• 품질경영학회지
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• 제51권4호
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• pp.735-749
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• 2023

Purpose: The purpose of this study is to derive solutions and prevent similar cases from occurring by analyzing the causes of cracks found in temperature cycling tests of rocket motor. Methods: By combining the results of the current state confirmation test, non-destructive test, domestic and foreign rocket motor comparison test, cutting test, and adhesion test according to the number of times to apply mold release agent, a Cause and Effect Diagram analysis was performed to derive the cause of cracks. Results: Through this study, 26 factors that could cause cracking in rocket motors during temperature cycling tests were identified. Through various additional test results, a total of five causes were identified, including chemical and structural design of the joint between the propellant and stress relief insert, omission of procedure in the manufacturing procedures, natural aging due to temperature, and load accumulation due to temperature changes. The fundamental cause was confirmed to be insufficient consideration of the release properties of the propellant and stress relief insert. Conclusion: During the design process, it was confirmed that this could be solved by structurally or chemically designing the insert so that it does not combine with the propellant, or by applying a mold release agent during the manufacturing process.

• 천문학회보
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• 제36권2호
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• pp.156-156
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• 2011

VPH (Volume Phase Hologram) grating is one of the transmission gratings and is known as its remarkable efficiency (>90%). It has two different densities of gelatins causing interference patterns. The VPH grating is favored in many astronomical instruments these days and also IGRINS, which is up coming near infrared high-resolution spectroscope expected to see the first light next year, uses the VPH grating as its cross-disperser. The infrared astronomical instruments operate at cryogenic temperature (~100K) in order to cut down thermal noise and the optical components of IGIRNS will be operated at 130K. The VPH grating is sandwiched in between fused silica or glass and glued together using optical adhesive. IGRINS is expected to go through 50 times of thermal cycling in 10 years including the performance test and this research is to check whether the physical characteristic such as the adhesion or dichromatic gelatin does not break and change from the several cryogenic thermal cycling. The two identical test gratings provided from Kaiser Optical System, Inc. are used in this test. One VPH grating is cooled down to 100K for 2 hours with maximum dT/dt = 5 and warmed up to the room temperature and another grating is kept stored in the room temperature and used as a control sample. In order to check the change, we inspected the grating with eyes and checked its efficiency and transmission at the room temperature every 10 cycling. From the 40 times of cryogenic temperature cool down cycling, the VPH grating showed no signs of change within the error compared to the control sample. We concluded the VPH grating is durable through several cryogenic thermal cycling.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.351-354
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• 2000

AC impedance of LiM $n_2$ $O_4$ and LiM $g_{0.1}$M $n_{1.9}$ $O_4$ samples have been studied at various temperature with charge-discharge test. AC impedance of LiM $n_2$ $O_4$ measured at -2$0^{\circ}C$, room temperature and 5$0^{\circ}C$ revealed that initial impedance before charge-discharge test was gradually decreased and become small by becoming law temperature. It indicates that the Li ion diffusion and the transfer resistance of the cathode are related to the temperature of cycling. Impedance at high temperature was suddenly increased because Mn dissolution and decomposition of electrolyte had been increased during cycling, compared to impedance at low temperature. Therefore, charge-discharge capacity was suddenly decreased at high but was slowly at low. In LiM $g_{0.1}$M $n_{1.9}$ $O_4$, impedance and capacity were stability at room temperature than there at 5$0^{\circ}C$, too. Initial impedance at 5$0^{\circ}C$ before charge-discharge test was small and impedance was suddenly increased during cycling than that at room temperature.ure.ure.

• 마이크로전자및패키징학회지
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• 제23권3호
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• pp.43-49
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• 2016

박형 package-on-package에 대해 T/H (temperature/humidity) 시험, TC (temperature cycling) 시험과 HTS(high temperature storage) 시험을 사용하여 신뢰성을 분석하였다. T/H 시험은 $85^{\circ}C/85%$의 조건으로 500시간, TC 시험은 $-40{\sim}100^{\circ}C$의 조건으로 1000회, HTS 시험은 $155^{\circ}C$의 조건으로 1,000시간 범위에서 평가하였다. 폴리이미드 써멀테이프를 사용하여 제작한 24개의 package-on-package (PoP) 시편에 대해 신뢰성 시험 전에 측정한 솔더접속 배선의 평균저항은 $0.56{\pm}0.05{\Omega}$이었으며, 24개 시편에서 모두 유사한 값이 측정되었다. 500시간까지의 T/H 시험, 1000회의 TC 시험 및 1,000시간까지의 HTS 시험후에도 솔더 접속부의 오픈 불량은 발생하지 않았다.

• 대한기계학회논문집A
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• 제28권12호
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• pp.1856-1863
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• 2004

In the last 50 years, lead-contained solder materials have been the most popular interconnect materials used in the electronics industry. Recently, lead-free solders are about to replace lead-contained solders for preventing environmental pollutions. However, the reliability of lead-free solders is not yet satisfactory. Several researchers reported that lead-contained solders have a good fatigue property. The others published that the lead-free solders have a longer thermal fatigue life. In this paper, the reason for the contradictory results published on the estimation of fatigue life of lead-free solder is investigated. In the present study, fatigue behavior of 63Sn37Pb, and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluating the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder ball joint in BGA packages. It was found that lead-free solder joints have a good fatigue property in the small temperature range condition. That condition induce small strain amplitude. However in the large temperature range condition, lead-contained solder joints have a longer fatigue life.

• 한국세라믹학회지
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• 제54권4호
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• pp.314-322
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• 2017

This study investigates changes in the mechanical behavior, such as changes in indentation load-displacement curve, wear resistance and contact fatigue resistance of thermal barrier coatings (TBCs) by thermal cycling test and thermal shock test. Relatively dense and porous TBCs on nickel-based bondcoat/superalloy are prepared; the highest temperature applied during thermal durability test is $1350^{\circ}C$. The results indicate that the porous TBCs have relatively longer lifetime during thermal cycling and thermal shock tests, while denser TBCs have relatively higher wear and contact fatigue resistance. The mechanical behavior is influenced by sintering of the TBCs by exposure to high temperature during tests.

• 한국전기전자재료학회논문지
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• 제20권5호
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• pp.443-449
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• 2007

The structural and thermal stability of $Li[Co_{0.1}Ni_{0.15}Li_{0.2}Mn_{0.55}]O_2$ electrode during cycling process was studied. The sample was prepared by simple combustion method. Although there were irreversible changes on the initial cycle, O3 stacking for $Li[Co_{0.1}Ni_{0.15}Li_{0.2}Mn_{0.55}]O_2$ structure was retained during the first and subsequent cycling process. Impedance of the test cell was decreased after the first charge-discharge process, which would be of benefit to intercalation and deintercalation of lithium ion on subsequent cycling. As expected, cycling test for 75 times increased impedance of the cell a little, instead, thermal stability of $Li[Co_{0.1}Ni_{0.15}Li_{0.2}Mn_{0.55}]O_2$ was improved. Moreover, based on DSC analysis, the initial exothermic peak was shifted to high temperature range and the amount of heat was also decreased after cycling test, which displayed that thermal stability was not deteriorated during cycling.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2011년도 춘계학술발표대회 논문집
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• pp.25-30
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• 2011

In this paper, we analyzed the electrical characteristics with Micro-cracks in Photovoltaic module. Micro cracks are increasing the breakage risk over the whole value chine from the wafer to the finished module, because the wafer or cell is exposed to mechanical stress. And The solar cells have to with stand the stress under out door operation in the finished module. Here the mechanical stress is induced by temperature changes and mechanical loads from wind and snow. So, we experimentally analyze the direct impact of micro-cracks on the module power and the consequences after artificial aging. The first step, we made micro-cracks in PV module by mechanical load test according to IEC 61215. Next, PV modules applied the thermal cycling test, because micro-cracks accelerated aging by thermal cycling test, according to IEC61215. Before every test, we checked output and EL image of PV module. As the result of first step, we detected little power loss(0.9%). But after thermal cycling test increased power loss about 3.2%.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 추계학술발표대회 논문집
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• pp.38-42
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• 2002

An apparatus was developed to repetitively apply a $-196^{\circ}C$ thermal load to coupon-sized mechanical test specimens. Using this device, IM7/5250-4 (carbon / bismaleimide) cross-ply and quasi-isotropic laminates were submerged in liquid nitrogen ($LN_2$) 400 times. Ply-by-ply micro-crack density, laminate modulus, and laminate strength were measured as a function of thermal cycles. Quasi-isotropic samples of IM7/977-3 (carbon / epoxy) composite were also manually cycled between liquid nitrogen and an oven set at $120^{\circ}C$ for 130 cycles to determine whether including elevated temperature in the thermal cycle significantly altered the degree or location of micro-cracking. In response to thermal cycling, both materials micro-cracked extensively in the surface plies fellowed by sparse cracking of the inner plies. The tensile modulus of the IM7/5250-4 specimens was unaffected by thermal cycling, but the tensile strength of two of the lay-ups decreased by as much as 8.5%.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2003년도 제20회 춘계학술대회 논문집
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• pp.151-155
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• 2003

An apparatus was developed to repetitively apply a -196 $^{\circ}C$ thermal load to coupon-sized mechanical test specimens. Using this device, IM7/5250-4 (carbon / bismaleimide) cross-ply and quasi-isotropic laminates were submerged in liquid nitrogen (L$N_2$) 400 times. Ply-by-Ply micro-crack density, laminate modulus, and laminate strength were measured as a function of thermal cycles. Quasi-isotropic samples of IM7/977-3 (carbon / epoxy) composite were also manually cycled between liquid nitrogen and an oven set at 120 $^{\circ}C$ for 130 cycles to determine whether including elevated temperature in the thermal cycle significantly altered the degree or location of micro-cracking. In response to thermal cycling, both materials micro-cracked extensively in the surface plies followed by sparse cracking of the inner plies. The tensile modulus of the IM7/5250-4 specimens was unaffected by thermal cycling, but the tensile strength of two of the lay-ups decreased by as much as 8.5 %.