• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.37-43
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• 1999

Modules of the system that requires large capacity and high-speed information processing are implemented in the form of MCM that allows high-speed data processing, high density circuit integration and widely applied to such fields as ATM, GPS and PCS. Hence we developed the ATM switching module that is consisted of three chips and 2.48 Gbps data throughput, in the form of 10 multi-layer by Cu/Photo-BCB and 491pin PBGA which size is $48 \times 48 \textrm {mm}^2$. hnologies required for the development of the MCM includes extracting parameters for designing the substrate/package through the interconnect characterization to implement the high-speed characteristics, thermal management at the high-density MCM, and the generation of the testability that is one of the most difficult issues for developing the MCM. For the development of the ATM Switching MCM, we extracted signaling delay, via characteristics and crosstalk parameters through the interconnect characterization on the MCM-D. For the thermal management of 15.6 Watt under the high-density structure, we carried out the thermal analysis. formed 1.108 thermal vias through the substrate, and performed heat-proofing processing for the entire package so that it can keep the temperature less than $85^{\circ}C$. Lastly, in order to ensure the testability, we verified the substrate through fine pitch probing and applied the Boundary Scan Test (BST) for verifying the complex packaging/assembling processes, through which we developed an efficient and cost-effective product.

• 한국연소학회:학술대회논문집
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• 2000.12a
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• pp.17-23
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• 2000

Knock in SI engines causes physical damage to the piston and combustion chamber and lowers the thermal efficiency. The increase in compression ratio which can improve the thermal efficiency and engine performance has been limited by engine knock. So the need of making clear the knocking phenomenon has increased. This paper reviews the methods of knock detection, characterization and prediction of knock with the reduced chemical kinetic modeling.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1193-1197
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• 2006

The novel oligomers were synthesized by Grignard reaction, the suzuki coupling reaction, etc. The oligomers were characterized by Infrared (IR), Mass spectrometer (MS). Their thermal properties were investigated by differential scanning calorimetry (DSC) and Thermogravimetric analysis (TGA). The new oligomers showed high thermal stability above $300^{\circ}C$.

• Journal of the Korean Society of Combustion
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• v.5 no.2
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• pp.29-35
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• 2000

Knock in SI engines causes physical damage to the piston and combustion chamber and lowers the thermal efficiency. The increase in compression ratio which can improve the thermal efficiency and engine performance has been limited by engine knock. So the need of making clear the knocking phenomenon has increased. This paper reviews the methods of knock detection, characterization and prediction of knock with the reduced chemical kinetic modeling.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.7
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• pp.1038-1044
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• 2013

A research on thermal analysis method is conducted for the characterization of heat generation during operation of Interior Permanent Magnet Synchronous Motor(IPMSM) for Light Railway Transits(LRT) in this paper. Efficient cooling of the heat generated in the IPMSM is important because the excessive heat generated from the winding, core and permanent magnet makes it harder for a long time continuous operation of IPMSM. Therefore, in order to analyze the heat generation characteristics of the 110kW-class IPMSM as advanced research for application the IPMSM to the cooling device, the heat transfer coefficients for each component of the 110 kW-class IPMSM were derived and the thermal equivalent network was configured to perform the thermal analysis in this study. Finally, the 110kW-class IPMSM prototype is made and a comparative verification between the test data and the thermal analysis results through its various performance tests are carried out.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1575-1577
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• 1999

XLPE is widely used as a main insulation in EHV power cables, deeply connected with thermal stress. In this study, the thermal history of XLPE insulation was examined using DSC(Differential Scanning Calorimetry). The principle is on the basis of the phenomenon that crystal in polyethylene is rearranged as it is annealed near/below the melting temperature. From the result, it was possible to define accurate temperature which was really applied on the XLPE insulation and this method was assured as a useful tool in characterization of thermal history in XLPE cable insulation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.315-316
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• 2009

본 논문에서는 1W 급 이상의 고출력 LED 용 패키지로서 세라믹 LTCC 적층 패키지의 방열 특성을 평가하고 열해석 결과와의 차이에 대해 고찰하였다. 특히, 세라믹 패키지의 방열 특성을 향상시키기 위해 Thermal Via와 Heat slug를 LED Chip 하단부에 위치시켰을 때 방열 특성을 평가하기 위해 Transient Thermal Test를 이용하여 각각의 경우에 대한 열저항을 평가하여 방열 특성의 항상 정도를 확인하였으며, 열해석 시뮬레이션을 통해 얻은 결과와 비교하였다. 평가 결과 Heat slug를 배치한 패키지가 열저항이 $8^{\circ}C/W$로서 가장 우수한 특성을 보여주었으며, 열해석 결과와의 차이에 대해서는 광출력으로 방출된 전력을 계산하여 보정함으로써 $1^{\circ}C$ 이하의 편차를 보여주는 결과를 얻을 수 있었다.

• Journal of the Korean Ceramic Society
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• v.32 no.3
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• pp.349-358
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• 1995

The ceramic composite membrane was synthesized by thermal oxidation after evaporation of Al on the support prepared by slip casting process. Oxidation was performed at $700^{\circ}C$ and 80$0^{\circ}C$ under dry oxygen atmosphere. It was considered as optimum oxidation condition that the membrane showed a knudsen behaviro. A further oxidation resulted in an increase of gas permeability because top layer became densified. Then, a multi-layered composite membrane was synthesized through a sol-gel method, evaporation and thermal oxidation of Al coating processes. While the membrane was thermally stable up to 80$0^{\circ}C$, gas permeability was rapidly decreased even at a slight amount of deposition of Al.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.2
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• pp.138-144
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• 2004

The initiation and the propagation of solder joint crack depend on its environmental conditions, such as high temperature creep and thermal fatigue. Creep is known to be the most important factor for the mechanical failure of solder joints in micro-electronic components and micro-systems. This is mainly caused by the different thermal expansion coefficients of the materials used in the micro-electronic packages. To determine the reliability of solder joints and consequently the electronic components, the characterization of the creep behavior of this group of materials is crucial. This paper is to apply the theory of creep into solder joints and to provide related technical information needed for evaluation of reliability of solder joint to failure. 63Sn-37Pb solder was used in this study. This paper experimentally shows a way to enhance the reliability of solder joints.

• Journal of Mechanical Science and Technology
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• v.18 no.4
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• pp.681-688
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• 2004

For use of the thermal cycle of the biochemical fluid sample, the isothermal temperature source with a large surface area was designed, fabricated and its thermal characterization was experimentally evaluated. The comprehensive overview of the technology trend on the temperature control devices was detailed. The large surface area isothermal temperature source was realized by using the vapor chamber heat spreader. The cost-effectiveness and simple manufacturing process were achieved by using the metal-etched wick structure. The temperature distribution was quantitatively investigated by using IR temperature imaging system at equivalent temperatures to the PCR thermal cycle. The standard deviation was measured to be within 0.7$^{\circ}C$ for each temperature cycle. This concludes that the presented isothermal temperature source enables no temperature gradient inside bio-sample fluid. Furthermore it can be applied to the cooling of the electronic devices due to its slimness and low thermal spreading resistance.