• Journal of Sensor Science and Technology
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• 제9권3호
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• pp.171-176
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• 2000

The physical and electrical characteristics of MgO and Pt thin-films on it, deposited by reactive sputtering and rf magnetron sputtering, respectively, were analyzed with annealing temperature and time by four-point probe, SEM and XRD. Under annealing conditions of $1000^{\circ}C$ and 2 hr, MgO thin-film had the properties of improving Pt adhesion to $SiO_2$ and insulation without chemical reaction to Pt thin-film, and the sheet resistivity and the resistivity of Pt thin-film deposited on it were $0.1288\;{\Omega}/{\square}$ and $12.88\;{\mu}{\Omega}{\cdot}cm$, respectively. We made Pt resistance pattern on $SiO_2$/Si substrate by lift-off method and fabricated thin-film type Pt-RTD(resistance thermometer device) for micro thermal sensors by Pt-wire, Pt-paste and SOG(spin-on-glass). In the temperature range of $25{\sim}400^{\circ}C$, the TCR value of fabricated Pt-RTD with thickness of $1.0{\mu}m$ was $3927\;ppm/^{\circ}C$ close to the Pt bulk value. Resistance values were varied linearly within the range of measurement temperature.

• Applied Chemistry for Engineering
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• 제8권1호
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• pp.76-83
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• 1997

Blends of thermotropic liquid crystalline polymer(TLCP) with poly(ethylene terephthalate) (PET) were prepared by the coprecipitation from a common solvent. The blends were processed through a capillary die at $287^{\circ}C$ to produce a monofilament. Morphology and mechanical, thermal properties of blends and composites were examined by differential scanning calorimetry(DSC), tensile test, optical microscopy and scanning electron microscopy. Crystallization kinetics of the blends were investigated by the isothermal DSC method. The Avrami analyses were applied to obtain the information on the crystal growth geometry and factors controlling the rate of crystallization. In the blends, liquid crystalline phase did not reveal any significant macrophase separation and thermal degradation at the processing temperature. From scanning electron micrographs of cryogenic fracture surfaces of extruded fibers, the TLCP domains were found to be more or less finely dispersed with $0.1{\mu}m$ to $0.2{\mu}m$ in size. Interfacial adhesion between the TLCP and matrix polymer was excellent. Tensile strength and modulus of TLCP/PET in-situ fiber composites were enhanced with increasing draw ratio and LCP content.

• Tribology and Lubricants
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• 제34권2호
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• pp.60-66
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• 2018

Graphene is a monolayer of carbon atoms (approximately 0.34 nm), arranged in a honeycomb network. It has been hailed as a next-generation flexible and transparent material because it has high electrical and thermal conductivities, excellent mechanical properties, as well as flexible and transparent properties. The wettability of graphene alters its adhesion or surface energy, and it is therefore an important parameter influencing its application in the fabrication of next-generation flexible and transparent electronics. Studies on the wettability of graphene are numerous and various opinions exist. However, almost all of these studies use the wet transfer method to transfer the graphene. In this study, therefore, we investigated the effect of wet and dry transfer methods on water contact angles of graphene on a substrate. The contact angles of substrates vary depending on the type of substrate. It was found that after graphene is transferred to the substrate, regardless of transfer method, the graphene/substrate contact angle increases to a value. The contact angle of graphene transferred using the dry transfer method is higher than the contact angle of graphene transferred using wet transfer methods. The wet transferred graphene is affected by the poly(methyl methacrylate) (PMMA) residue and the polar surface of substrate. The dry transferred graphene is influenced by the conformal contact between graphene and substrate.

• Journal of the Korean Crystal Growth and Crystal Technology
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• 제8권2호
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• pp.307-314
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• 1998

PZT thin films were fabricated by the Sol-gel method. Starting materials used for the preparation of the stock solution were Pb-acetate trihydrate, Zr-normal propoxide and Ti-isopropoxide. 2-Methoxyethanol and iso-propanol were used for solution. For studying the diffusion of Pb ion into the substrates. We used bare Si substrate, $SiO_2/Si$ substrates which was produced by thermal oxidation and $TiO_2/SiO_2/Si$ which was mad by Sol-gel method. Densification and adhesion of thin films were observed by SEM. Phase formation of thin films and diffusion of Pb ion into the substrate were examined by XRD and ESCA, respectively. In the case of bare Si and $SiO_2/Si$ substrate, we obtained the perovskite phase at $700^{\circ}C$ and restricted a little the diffusion of Si ion into the film with $SiO_2$ buffer layer. In the case of $TiO_2/SiO_2/Si$, perovskite phase were obtained at $500^{\circ}C$ and the diffusion of Pb ion and Si ion were restriced.

• Journal of the Korean Solar Energy Society
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• 제38권1호
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• pp.45-55
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• 2018

Environmentally benign lead-free solder coated ribbon (e. g. SnCu, SnZn, SnBi${\cdots}$) has been intensively studied to interconnect cells without lead mixed ribbon (e. g. SnPb) in the crystalline silicon(c-Si) photovoltaic modules. However, high melting point (> $200^{\circ}C$) of non-lead based solder provokes increased thermo-mechanical stress during its soldering process, which causes early degradation of PV module with it. Hence, we proposed low-temperature conductive paste (CP) based tabbing method for lead-free ribbon. Modules, interconnected by the lead-free solder (SnCu) employing CP approach, exhibits similar output without increased resistivity losses at initial condition, in comparison with traditional high temperature soldering method. Moreover, 400 cycles (2,000 hour) of thermal cycle test reveals that the module integrated by CP approach withstands thermo-mechanical stress. Furthermore, this approach guarantees strong mechanical adhesion (peel strength of ~ 2 N) between cell and lead-free ribbons. Therefore, the CP based tabbing process for lead free ribbons enables to interconnect cells in c-Si PV module, without deteriorating its performance.

• Polymer(Korea)
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• 제33권1호
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• pp.45-51
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• 2009

Water soluble adhesive was polymerized from butyl acrylate (BA), methyl methacrylate (MMA) and one of various functional monomers such as acrylic acid (AA), 2-hydroxylethyl methacrylate (2-HEMA), glycidyl methacrylic acid (GMA) and acrylamide (AAm). The amount of the functional monomers was 1$\sim$5 wt%/monomer. In order to improve the adhesive power, a substrate was treated using atmospheric flat plasma method. The adhesive power was improved by the addition of the functional monomers with an order of AA> 2-HEMA> GMA> AAm. The holding power of the adhesives, which is related with the thermal properties of the adhesives, increased with the amount of the functional monomers. The effectiveness in improving the holding power has an order of AA > AAm > GMA > 2-HEMA. By treating a substrate with atmospheric flat plasma method, the adhesives containing each of AA, 2-HEMA, GMA and AAm showed the increases of the final adhesion strength by 9.1, 9.4, 9.4, and 1.8%, respectively. In conclusion, the mechanical properties such as adhesive power and holding power could be controlled by introducing.

• Journal of the Microelectronics and Packaging Society
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• 제24권4호
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• pp.39-46
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• 2017

This paper presents the fabrication of ceramic insulation layer on metallic heat spreading substrate, i.e. an insulated metal substrate, for planar type heater. Aluminum alloy substrate is preferred as a heat spreading panel due to its high thermal conductivity, machinability and the light weight for the planar type heater which is used at the thermal treatment process of semiconductor device and display component manufacturing. An insulating layer made of ceramic dielectric film that is stable at high temperature has to be coated on the metallic substrate to form a heating element circuit. Two technical issues are raised at the forming of ceramic insulation layer on the metallic substrate; one is delamination and crack between metal and ceramic interface due to their large differences in thermal expansion coefficient, and the other is electrical breakdown due to intrinsic weakness in dielectric or structural defects. In this work, to overcome those problem, selected metal oxide buffer layers were introduced between metal and ceramic layer for mechanical matching, enhancing the adhesion strength, and multi-coating method was applied to improve the film quality and the dielectric breakdown property.

• Composites Research
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• 제27권6호
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• pp.219-224
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• 2014

Nancomposites manufacture has been developed rapidly, because of reinforcing effects of CNT in terms of mechanical, electrical and thermal properties. In this study, 10 wt% CNT paste was fabricated with good dispersion state and easy processability. Damage sensing and reinforcing effect of CNT paste were investigated in nanocomposites. 10 wt% CNT paste exhibited better tensile and flexural properties than those of general 1 wt% CNT nanocomposites. To observe the healing effect of CNT paste, a crack was made artificially with 30wt% CF30wt%/PP composites, and the CNT paste was filled inside the crack. The damage sensing of CNT paste in CF30wt%/PP composites was investigated by electrical resistance measurement and mechanical tests. CNT paste exhibited good reinforcing effect in mechanical properties of CF30wt%/PP composites, and this reinforcing effect was getting better with larger cracks. The reason was because CNT paste had good interfacial adhesion with CF30wt%/PP composites to resist crack propagation. In electrical resistance measurement, there was a jump in electrical resistance signal at the adhesion interface. The jumping signal could be used to predict fracture of CF/PP composites. CNT nanocomposites for damage sensing had crack reducing effect and damage detection using electrical resistance method.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• 제25권6호
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• pp.445-451
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• 2016

The Inconel 718 alloy is a well-known super-heat-resistant alloy and a difficult-to-cut material. Inconel 718 with excellent corrosion and heat resistance is used in harsh environments. However, the heat generated is not released owing to excellent physical properties, making processes (e.g., adhesion and thermal fatigue) difficult. Tool condition monitoring in machining is significant in reducing manufacturing costs. The cutting tool is easily broken and worn because of the material properties of Inconel 718. Therefore, tool management is required to improve tool life and machinability. This study proposes a method of predicting the tool wear with non-contacting sensors (e.g., IR thermometer for measuring the cutting temperature and a microphone for measuring the sound pressure level in machining). The cutting temperature and sound pressure fluctuation according to the tool condition and cutting force are analyzed using experimental data. This experiment verifies the effectiveness of the non-contact measurement signals in tool condition monitoring.

• Journal of Sensor Science and Technology
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• 제22권2호
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• pp.130-135
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• 2013

This study proposed a noble process to fabricate TSV (Through Silicon Via) structure which has lower cost, shorter production time, and more simple fabrication process than plating method. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process. The via hole was $100{\mu}m$ in diameter and $400{\mu}m$ in depth. A dielectric layer of $SiO_2$ was formed by thermal oxidation on the front side wafer and via hole side wall. An adhesion layer of Ti and a seed layer of Au were deposited. Soldering process was applied to fill the via holes with solder paste and metal powder. When the solder paste was used as via hole metal line, sintering state and electrical properties were excellent. However, electrical connection was poor due to occurrence of many voids. In the case of metal powder, voids were reduced but sintering state and electrical properties were bad. We tried the via hole filling process by using mixing solder paste and metal powder. As a consequence, it was confirmed that mixing rate of solder paste (4) : metal powder (3) was excellent electrical characteristics.