two-dimensional heat transfer. In the laminating process for PDP glass or PCB, the temperature distributions in a hot roller are presented considering the effects of the roller rotation speed and the inner and outer radii of the roller. The results show that the temperature distributions are strongly dependent on Peclet number. If Pe number becomes larger, the iso-thermal lines are more concentric about the rotating axis and the temperature difference on the hot roller surface decreases exponentially. It also shows that if the contact angle between the roller and the film becomes smaller the temperature difference becomes smaller. However, the changes of the rollers inner or outer radius have little effect on the temperature difference.

• Journal of Advanced Marine Engineering and Technology
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• v.18 no.3
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• pp.1-9
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• 1994

The transient temperature distribution of materials during upsetting forming is very important for quality of upsetted workpiece and understanding the thermal characteristics of upsetting is essential for optimum control of the forming. In this paper it is shown that the governing equation of heat transfer for axi-symetric body can be derived from minimizing a functional, and from this theory, formulation of analysis by the finite element method is presented. It is also shown that the thermal contact resistance between two bodies can be represented by equivalent coefficient of heat conductivity. Some examples of calsulated transient temperature distributions by the computer program diveloped from the theory presented in this paper are given in graphic forms. It is proven that the results calculations are very plausible.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.6 s.249
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• pp.705-712
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• 2006

A finite element method based on the penalized subdomain-interface framework is proposed for fully-coupled, nonlinear thermomechanical analyses with thermal contact anuor radiation boundaries. In the variational formulation, a well-known penalty functional scheme is adopted for connecting subdomains and interfaces that satisfy various continuity requirements. As a logical consequence, the whole domain can be arbitrarily divided into independently-modeled subdomains without considering the conformity of meshes along their interfaces. Since the nonlinearities due to the contact and radiation boundaries can be localized within a few subdomains, the computational efficiency of the present method is greatly increased with appropriate solution algorithms. By solving some numerical problems, these advantageous features are confirmed carefully.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.385-386
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• 2006

A brake disk in railway vehicle is safety part. Requirements not only in performance but also in comfort, serviceability and working lifetime are high and rising. In this study, we carried out fatigue test and thermal stress analysis. To determine a pressure distribution, contact pressure analysis precede thermal stress analysis. Especially, characteristics of the brake disk were analyzed in considering intial velocity, and thickness of a frictional plate. Form the comparing the results of experiment and FEM analysis, fatigue characteristic and fatigue life assessment ok a brake disk of railway vehicle were performed.