• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.63-66
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• 1999

The effects of UV and ozone on the weathershed materials for 5 polymer insulators were investigated. This study was carried by material characterizations such as surface microstructure, thermal property, chemical structure and contact angle. The aged specimens are compared with new ones. In case of UV, the chalking of fillers and cracking of surface were increased with the increase of UV radiation time. In case of ozone, aged specimens are not different from new ones. From this study, It can be concluded that UV has more effect on the surface properties of weathershed materials than ozone.

• 폴리머
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• 제37권3호
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• pp.399-404
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• 2013

장기내열성과 파단신율이 우수한 블렌드 수지를 개발하고자 polyphenylene sulfide(PPS)에 7종류의 elastomer를 용융혼합하여 그 가능성을 조사해 보았다. PPS/elastomer(90/10, 80/20, 70/30) 블렌드를 제조한 후 시험편을 압축성형 또는 sheet를 제조하여 capillary rheometer, UTM, impact tester, SEM 등으로 유변학적 거동, 기계적 특성 및 모폴로지를 측정하였고 오븐에서 일주일간 열을 가한 후 다시 기계적 특성을 측정하였다. 열을 가하기 전의 인장강도는 elastomer 종류에 관계없이 비슷하였고 파단신율은 m-EVA의 경우가 가장 큰 값을 보였다. Elastomer 첨가량을 증가시킴에 따라 신율이 증가하였는데 30 wt%정도 첨가 시 박리가 발생하였다. 오븐테스트 이후에는 인장 강도는 더 증가한 반면에 신율은 급격히 감소하였다. 상기의 elastomer들이 PPS와 부분적인 상용성이 있는 것으로 보이는 바 소량의 elastomer 첨가 만으로도 PPS 가공과 관련된 여러 문제 등을 해결할 수 있어 다양한 그레이드의 개발에 적극 활용될 수 있을 것으로 기대된다.

• 에너지공학
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• 제25권3호
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• pp.18-26
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• 2016

대부분의 변압기에 사용되고 있는 절연유는 석유계 원료를 이용한 광유계 절연유였으나 유출시 환경오염, 낮은 인화점으로 인한 화재 위험성을 가지고 있어 보다 친환경 식물성 원료를 활용한 절연유 도입이 최근 검토되고 있다. 그러나 식물성 절연유의 높은 생분해성과 인화점으로 절연유로서의 높은 적용가능성에도 불구하고 장기운전에 의한 열화가 미치는 영향에서는 아직 많은 연구가 필요한 실정이다. 따라서 본 연구에서는 변압기의 구성요소를 감안하고 실제 운전조건보다 높은 $150^{\circ}C$에서 2주간의 가속열화 시험을 통해 전산가, 수분, 절연파괴전압 등의 주요물성 변화를 통해 식물성 절연유 산화특성과 이 과정에서 생성되는 용존 가스 분석을 실시였다. 이를 통해 식물성 절연유가 기존 광유계 절연유 대비 친수성에 의한 전산가 상승에도 불구하고 절연성능을 유지하는 특징을 가지고 있으며 가스 성분 비교를 통해 주어진 온도 조건에서 우수한 열안정성을 나타내고 있음을 확인하였다.

• 전기학회논문지
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• 제59권6호
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• pp.1087-1094
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• 2010

We have developed a cylindrical multi-terminal capacitive-conductive sensor that could be attached to the internal surface of cooling system pipe to evaluate capacitance and conductivity of heat transfer fluid. It was used as measuring system to diagnose insulating condition, by which was kept a insulating resistance of inner stack and at the same time was cooled electrochemical heat of reaction of FCEV(fuel cell electric vehicle) stack that used a compressed hydrogen gas reacting with oxygen in accordance with variation on thermal degradation of nonconductive heat transfer fluid. Also to assess diagnosis characteristics of heat transfer fluid, i.e. coolant, we have performed accelerated aging test using developed sensor attached to cooling system. Consequently, it was measured dielectric and electric resistance of coolant to estimate and analyse for dielectric properties by degradation condition.

• 대한기계학회논문집A
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• 제26권7호
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• pp.1262-1269
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• 2002

It is inevitable to evaluate the life of turbine rotor because the operating periods of power plants need to be extended. For the test, seven kinds of specimens with different degradation levels were prepared by the isothermal heat treatment at $630^{\circ}C$. Magnetic methods utilizing Barkhausen noise coercive force($BN_c$) were applied to detect the degradation caused by thermal aging. Magnetic property of material is related with domain dynamics and that is affected by the microstructure of material. Therefore $BN_c$ is very sensitive to the microstructure change of the material. With the increase of degradation, $BN_c$ was decreased and this phenomenon is considered due to precipitations and grain size. The result was compared with Vickers hardness($H_v$) and coercive force($H_c$) to detect the relative variation, and was related with $H_v$ and YS to estimate the change of the mechanical properties with the degradation.

• 한국주조공학회지
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• 제18권4호
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• pp.364-372
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• 1998

Effects of Si and Ca additions on the mechanical properties of AM60 based Mg alloys have been investigated. Hardness of the AM60 based Mg alloys reached a maximum value after aging for approximately 33 hours but the amount of hardness increase was negligible. The poor age hardening response of the alloys was due to low Al content, which implies that Al content must be >6 wt.% to observe age hardening effect. The tensile and yield strength increased with increasing Al, Si, and Ca content but elongation decreased with increasing Al and Si content. The best mechanical properties obtained in AM 40-2.5Si-0.2Ca alloy after T4 heat treatment were as follows; tensile strength 193.4 MPa, yield strength 79.2 MPa, and elongation 11.2%. High temperature property obtained from creep test was also improved by introducing $Mg_2Si$ which has high hardness, high melting temperature and low thermal expansion coefficient.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• 한국전기전자재료학회논문지
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• 제18권1호
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• pp.62-67
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• 2005

Recently, polymer insulators that are used for high voltage applications have some advantages such as light weight, small size, vandalism resistance, hydrophobicity and easy making process. During outdoor service of polymer insulators, the surface of the insulating material is frequently subjected to moisture and contamination that lead to dry band arcing. Their tracking resistance, erosion resistance, end sealing and shed design are very important because dry band arcing causes degradation of polymer surface. Aging test to estimate life property of polymer insulator is executed through several international standard such as IEC 61109 and CEA tracking wheel test, but is not getting clear conclusion yet. There are two methods in the diagnosis method of polymer insulator such as off-line and on-line. The diagnosis methods in off-line are external condition analysis by the eye, contaminant analysis on surface, surface analysis, pollution withstand voltage test, power frequency flashover voltage test, lightning impulse flashover test, tensile fracture load test and flexural load test. Polymer material is also investigated it's tracking resistance by adding surface active agent in IEC 587. In this paper, the tracking performance of polymer insulator with salt solution which is added surface active agent. The diagnosis of insulator sample has been analyzed by leakage current and visual examination, STRI guide and thermal image camera.

• 대한화장품학회지
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• 제30권2호
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• pp.167-172
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• 2004

피부 활성 물질로 넓이 알려져 있는 vitamin C (L-Ascorbic acid)는 콜라겐 생합성 촉진과 강한 항산화 작용으로 피부 항노화 및 주름 개선 효과 있을 뿐만 아니라 멜라닌 세포 활성 억제, 자외선 차단, 상처치유 등의 효능을 갖고 있다. 그러나 물성 면에서 피부 자극과 수분 및 공기, 빛에 불안정하여 쉽게 산화된다는 단점을 갖고 있다 이러한 문제점을 해결하기 위해 많은 연구가 진행되어 왔고, 그 결과 다양한 vitamin C 유도체가 개발되었다. 그러나 아직까지도 vitamin C의 불안정한 물성을 해결하면서 그 자체의 효능을 피부에 적용시키기에는 미흡한 점이 많다는 평을 받고 있다. 본 연구에서는 이러한 vitamin C의 불안정한 물성을 개선시키고 그 효능을 피부에 적용시킬 수 있는 vitamin C 유도체를 개발하기 위해, 피부 친화성이 우수한 스핑고지질류 중 하나인 phytosphingosine을 이용하여 산염기 반응에 의한 vitamin C의 OH기와 phytosphingosine의 -NH$_2$이온 결합시킨 새로운 vitamin C 유도체인 phytosphingosine ascorbate (SP-VC)를 합성하였다. 이렇게 합성된 phytosphingosine ascorbate (SP-VE)는 원소 분석(C58.3 : H9.3 : N2.8 : 029.5) 및 mass spectrosocopy (Maldi TOF-MS), UV/vis spectra (268.5nm), $^1$H NMR, FT-IR, 열분석 (m.p=154$^{\circ}C$), HPLC 등을 통하여 구조 및 물성을 확인하였다 또한 효능면에서는 우선적으로 phytosphingosine ascorbate(SP-VC)의 항균 및 항산화 효과를 확인하였다. 이러한 결과를 토대로 vitamin C와 phytosphingosine의 효능을 동시에 갖으며 불안정한 물성과 자극을 개선시킬 것이라 예상되는 새로운 소재를 합성하였다.