• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.169-173
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• 2003

We demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon) printed circuit board (PCB). The copper lines were formed with $100\;{\mu}m$ width and $18\;{\mu}m$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of $100-200\;{\mu}m$. The DFRs of $15\;{\mu}m$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100^{\circ}C\;to\;150^{\circ}C$ and laminating speed. We found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63 cm/s. And the smallest size of indium solder bump was diameter of $50\;{\mu}m$ with pitch of $100\;{\mu}m$.

• 한국전자파학회:학술대회논문집
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• 한국전자파학회 2000년도 종합학술발표회 논문집 Vol.10 No.1
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• pp.364-368
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• 2000

In this paper, we present the design and fabrication of a new circularly polarized circular patch antenna. The antenna is realized using a plastic foam sheet, a Teflon substrate and a metal-coated film. The radiating element is a circular patch proximity-fed by a wide microstrip line. Two thins slots are introduced on the circular patch to obtain a circular polarized radiation. The antenna is optimized using a commercial software. The antenna has 18% impedance bandwidth, 4% axial-ratio band width and 9.12dBi gain.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1990년도 하계학술대회 논문집
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• pp.462-464
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• 1990

We report the development of a surface discharge preionized KrF discharge Laser with a new type of high-brightness Corona preionizer using a segmented columnar $BaTiO_3$ dielectric. This Laser characteristic was higher value than that obtained with the conventional corona preionizer using a glass, $Al_2O_3ceramic$, Kapton film, or a Teflon insulator.

• 마이크로전자및패키징학회지
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• 제8권2호
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• pp.31-36
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• 2001

Plasma Polymerization를 이용하여 Teflon-like 불화 유기 박막을 Si, $SiO_2$, Al, TEOS 위에 증착하였다. Difluoromethane $(CH_2F_2$)에 Ar, $O_2$, 그리고 $CH_4$를 첨가하여 첨가 가스에 따른 불화 유기 박막의 특성을 평가하였다. 각각의 첨가가스에 대하여 압력, 온도, 그리고 첨가가스의 비율을 변화시켜 박막을 증착하여 정접촉각 통한 표면의 친수성 (hydrophilicity)과 소수성(hydrophobicity) 정도를 관찰하였다. Ar을 첨가한 경우 Ar 첨가량과 power의 증가에 따라 정접촉각의 감소를 관찰하였다. 그러나 증착압력이 증가함에 따라 정접촉각이 증가하였다. Ar 첨가시 2 Torr이상의 증착압력에서 분말형태의 초소수성 불화 유기박막을 얻을 수 있었다. $O_2$를 첨가한 경우, $O_2$의 첨가량과 증착압력이 증가함에 따라 정접촉각은 감소하였다. 약 100W까지의 power에서는 정접촉각은 일정하였지만 power의 증가에 따라 정접촉각은 감소하여 200W에서는 천수성표면을 얻을 수 있었다. $CH_4$를 첨가하여 불화유기박막을 증착하였을 경우 $CH_4/CH_2F_2$비율이 5까지 급격한 증가를 나타내었고, 비율이 5이상인 경우에서는 일정한 정접촉각을 나타내었다. 화학기상증착에 의해 제조된 박막보다 plasma polymerization으로 제작된 불화유기박막이 히스테리시스(hysteresis)가 낮은 불화유기박막을 형성하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.117-120
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• 2003

Warm deep drawing which is one of the new forming technologies to improve formability of sheet metal is applied to the cylindrical cup drawing of Mg-alloy sheet metal. In experiments the temperature of die and blank holder is varied from room temperature to $300^{\circ}C$, while the punch is cooled by circulation of coolant to increase the fracture strength of workpiece on the punch corner area. Test material chosen for experiments is AZ31 magnesium sheet metal. Teflon film as a lubricant is used on both sides of a workpiece. The limit drawing ratio as well as thickness distributions of drawn cups are investigated and validity of warm deep drawing process is also discussed.

• 소성∙가공
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• 제19권3호
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• pp.179-184
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• 2010

The present study is focused on the deep drawability and product qualities of ultra thin beryllium copper sheet metal. The goal of this research is to investigate the limit drawing ratio in deep drawing of ultra thin beryllium copper metal. For the experiment, beryllium copper(C1720, $50{\mu}m$ in thickness) is used. Tensile test are also carried out to find out the material properties. Deep drawing experiments are carried out in Universal Testing Machine(UTM) to obtain limit drawing ratio. Deep drawing tests are carried out for various specimen sizes. Teflon film is used as a lubricant and constant blank holding force is imposed. Sheet thickness and surface hardness are measured along radial direction after deep drawing. Thickness is measured using optical microscope. For beryllium copper(C1720), the maximum LDR of 2.4 is obtained when the die shoulder radius is 20 or 30 times of sheet thickness.

• Transactions on Electrical and Electronic Materials
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• 제8권1호
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• pp.15-20
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• 2007

Conditioner wear, copper polish rates, pad temperature and coefficient of friction (COF) are measured for two novel Mitsubishi Materials Corporation designs during an extended wear and polishing test. Both designs are coated with a $Teflon^{TM}$ film to reduce substrate wear and chemical attack. Using optical interferometry, changes in the coating that result in gradual changes in diamond exposure are measured. Theories of the COF, conditioning, and polishing are applied to explain the observed performance differences between the designs.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2005년도 추계학술발표대회 논문집
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• pp.256-259
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• 2005

Mixed-mode interlaminar fracture toughness of carbon fabric/epoxy composites, which are applicable to tilting train carbody, was evaluated through the MMB (Mixed-mode bending) test. Specimens were made of CF3327 plain woven fabric with epoxy and a starter delamination at one end was made by inserting Teflon film with the thickness of 12.5 μ m. Mixed-mode interlaminar fracture test was conducted for 6 types of specimens with the mode II ratio of 20 ,35, 50, 65, 80, 90%. Also crack propagating behaviors and fractured surfaces were examined through an optical travelling scope and a scanning electron microscope, respectively.

• 한국철도학회논문집
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• 제8권2호
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• pp.195-201
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• 2005

Mode II interlaminar fracture behaviors of carbon fabric/epoxy composites, which are applicable to tilting train carbodies, was investigated by the ENF (End notched flexure) test. The specimens were made of CF3327 plain woven fabric with epoxy and a starter delamination at one end was made by inserting Teflon film with the thickness of 12.5$mu$m or 25.0$mu$m. The equation for mode II interlaminar fracture toughness was suggested based on the effective crack length from the compliance of load-displacement curve. Mode II interlaminar fracture toughness was evaluated for several types of the specimens. Also crack propagating behaviors and fracture surfaces were examined through an optical travelling scope and a scanning electron microscope.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1995년도 춘계학술대회논문집
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• pp.178-185
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• 1995

Warm deep drawing for optimum forming conditions to give the maximum drawing depth is investigated and compared with the results at room temperature. Experiments which draw square cups of STS 304 stainless steel sheet under the constant lubrication condition of teflon film made both in a crank and hydrqulic press for two kinds of specimens . The maximum drawing depth at warm forming condition reaches 1.4 times the drawing depth at room temperature in a crank press, whereas 1.6 times in a hydrqulic press, and also more uniform distribution of thickness in case of warm deep drawn cup is observed. The effects of other factors on formability , such as forming temperature, speed of press and cooling of punch are examinnied and discussed.