• Journal of the Korean Vacuum Society
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• v.16 no.5
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• pp.343-347
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• 2007

Fe thin films exhibited (100) preferential orientation when they were deposited at low deposition rate of $0.1{\AA}/s$ on glass substrates by using facing target sputtering system. The (100) oriented Fe layer induces (100) orientation of Pt layer deposited on it owing to hetero-epitaxial growth. After annealing at $600^{\circ}C$ in $H_2$ atmosphere, FePt films exhibited f.c.t. (001) texture in the whole film caused by inter-diffusion between atoms. We have also confirmed that the homogeneously inter-diffused compositional modulation in the film after the annealing process. Furthermore, annealing process in $Ar+H_2$ atmosphere at $400^{\circ}C$ during Pt deposition was effective for attaining Pt (100) texture. The annealing process during Pt deposition also induced in low annealing temperature and decreased annealing time for attaining the FePt f.c.t. (001) structure.

• Korean Journal of Materials Research
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• v.28 no.9
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• pp.534-538
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• 2018

The annealing characteristics of a cold rolled Al-6.5Mg-1.5Zn alloy newly designed as an automobile material is investigated in detail. The aluminum alloy in the ingot state is cut to a thickness of 4 mm, a total width of 30 mm and a length of 100 mm and then reduced to a thickness of 1 mm (reduction of 75 %) by multi-pass rolling at room temperature. Annealing after rolling is performed at temperatures ranging from 200 to $400^{\circ}C$ for 1 hour. The tensile strength of the annealed material tends to decrease with the annealing temperature and shows a maximum tensile strength of 482MPa in the material annealed at $200^{\circ}C$. The tensile elongation of the annealed material increases with the annealing temperature, while the tensile strength does not, and reaches a maximum value of 26 % at the $350^{\circ}C$ annealed material. For the microstructure, recovery and recrystallization actively occur as the annealing temperature increases. The recrystallization begins to occur at $300^{\circ}C$ and is completed at $350^{\circ}C$, which results in the formation of a fine grained structure. After the rolling, the rolling texture of {112}<111>(Cu-Orientation) develops, but after the annealing a specific texture does not develop.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.27 no.3A
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• pp.284-289
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• 2002

In this paper, we propose the fast simulated annealing algorithm to decrease convergence rate in image segmentation using MRF. Simulated annealing algorithm has a good performance in noisy image or texture image, But there is a problem to have a long convergence rate. To fad a solution to this problem, we have labeled each pixel adaptively according to its intensity before simulated annealing. Then, we show the superiority of proposed method through experimental results.

• Korean Journal of Metals and Materials
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• v.47 no.6
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• pp.356-362
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• 2009

In order to vary the primary recrystallization textures, AA 1050 sheets were cold rolled in two different manners. Differences in cold rolling schedule gave rise to the formation of different cold rolling textures also leading to the formation of different primary recrystallization textures. Upon annealing for grain growth, changes in microstructure and texture hardly occurred in the sample depicting Cube recrystallization texture, while grain growth was accompanied with the development {001}<100> Cube texture in the sample displaying a recrystallization texture comprising of weak rolling texture components. The selective growth of Cube oriented grains is attributed to the high mobility of their grain boundaries.

• Journal of Magnetics
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• v.11 no.3
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• pp.111-114
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• 2006

We electroplated copper-cobalt thin films on a silicon substrate, which had 150 nm thick copper seed layer. The adhesion between the two metallic layers could be increased by utilizing a proper organic additive, pulse plating technique, and high temperature annealing. The thin films exhibited columnar growth of the deposits and enhanced adhesion. This is attributed to the grain growth mechanism introduced by the additive and annealing.

• Korean Journal of Metals and Materials
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• v.48 no.7
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• pp.605-614
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• 2010

Conventional rolling (symmetric) and differential speed rolling (DSR) were both applied to AA1050 sheets at various velocity ratios, from 1 to 2 between the top and bottom rolls. An electron backscatter diffraction (EBSD) technique was used to measure texture inhomogeneity through the thickness direction. After the annealing process, the annealing texture of the DSR processed sheets was different from that of conventionally rolled sheets. The velocity ratio between the top and bottom rolls affected the texture inhomogeneity and macroscopic plastic strain ratio of the AA1050 sheets. A prediction for the macroscopic plastic strain ratio of AA1050 sheets was carried out using a visco-plastic self-consistent (VPSC) polycrystal model. The strain ratio directionality that was predicted using the VPSC polycrystal model was in good agreement with experimental results.

• Journal of the Korean Ceramic Society
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• v.43 no.3 s.286
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• pp.152-155
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• 2006

Silicon carbide ceramics seeded with 10-30 wt% SiC whiskers are fabricated by hot pressing and annealing. A quantitative texture analysis including calculation of the Orientation Distribution Function (ODF) is used for obtaining the degrees of preferred orientation of the fabricated samples. The microstructure and crystallographic texture are discussed with respect to the effect of ${\beta}-SiC$ whisker seeds on the resulting fracture toughness values. The SEM microstructures and the texture data reveal a correlation between texture and fracture toughness anisotropy.

• Progress in Superconductivity
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• v.1 no.1
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• pp.51-55
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• 1999

A Ni/Ag/Stainless steel 310S(SS310S) multi-layer sheet has been fabricated by a combination of vacuum brazing, cold rolling and texture annealing processes. After heat-treating the thin Ni/Ag/SS310S multi-layer sheet at $900^{\circ}C$ for 2h, development of (100)<001>cube texture on Ni surface was revealed by (111) pole figure. Quantitative chemical analysis was made by EPMA for the cross-section of the Ni/Ag/SS310S multi-layer sheet. EPMA results showed that Ag diffusion into the Ni layer, which may suppress the cube texture development, was negligible. A small amount of Cr atoms were detected in the Ni layer. It showed that Ag can be used as a chemical barrier of alloying element atoms in Ni layer for the Ni/Ag/SS310S multi-layer sheet and a strong cube texture was developed for the Ni layer in the Ni/Ag/SS310S multi-layer sheet.

• Progress in Superconductivity
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• v.5 no.1
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• pp.70-74
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• 2003

We fabricated cube textured Ni substrate for YBCO coated conductor and evaluated the effects of processing parameters on microstructural evolution and texture formation. Ni-rods as an initial specimen were prepared by two different methods, i.e., powder metallurgy(PM) and plasma arc melting(PAM). Subsequently, the rods were cold rolled to 100 $\mu\textrm{m}$ thick substrate and annealed at temperatures of $700∼1200^{\circ}C$. The texture of the substrate was characterized by pole-figure. It was observed that the texture of substrate made by P/M did not significantly varied with annealing temperature of 600∼$l100^{\circ}C$ and the full-width at half-maximums (FWHM) of both in-plane and out-of-plane were 9$^{\circ}$∼$10^{\circ}$. On the other hand, the texture of substrate made by PAM was more dependent on the annealing temperature and the corresponding values were $9^{\circ}$ ∼$13^{\circ}$ at the temperature range. In addition, recrystallization twin texture, (221)＜221＞, was formed as the temperature increased further. OM profiles showed that the grain size of substrate made by P/M was smaller than that made by PAM and this difference was correlated to the microstructure of initial specimens.

• Journal of the Korean Vacuum Society
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• v.9 no.4
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• pp.394-399
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• 2000

The effects of the type and thickness of underlayer on the crystallographic texture and the sheet resistance of aluminum thin film were studied. Ti and Ti/TiN were examined as the underlayer of aluminum. Ti and TiN were prepared by ionized physical vapor deposition (I-PVD) metalorganic chemical vapor deposition (MOCVD), respectively. The texture and the sheet resistance of metal thin film stacks were investigated at various thicknesses of Ti or TiN, and the sheet resistance was measured after annealing at $400^{\circ}C$ in an nitrogen ambient. For I-PVD Ti underlayer, the excellent texture of aluminum <111> was obtained even at top of 5 nm of Ti. However, the sheet resistance of the metal stack was greatly increased after annealing due to the interdiffusion and reaction of Al and Ti. MOCVD TiN between Ti and Al could suppress the Al-Ti reaction without severe degradation of aluminum <111> texture. Excellent texture of aluminum was obtained for the MOCVD TiN thinner than 4 nm.