• Title/Summary/Keyword: thermal analysis simulation

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Space Simulation Test and Thermal Verification of HAUSAT-2 STM (Structural-Thermal Model) by Using Surface Heaters (표면히터를 이용한 HAUSAT-2 위성 STM의 우주모사 및 열해석 검증 연구)

  • Lee, Mi-Hyeon;Kim, Dong-Woon;Hwang, Ki-Lyong;Chang, Young-Keun
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.33 no.11
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    • pp.106-114
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    • 2005
  • This study addresses space simulation test results and thermal modelling verification of HAUSAT-2 nanosatellite STM (Structural-Thermal Model). The thermal modelling of the HAUSAT-2 has been modified in accordance with test results. Thermal analysis results were repeatedly compared with test results for modified thermal modelling. It is verified that the analysis results for modified thermal modelling agree well with test results. Some surface heaters were implemented to simulate solar illumination for HAUSAT-2 Thermal Vacuum/Balance Test. A low-cost and effective thermal test methodology, which is applicable to ultra-small satellite system, was proposed and verified by test results in this study.

Thermal Analysis and Optimization of 6.4 W Si-Based Multichip LED Packaged Module

  • Chuluunbaatar, Zorigt;Kim, Nam Young
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.39C no.3
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    • pp.234-238
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    • 2014
  • Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

A Study on the Thermal Design for A Signal Processor in the Micro-Wave Seeker (초고주파 탐색기 신호처리부의 방열설계에 관한 연구)

  • Lee, Won-Hee;Yu, Young-Joon;Kim, Ho-Yong
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.39 no.1
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    • pp.76-83
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    • 2011
  • This paper focuses on the thermal design of a signal processor in Micro-Wave Seeker. High temperature environment and ESS(Environmental Stress Screening) test condition should be considered in designing a signal processor. First, we performed the thermal analysis to know conditions under which a signal processor is thermally reliable. As a result of thermal analysis, we found that adopting heat transfer block to the thermally fragile components is most efficient, because the heat transfer block can control the thermal loads of the individual components. Next, we verified this solution by numerical simulation and experiment and concluded that thermal reliability of a signal processor can be achieved. Maximum temperature difference between numerical simulation and experiment is about $2^{\circ}C$.

Simulation Method for Thermal appropriate Desing of Compound Cylinder using Bondgraph Modeling (원통결합부의 열특성 최적설계를 위한 예측 시뮬레이션 방법)

  • 민승환;박기환;이선규
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.04a
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    • pp.635-640
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    • 1996
  • A thermo-elastic system in the production machine has highly nonlinear dynamic characteristics. In general, the finite element method is utilized for accurate analysis. However, it requires large computing time. Thus, thermo-elastic systems are usuallymodeled as electric and fluid system using lumped para,eter. In this paper. we propose the bondgraph model and transient simulation methodology of thermo-elastic system in consideration of various boundary and joint contact conditions. Consequently, the proposed method ensures a possibility of its on-line compensation about undesirable phenomena by using real time estimate process and electronic cooling device for thermal appropriate behavior. Thermo-elastic model consisting of bush and shaft including contact condition is presented.

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The Temperature Distribution and Thermal Stress Analysis of Mold transformer (주상용 몰드변압기의 온도분포와 열응력 해석)

  • 조한구;이운용;한세원
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.11a
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    • pp.387-390
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    • 2000
  • The life of transformer is significantly dependent on the thermal behavior in windings. To analyse winding temperature rise, many transformer designer have calculated temperature distribution and hot spot point by finite element method(FEM). Recently, numerical analyses of transformer are studied for optimum design, that is electric field analysis, magnetic field, potential vibration, thermal distribution and thermal stress. Therefore design time and design cost are decreased by numerical analysis. In this paper, the temperature distribution and thermal stress analysis of 50kVA pole cast resin transformer for power distribution are investigated by FEM program. The temperature change according to load rates of transformer also have been investigated. We have carried out temperature rise test and test results are compared with simulation data.

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Analysis of the fluid-solid-thermal coupling of a pressurizer surge line under ocean conditions

  • Yu, Hang;Zhao, Xinwen;Fu, Shengwei;Zhu, Kang
    • Nuclear Engineering and Technology
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    • v.54 no.10
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    • pp.3732-3744
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    • 2022
  • To investigate the effects of ocean conditions on the thermal stress and deformation caused by thermal stratification of a pressurizer surge line in a floating nuclear power plant (FNPP), the finite element simulation platform ANSYS Workbench is utilized to conduct the fluid-solid-thermal coupling transient analysis of the surge line under normal "wave-out" condition (no motion) and under ocean conditions (rolling and pitching), generating the transient response characteristics of temperature distribution, thermal stress and thermal deformation inside the surge line. By comparing the calculated results for the three motion conditions, it is found that ocean conditions can significantly improve the thermal stratification phenomenon within the surge line, but may also result in periodic oscillations in the temperature, thermal stress, and thermal deformation of the surge line. Parts of the surge line that are more susceptible to thermal fatigue damage or failure are determined. According to calculation results, the improvements are recommended for pipeline structure to reduce the effects of thermal oscillation caused by ocean conditions. The analysis method used in this study is beneficial for designing and optimizing the pipeline structure of a floating nuclear power plant, as well as for increasing its safety.

Experimental and Numerical Study of the Thermal Decomposition of an Epoxy-based Intumescent Coating (실험과 계산을 통한 에폭시 계열 내화도료의 열분해에 관한 연구)

  • Kim, Yangkyun
    • Fire Science and Engineering
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    • v.30 no.1
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    • pp.31-36
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    • 2016
  • This study investigates the characteristics of thermal decomposition of an epoxy-based intumescent paint using thermogravimetric analysis (TGA) and numerical simulation. A mathematical and numerical model is introduced to describe mass loss profiles of the epoxy-based intumescent coating induced by the thermal decomposition process. The decomposition scheme covers a range of complexity by employing simplified 4-step sequential reactions to describe the simultaneous thermal decomposition processes. The reaction rates are expressed by the Arrhenius law, and reaction parameters are optimized to fit the degradation behavior seen during thermogravimetric (TG) experiments. The experimental results show a major 2-step degradation under nitrogen and a 3-step degradation in an air environment. The experiment also shows that oxygen takes part in the stabilization of the intumescent coating between 200 and $500^{\circ}C$. The simulation results show that the proposed model effectively predicts the experimental mass loss as a function of time except for temperatures above $800^{\circ}C$, which were intentionally not included in the model. The maximum error in the simulation was less than 3%.

A Numerical Simulation of Regenerative Cooling Heat Transfer for the Rocket Engine (로켓엔진의 재생 냉각 열전달 해석)

  • 전종국;박승오
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2003.05a
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    • pp.127-130
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    • 2003
  • This paper presents the numerical thermal analysis for regeneratively cooled rocket thrust chambers. An integrated numerical model incorporates computational fluid dynamics for the hot-gas thermal environment, and thermal analysis for the liner and coolant channels. The flow and temperature fields in rocket thrust chambers is assumed to be axisymmetric steady state which is presumed to the combustion liner. The heat flux computed from nozzle flow is used to predict the temperature distribution of the combustion liner. As a result, we present the wall temperature of combustion liner and the temperature change of coolant.

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Analysis of PCM Wallboards Design Parameters using Dynamic Energy Simulation (동적 에너지 시뮬레이션을 이용한 PCM보드의 설계변수 분석에 관한 연구)

  • Lee, Jin-Uk;An, Sang-Min;Kim, Taeyeon;Lee, Seung-Bok
    • KIEAE Journal
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    • v.12 no.4
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    • pp.97-104
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    • 2012
  • A phase-change material is a substance with a high heat of fusion which, melting and freezing at a certain temperature, is capable of storing and releasing large amounts of energy. Heat is absorbed or released when the material changes from solid to liquid. Therefore, PCMs are classified as latent heat storage (LHS) units. The purpose of this study is to analyze PCM wallboard design parameters using dynamic energy simulation. Among the factors of PCM, melting temperature, latent heat, phase change range, thermal conductivity are very important element to maximize thermal energy storage. In order to analyze these factors, EnergyPlus which is building energy simulation provided by department of energy from the U.S is used. heat balance algorithm of energy simulation is conduction finite difference and enthalpy-temperature function is used for analyzing latent heat of PCM. The results show that in the case of melting temperature, the thermal energy storage could be improved when the melting temperature is equal to indoor surface temperature. It seems that when the phase change range is wide, PCM can store heat at a wide temperature, but the performance of heat storage is languished.

A Fundamental Study on Forecast of the Thin Plate Welding Deformation by Numerical Simulation (수치시뮬레이션에 의한 박판 용접 변형 예측에 관한 기초적 연구)

  • 김종명;박창수;김영표;방한서
    • Journal of Welding and Joining
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    • v.21 no.1
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    • pp.93-98
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    • 2003
  • For construction of steel structures, thin steel plates have been often used and welding is the main manufacturing process. However, welding processes cause some problems(welding residual stresses, welding deformations, etc.). In these problems, welding deformation is extremely harmful to the safety of structures especially. Therefore, in this study, a numerical analysis program based on large deformation plate theory has been developed to analyze and predict the welding deformation in thin plates. From the result of numerical analyse, we can find two parameters, thermal cycles and mechanical restraints affecting the welding deformation of structures. It is considered that large difference of thermal cycles and mechanical restraints in the width direction bring about welding deformation. Results of simulation have the same tendency of deformation distribution in width direction as experimental formulas.