• Transactions on Electrical and Electronic Materials
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• v.9 no.4
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• pp.143-146
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• 2008

In this study the thermal impact characteristics by forest fire are extensively investigated using temperature controlled ovens. The test conditions for thermal impact damage are simulated according to the characteristics of natural forest fire. The test pieces are suspension porcelain insulators made by KRI in 2005 for transmission lines. In the thermal impact cycle tests with $300\;^{\circ}C$ thermal impact gradient (-70 to $230\;^{\circ}C$), cycling in 10 minute periods, no critical failures occurred in the test samples even with long cycle times. But in tests with thermal impact gradient from room temperature to $200-600\;^{\circ}C$, cycling in 10 to 30 minute periods, there were critical failures of the porcelain insulators according to the thermal impact gradient and quenching method. In the case of thermal impact by forest fire, it was found of that duration time is more important than the cycling time, and the initiation temperature of porcelain insulator failures is about $300\;^{\circ}C$, in the case of water quenching, many cracks and fracture of the porcelain occurred. It was found that the thermal impact failure is closely related to the displacement in the cement by thermal stress as confirmed by simulation. It was estimated that the initiation displacement by the thermal impact of $300\;^{\circ}C$ is about 0.1 %. Above 1% displacement, it is expected that the most porcelain insulators would fail.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.7
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• pp.799-804
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• 2011

A thermal cycling test was conducted on a chip resistor solder joint with real-time failure monitoring. In order to study the failure mechanism of the chip resistor solder joint during the test, the resistance between both ends of the resistor was monitored until the occurrence of failure. It was observed that the monitored resistance first fluctuated linearly according to the temperature change. The initial variation in the resistance occurred at the time during the cycle when there was a decrease in temperature. A more significant change in the resistance followed after a certain number of cycles, during the time when there was an increase in the temperature. In order to explain the failure patterns of the solder joint, a mechanism for the solder failure was suggested, and its validity was proved through FE simulations. Based on the explained failure mechanism, it was shown that prognostics for the solder failure can be implemented by monitoring the resistance change in a thermal cycle condition.

• Journal of Fashion Business
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• v.26 no.6
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• pp.105-115
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• 2022

Wearing a mask is still advised since COVID-19 continues to spread. However, masks may also irritate the skin and cause mask acne, often known as "maskne", which is a type of acne mechanica caused by friction between the skin and clothing. Therefore, there is a need to develop an effective maskne cosmetic. In this study, we made the maskne cosmetics containing humulus lupulus extract and copper tripeptide-1 and investigated its stability and safety. To measure stability, a centrifugation test and heat-cool cycling were done, and changes in viscosity and pH were measured for 8 weeks. The Cumulative Irritation Test (CIT, WKIRB-202111-HR-096) was performed and positive reactions were determined by the ICDRG criteria. The results indicated that the samples were stable after centrifugation, temperature cycling, viscosity, and pH tests. In addition, cosmetic safety test results revealed that maskne cosmetics containing humulus lupulus extract and copper tripeptide-1 did not cause any skin responses. These findings indicate that prepared maskne cosmetics' stability and safety were comparable to those of currently available commercial cosmetics.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.10a
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• pp.115-118
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• 2003

This research aims to measure mechanical tensile properties of CFRP composites for cryogenic tank material. Through the cryogenic chamber, tensile tests are peformed under cryogenic temperature for graphite/epoxy fabric specimen aged at $-150^{\circ}C$ for 30hrs with load and graphite/epoxy unidirectional specimen 3-cycled from RT to $-100^{\circ}C$ with load. For graphite/epoxy fabric specimen, tensile modulus showed to increase after aging at cryogenic temperature(CT) while to decrease after aging at room temperature(RT) and tensile strength is more decreased after CT-aged than at RT-aged. For graphite/epoxy unidirectional specimen, tensile modulus was almost not changed after 3-cycling but strength showed the trend of decrease as increase the number of cycling.

• Korean Journal of Metals and Materials
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• v.49 no.12
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• pp.945-949
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• 2011

The cycling characteristics of $MgH_2$ made by hydriding chemical vapor deposition method have been investigated. The particle size of $MgH_2$ made by HCVD was about $1{\mu}m$. The cycling experiment was performed by measuring hydrogen quantity absorbed at 673 K and under 35 atm of hydrogen pressure for 30 min. Up to 3 cycles the hydrogen storage capacity increased, but from 4 to 6 cycles the hydrogen storage capacity decreased rapidly. During this cycling test the particle size increased gradually from $1{\mu}m$ to $6{\mu}m$. This increase was due to sintering by the high reaction temperature and the heat of reaction during hydrogen absorption. From 7 to 30 cycles, the hydrogen storage capacity was maintained at 5.8 wt%. Even after 30 cycles, the plateau pressure was constant.

• Journal of the Korean Society of Safety
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• v.4 no.1
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• pp.25-39
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• 1989

Cyclic temperature creep tests were carried out an AS 7075 alloy specimens were subjected to a constant load and stepwise temperature cycles in which temperature was fluctuated between 30$0^{\circ}C$ and 25$0^{\circ}C$ with three different cycle ratios. The highest frequency of cycling was 1 cycle per 10 hr and the lowest one was 1 cycle per 12 hr. From the creep experimental results with the above conditions the creep strain under cyclic temperature can be predicted easily by introd ucing the equivalent steady temperature because defined by Eq.(16), but the rupture life is 1.1 time than those of constant temperature because of effect of temperature history at tertiary creep range. Besides thlis result, the results of the creep test under cyclic temperature conditions are respectively compayiea with calculated rupture lives using the life fraction law and Eq.(18). The agreement between the obseried rupture times and calculated ones is fairly good. So creep rupture lives can be respectively predicted using life fraction law and Eq.(18).

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.65-71
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• 2005

At present, Electronic industries push ahead to eliminate the Pb(Lead) -a hazardous material-from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C\;-\;+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.7
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• pp.1229-1234
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• 2008

In this work, ultra high-voltage (17 - 50 kV AC), reliable 80 pF mica capacitors for partial discharge system application were investigated. Mica was used as the dielectric of the capacitors. Using the conservative design rule, over 3 individual $50\;{\mu}m$ thick mica sheets with a size of 30mm{\times}35mm were used with lead foils to form a parallel capacitor element and 20 mica sheets were interleaved with lead foils to form a series stack of parallel capacitor element to meet the requirements of the capacitors. The dimensions of the fabricated 80 pF capacitors for 17 kV AC and 50 kV AC were $90\;mm{\times}90\;mm$ and $95\;mm{\times}180\;mm$, respectively. The high-frequency characteristics of the capacitance (C) and dissipation factor (D) of the developed capacitors were measured using a capacitance meter. The developed capacitors exhibited C of 79.5 - 87.5 pF, had D of 0.001% over the frequency ranges of 150 kHz to 50 MHz, had a self-resonant frequency of 65 MHz, and showed results comparable to those measured for the capacitors prepared recently by $Adwel^{Tm}$. The developed capacitors also showed excellent characteristics for thermal shock test and temperature cycling test.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.27-32
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• 2010

For the flip chip joints processed using Cu pillar bumps and Sn pads, thermal cycling and high temperature storage reliabilities were examined as a function of the Sn pad height. With increasing the height of the Sn pad, which composed of the flip chip joint, from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance of the flip chip joint decreased from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$. Even after thermal cycles of 1000 times ranging from $-45^{\circ}C$ to $125^{\circ}C$, the Cu pillar flip chip joints exhibited the contact resistance increment below 12% and the shear failure forces similar to those before the thermal cycling test. The contact resistance increment of the Cu pillar flip chip joints was maintained below 20% after 1000 hours storage at $125^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.37-45
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• 2008

In this study, reliabilities of Cu (60 um)/SnAg (20 um) double-bump flip chip assemblies were investigated for the flip chip interconnections on organic substrates with 100 um pitch. After multiple reflows at $250^{\circ}C\;and\;280^{\circ}C$, bump contact resistances were almost same regardless of number of reflows and reflow temperature. In the high temperature storage test, there was no bump contact resistance change at $125^{\circ}C$ up to 2000 hours. However, bump contact resistances slightly increased at $150^{\circ}C$ due to Kirkendall voids formation. In the electromigration test, Cu/SnAg double-bump flip chip assemblies showed no electromigration until about 600 hours due to reduced local current density. Finally, in the thermal cycling test, thermal cycling failure mainly occurred at Si chip/Cu column interface which was found out the highest stress concentration site in the finite element analysis. As a result, Al pad was displaced out under thermal cycling. This failure mode was caused by normal compressive strain acting Cu column bumps along perpendicular direction of a Si chip.