• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.473-474
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• 2007

• Proceedings of the Korean Nuclear Society Conference
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• 2005.05a
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• pp.1229-1230
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• 2005

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.72.1-72
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• 1998

• Journal of the Korean Society of Clothing and Textiles
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• v.36 no.1
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• pp.1-11
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• 2012

This paper reports on a prototype cooling garment applying a cooling module. The cooling module was composed of a Peltier device, a cold sink, a heat sink and two fans. A constant box was used to evaluate the cooling effect of the module. Two cooling modules were attached on each side of the garment. The wear trial was conducted using 10 male subjects in an environmental chamber maintained at $30{\pm}0.5^{\circ}C$, $50{\pm}5%$RH. Subjective sensations of thermal, humidity, and comfort were surveyed. Statistical package SPSS12.0 was used for the t-test and the Wilcoxon signed-rank test. The results showed that most effective cooling module decreased the temperature of the constant temperature box by $-4.9^{\circ}C$. The micro-temperature of the cooling garment with a Peltier device was lower than the control garment during the exercise. In particular, the chest skin temperature was $1.5^{\circ}C$ lower with the cooling garment than the control. The maximum temperature difference was $-2.57^{\circ}C$ on the sides of the $1^{st}$ layer. Subjective thermal sensation from wear trials of the Peltier device attached garment was lower than the control garment. Subjects felt more comfortable with the cooling garment in almost all the periods.

• Journal of Biosystems Engineering
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• v.26 no.6
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• pp.545-552
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• 2001

Nondestructive methods such as ultrasonic and magnetic resonance imaging systems have many advantages but still much expensive. And they do not give exact color information and may miss some details. If it is allowed to destruct a biological object to obtain interior and exterior informations, 3D image visualization model from a series of sliced sectional images gives more useful information with relatively low cost. In this paper, a PC based automatic 3D visualization system is presented. The system is composed of three modules. The first module is the handling and image acquisition module. The handling module feeds and slices a cylindrical shape paraffin, which holds a biological object inside the paraffin. And the paraffin is kept being solid by cooling while being handled. The image acquisition modulo captures the sectional image of the object merged into the paraffin consecutively. The second one is the system control and interface module, which controls actuators for feeding, slicing, and image capturing. And the last one is the image processing and visualization module, which processes a series of acquired sectional images and generates a 3D volumetric model. To verify the condition for the uniform slicing, normal directional forces of the cutting edge according to the various cutting angles were measured using a strain gauge and the amount of the sliced chips were weighed and analyzed. Once the 3D model was constructed on the computer, user could manipulate it with various transformation methods such as translation, rotation, and scaling including arbitrary sectional view.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.179-179
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• 2008

$BaTiO_3$를 기본조성으로 하는 PTC 써미스터는 Curie 온도이상에서 저항이 급격히 상승하는 산화물 반도체 세라믹이다. 이러한 성질을 이용하여 degaussing 소자, 정온 발열체, 온도센서, 전류 제한소자 등 상업적으로 여러 분야에서 연구되고 있다. 또한 원가절감 등을 위하여 Ni 내부전극을 사용하여 환원 분위기에서 소결하는 칩 타입에 대한 연구가 진행되고 있다. 본 연구에서는 Sm 함량(0.1at%~1.0at%)을 달리한 $BaTiO_3$(Si, Mn, Ca) 계를 선택하여 3%$H_2/N_2$ 분위기에서 1200~$1260^{\circ}C$, 2h 소결한 후 공기 중에서 재산화 처리하고 재산화 시간에 따른 PTC 특성 변화에 대하여 고찰하였다. 재산화 온도와 시간은 각각 $800^{\circ}C$와 0.5h~10h으로 하였다. Sm 함량을 달리하여 환원 분위기에서 소결한 시편의 미세구조와 PTC 특성과의 상관관계를 관찰한 결과, 소결온도가 낮을수록 PTC 특성은 좋아졌으며, 상온 비저항은 Sm 함량이 높아질수록 낮아졌다. 또한 Sm 함량이 높아질수록 jumping ratio$(R_{max}/R_{25^{\circ}C})$는 낮아졌다. 재산화 시간에 따른 PTC 특성은 다소 떨어졌지만 소결온도에 따라 달리 나타났다. Jumping ratio$(R_{max}/R_{25^{\circ}C})$는 Sm을 0.7 at% 첨가한 계에서 재산화를 1시간 처리한 시편에서 가장 우수하였다.

• Journal of Digital Convergence
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• v.15 no.3
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• pp.181-186
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• 2017

The system optimization is a technique that changes the structure of the program in order to extract the duplicated modules without changing the source code, reuse of the extracted module. Structure-oriented development and object-oriented development are efficient at crosscutting concern modular, however can't be modular of crosscutting concept. To apply the crosscutting concept in an existing system, there is a need to a extracting technique for distributed system optimization module within the system. This paper proposes a method for extracting the redundant modules in the completed system. The proposed method extracts elements that overlap over a source code analysis to analyze the data dependency and control dependency. The extracted redundant element is used to program dependency analysis for the system optimization. Duplicated dependency analysis result is converted into a control flow graph, it is possible to produce a minimum crosscutting module. The element extracted by dependency analysis proposes a system optimization method which minimizes the duplicated code within system by setting the crosscutting concern module.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2017.10a
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• pp.335-338
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• 2017

Presently, the collaboration hardware system and software technology that promoted commercializing ICBMS for integrated system visibility evaluation. This variation will move on the next pervasive period that mixed with cultural and technology convergence. There is possibility for the period system can invoke unpredictable confusing blank state. The blank state systems have ecosystem characteristics that are supplied, maintained and operated through the complex interactions of technology and culture. Using universal middleware can support the life-cycle model and increase the visibility of complex systems and prepare for confusing situations. In this study, based on universal middleware, data and service dynamic standardized modules were evaluated to support stable system visibility platform. The system visibility module consists of Intelligent Pervasive Cloud module, Memorial Service module and Life Cycler connection module. each module reflects various requirements of system visibility requested by external system. In addition, the analysis results are supported by various network application service standards through platform independent system and architecture.

• Journal of the Korean Solar Energy Society
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• v.38 no.3
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• pp.21-28
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• 2018

The objects of PV (Photovoltaic) monitoring system is to reduce the loss of system and operation and maintenance costs. In case of PV plants with configured of centralized inverter type, only 1 PV module might be caused a large loss in the PV plant. For this reason, the monitoring technology of PV module-level that find out the location of the fault module and reduce the system losses is interested. In this paper, a fault diagnosis algorithm are proposed using thermal and electrical characteristics of PV modules under failure. In addition, the monitoring system applied with proposed algorithm was constructed. The wireless sensor using LoRa chip was designed to be able to connect with IoT device in the future. The characteristics of PV module by shading is not failure but it is treated as a temporary failure. In the monitoring system, it is possible to diagnose whether or not failure of bypass diode inside the junction box. The fault diagnosis algorithm are developed on considering a situation such as communication error of wireless sensor and empirical performance evaluation are currently conducting.

• The KIPS Transactions:PartA
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• v.19A no.1
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• pp.51-60
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• 2012

IC(Integrated circuits)card, generally be named smard card, embedded MPU(Micro Processor Unit) of small-size, memory, EEPROM, Card Operating System(COS) and security algorithm. The IC card is used in almost all industry such as a finance(credit, bank, stock etc.), a traffic, a communication, a medical, a electronic passport, a membership management and etc. Recently, a application field of IC card is on the increase by method for payments of T-commerce, as T-commerce is becoming a new growth engine of the broadcating industry by trend of broadcasting and telecommunication convergence, smart mechanization of TV. For example, we can pay in IC credit card(or IC cash card) on T-Commerce. or we can be provided TV banking service in IC cash card such as ATM. However, so far, T-commerce payment services have weakness in security such as storage and disclosure of card information as well as dropping sharply about custom ease because of taking advantage of card information input method using remote control. To solve this problem, This paper developed processing payment module for implementing TV electronic payment system using IC credit card payment standard, EMV.