• Title/Summary/Keyword: thermal analysis properties

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Characteristic Studies of Plasma Treated unidirectional Hildegardia Populifolia Fabric

  • Prasad, C. Venkata;Lee, D.W.;Sudhakara, P.;Jagadeesh, D.;Kim, B.S.;Bae, S.I.;Song, J.I.
    • Composites Research
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    • v.26 no.1
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    • pp.54-59
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    • 2013
  • This study deals with effect of plasma treatment on the properties of unidirectional ligno cellulosic fabric Hildegardia Populofolia (HDP) fabric. Thermal stability of the fabric was determined by differential scanning calorimetry (DSC) and Thermo gravimetric analysis (DSC). Morphological properties was analyzed by SEM analysis and found that the surface was rough upon plasma treatment which provides good interfacial adhesion with matrix during composite fabrication. Thermal stability and mechanical properties of the plasma treated fabric slightly increases compare to alkali and untreated fabric. It was observed that tensile properties of the fabric increases upon plasma treatment due to the formation of rough surface. SEM analysis indicates formation of rough surface on plasma treatment which helps in increasing the interfacial interaction between the matrix (hydrophobic) and fabric (hydrophilic).

Analysis of Sliding Friction and Wear Properties of Clutch Facing for Automobile (Part 2) (자동차용 클러치 마찰재의 미끄럼마찰마모특성 해석(제2보 마찰특성))

  • Lee Han-young;Kim Geon-young;Hur Man-Dae
    • Tribology and Lubricants
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    • v.21 no.2
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    • pp.77-82
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    • 2005
  • In previous paper, the wear properties of clutch facing materials with two different copper amounts against fly-wheel materials used in the clutch system were investigated by sliding wear tests at different applied loads and speeds. This paper have been aimed to evaluate the friction properties for clutch facing materials at the same test conditions as the previous paper. The experimental results indicated that the friction properties of clutch facing materials are influenced from the thermal conductivities of the clutch facing material and the counter material. The clutch facing material with the lower thermal conductivity and the fly-wheel material with the higher thermal conductivity showed the low and stable friction coefficient in the range of high sliding speed. This appears to be due to the formation of a film on the surface of the fly-wheel material.

Characterization and processing of Biodegradable polymer blends of poly(lactic acid) with poly(butylene succinate adipate)

  • Lee, Sang-Mook;Lee, Jae-Wook
    • Korea-Australia Rheology Journal
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    • v.17 no.2
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    • pp.71-77
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    • 2005
  • We investigated thermal, rheological, morphological and mechanical properties of a binary blend of poly(lactic acid) (PLA) and poly(butylene succinate adipate) (PBSA). The blends were extruded and their molded properties were examined. DSC thermograms of blends indicated that the thermal properties of PLA did not change noticeably with the amount of PBSA, but thermogravimetric analysis showed that thermal stability of the blends was lower than that of pure PLA and PBSA. Immiscibility was checked with thermal data. The rheological properties of the blends changed remarkably with composition. The tensile strength and modulus of blends decreased with PBSA content. Interestingly, however, the impact strength of PLA/PBSA (80/20) blend was seriously increased higher than the rule of mixture. Morphology of the blends showed a typical sea and island structure of immiscible blend. The effect of the blend composition on the biodegradation was also investigated. In the early stage of the degradation test, the highest rate was observed for the blend containing $80wt\%$ PBSA.

Thermal properties and mechanical properties of dielectric materials for thermal imprint lithography

  • Kwak, Jeon-Bok;Cho, Jae-Choon;Ra, Seung-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.242-242
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    • 2006
  • Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).

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A study on the improvement of the thermal properties of ZnO arrester blocks (산화아연 피뢰기 소자의 열적 특성 향상을 위한 연구)

  • Kim, Dong-Seong;Lee, Su-Bong;Lee, Seung-Ju;Kim, Dong-Kyu;Yang, Soon-Man;Lee, Bok-Hee
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2009.10a
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    • pp.335-338
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    • 2009
  • In this study, in order to investigate the thermal and electrical properties of ZnO arrester block against 60[Hz] AC voltage, the changes in leakage current were measured. The temperature distribution appearing on the ZnO arrester blocks was observed using a forward looking infrared camera. In particular, the correlation between the thermal and electrical properties of a ZnO arrester block was analyzed experimentally. From this analysis, the thermal phenomena resulting from the heat generation and dissipation of the ZnO arrester block were interpreted. The degradation and thermal runaway phenomena of ZnO arrester block are closely related to the temperature limit of the ZnO arrester block. The installation of an additional metal electrode has resulted in the decrease of the leakage current due to the heat dissipation.

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Effect of surface treatment of graphene nanoplatelets for improvement of thermal and electrical properties of epoxy composites

  • Kim, Minjae;Kim, Yeongseon;Baeck, Sung Hyeon;Shim, Sang Eun
    • Carbon letters
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    • v.16 no.1
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    • pp.34-40
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    • 2015
  • In this study, in order to improve the thermal and electrical properties of epoxy/graphene nanoplatelets (GNPs), surface modifications of GNPs are conducted using silane coupling agents. Three silane coupling agents, i.e. 2-(3,4-epoxycyclohexyl)-ethyltrimethoxysilane (ETMOS), 3-glycidoxypropyltriethoxysilane (GPTS), and 3-glycidoxypropyltrimethoxysilane (GPTMS), were used. Among theses, GPTMS exhibits the best modification performance for fabricating GNP-incorporated epoxy composites. The effect of the silanization is evaluated using transmission electron microscopy (TEM), scanning electron microscopy, thermogravimetric analysis, and energy dispersive X-ray spectroscopy. The electrical and thermal conductivities are characterized. The epoxy/silanized GNPs exhibits higher thermal and electrical properties than the epoxy/raw GNPs due to the improved dispersion state of the GNPs in the epoxy matrix. The TEM microphotographs and Turbiscan data demonstrate that the silane molecules grafted onto the GNP surface improve the GNP dispersion in the epoxy.

Thermal stabilities and dynamic mechanical properties of dielectric materials for thermal imprint lithography (임프린트 공법적용을 위한 절연재료의 열적, 기계적 성질)

  • Cho, Jae-Choon;Ra, Seung-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.220-221
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    • 2007
  • Recently, imprint lithography have received significant attention due to an alternative technology for photolithography on high performance microelectronic devices. In this work, we investigated thermal stabilities and dynamic mechanical properties of dielectric materials for thermal imprint lithography. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various curing agent and spherical filler were studied using dynamic differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), rheometer and universal test machine(UTM).

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Nonlinear finite element analysis of reinforced concrete structures subjected to transient thermal loads

  • Zhou, C.E.;Vecchio, F.J.
    • Computers and Concrete
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    • v.2 no.6
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    • pp.455-479
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    • 2005
  • This paper describes a 2D nonlinear finite element analysis (NLFEA) platform that combines heat flow analysis with realistic analysis of cracked reinforced concrete structures. The behavior models included in the structural analysis are mainly based on the Modified Compression Field Theory and the Distributed Stress Field Model. The heat flow analysis takes into account time-varying thermal loads and temperature-dependent material properties. The capability of 2D nonlinear transient thermal analysis is then implemented into a nonlinear finite element analysis program VecTor2(C) for 2D reinforced concrete membranes. Analyses of four numerical examples are performed using VecTor2, and results obtained indicate that the suggested nonlinear finite element analysis procedure is capable of modeling the complete response of a concrete structure to thermal and mechanical loads.

Dependence of Thermal Properties on Crystallization Behavior of CaMgSi2O6 Glass-Ceramics

  • Jeon, Chang-Jun;Yeo, Won-Jae;Kim, Eung-Soo
    • Korean Journal of Materials Research
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    • v.19 no.12
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    • pp.686-691
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    • 2009
  • The effects of thermal properties on the crystallization behavior of $CaMgSi_2O_6$ glass-ceramics were investigated as a function of sintering temperature from 800$^{\circ}C$ to 900$^{\circ}C$. The crystallization behavior of the specimens depended on the sintering temperature, which could be evaluated from the differential thermal analysis, X-ray diffraction and Fourier transform infrared spectroscopy. With increasing sintering temperature, the thermal conductivity of the sintered specimens increased, while the coefficient of thermal expansion (CTE) of the sintered specimens decreased. These results could be attributed to the increase of crystallization, confirmed from the estimation by density measurements. Also, the thermal diffusivity and specific heat capacity of the sintered specimens were discussed with relation to the sintering temperature. Typically, a thermal conductivity of 3.084 $W/m^{\circ}C$, CTE of 8.049 $ppm/^{\circ}C$, thermal diffusivity of 1.389 $mm^2/s$ and specific heat capacity of 0.752 $J/g^{\circ}C$ were obtained for $CaMgSi_2O_6$ specimens sintered at 900$^{\circ}C$ for 5 h.

An efficient finite element analysis model for thermal plate forming in shipbuilding

  • S.L. Arun Kumar;R. Sharma;S.K. Bhattacharyya
    • Ocean Systems Engineering
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    • v.13 no.4
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    • pp.367-384
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    • 2023
  • Herein, we present the design and development of an efficient finite element analysis model for thermal plate forming in shipbuilding. Double curvature shells in the ship building industries are primarily formed through the thermal forming technique. Thermal forming involves heating of steel plates using heat sources like oxy-acetylene gas torch, laser, and induction heating, etc. The differential expansion and contraction across the plate thickness cause plastic deformation and bending of plates. Thermal forming is a complex forming technique as the plastic deformation and bending depends on many factors such as peak temperature, heating and cooling rate, depth of heated zone and many other secondary factors. In this work, we develop an efficient finite element analysis model for the thermo-mechanical analysis of thermal forming. Different simulations are reported to study the effect of various parameters affecting the process. Temperature dependent properties are used in the analysis and the finite element analysis model is used to identify the critical flame velocity to avoid recrystallization of plate material. A spring connected plate is modeled for structural analysis using spring elements and that helps in identifying the resultant shapes of various thermal forming patterns. Finally, detailed simulation results are reported to establish the efficacy, applicability and efficiency of the designed and developed finite element analysis model.