• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.23 no.3
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• pp.216-222
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• 2011

Recently, hybrid air-conditioning system has been proposed and applied to achieve building energy saving. One example is a system combining radiation panel with natural wind-induced cross-ventilation. However, few research works have been conducted on the non-uniformity of thermal comfort in such hybrid air-conditioning system. In this paper, both thermal environment and non-uniform thermal comfort of human thermal model under various air-conditioning system, including hybrid system, were evaluated in a typical office room using coupled simulation of computation fluid dynamics, radiation model and a human thermal model. The non-uniformity of thermal comfort was evaluated from the deviation of surface temperature of human thermal model. Flow fields and temperature distribution in each case were represented.

• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.72-77
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• 2016

As the semiconductor production technology has gradually developed and intra-market competition has grown fiercer, the caliber of Si Wafer for semiconductor production has increased as well. And semiconductors have become integrated with higher density. Presently the Si Wafer caliber has reached up to 450 mm and relevant production technology has been advanced together. Electrostatic chuck is an important device utilized not only for the Wafer transport and fixation but also for the heat treatment process based on plasma. To effectively control the high calories generated by plasma, it employs a refrigerant-based cooling method. Amid the enlarging Si Wafers and semiconductor device integration, effective temperature control is essential. Therefore, uniformed temperature distribution in the electrostatic chuck is a key factor determining its performance. In this study, the form of refrigerant flow channel will be investigated for uniformed temperature distribution in electrostatic chuck.

• Journal of the Optical Society of Korea
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• v.19 no.2
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• pp.159-164
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• 2015

In the injection-molded light guide plate the replication quality, i.e. the reproduction accuracy, of micro-patterns should be high and uniform over the entire surface area. However technical difficulty in meeting the necessary replication quality arises as the plate size becomes large for TV applications. We propose a simulation technique to optimize the distribution of micro-patterns on a 55-inch injection molded light guide plate considering non-ideal replication quality of micro-patterns. The luminance uniformity could be improved by more than 16% by optimizing the pattern distribution in spite of the same replication quality.

• Journal of Institute of Control, Robotics and Systems
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• v.16 no.5
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• pp.469-475
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• 2010

This paper presents a method of classifying discolored defects of metal pads using geometric texture for AFVI (Automated Final Vision Inspection) systems. In PCB manufacturing process, the metal pads on PCB can be oxidized and discolored partly due to various environmental factors. Nowadays the discolored defects are manually detected and rejected from the process. This paper proposes an efficient geometric texture feature, SUTF (Symmetry and Uniformity Texture Feature) based on the symmetric and uniform textural characteristics of the surface of circular metal pads for automating AFVI systems. In practical experiments with real samples acquired from a production line, 30 discolored images and 1232 roughness images are tested. The experimental results demonstrate that the proposed method using SUTFs provides better performance compared to Gabor feature with 0% FNR (False Negative Rate) and 1.46% FPR (False Positive Rate). The performance of the proposed method shows its applicability in the real manufacturing systems.

• Proceedings of the KIEE Conference
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• 2002.11a
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• pp.122-123
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• 2002

Cu CMP process control for global planarization of semiconductor surface were studied on a platen polisher by using an experimental copper slurry containing ceria as the abrasive component. In order to understand the process. a design of experiment was conducted. From the experiment. the effects of polishing parameters such as polishing pressure, platen speed, and speed of wafer carrier on the removal rate of copper and the uniformity in copper removal were calculated and discussed. In this study, process parameters of Cu CMP and WIWNU(Within Wafer Non Uniformity) were presented.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.389-392
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and non-uniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between particle size and CMP with particle size analysis of used slurry.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.11
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• pp.46-56
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• 1996

Planarization technique is rapidly recognized as a critical step in chip fabrication due to the increase in wiring density and the trend towards a three dimensional structure. Global planarity requires the preferential removal of the projecting features. Also, the several materials i.e. Si semiconductor, oxide dielectric and sluminum interconnect on the chip, should be removed simultaneously in order to produce a planar surface. This research has investihgated the development of the chemical mechanical polishing(CMP) machine with uniform pressure and velocity mechanism, and the pad insensitive to pattern topography named hard grooved(HG) pad for global planarization. Finally, a successful result of uniformity less than 5% standard deviation in residual oxide film and planarity less than 15nm in residual step height of 4 inch device wafer, is achieved.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.71-76
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• 2022

We evaluated and developed a 6th generation large-size polisher in the type of face-up and Oscar. We removed the hillocks of the low temperature poly-silicon (LTPS) thin film with this polisher. The surface roughness of LTPS was lowered from 7.9 nm to 0.6 nm after CMP(chemical mechanical polishing). The thickness of the LTPS is measured through reflectance in real time during polishing, and the polishing process is completed according to this thickness. The within glass non-uniformity (WIGNU) was 6.2% and the glass-to-glass non-uniformity (GTGNU) was 2.5%, targeting the LTPS thickness of 400Å. In addition, the residual slurry after the CMP process was removed through the Core Flow PVA Brush and alkaline chemical.

• Journal of the Korean institute of surface engineering
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• v.28 no.5
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• pp.300-308
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• 1995

The effect of nitrogen finishing for the control of coating weight in a nitrogen sealing box on the coating surface property in hot dip galvanizing process has been studied. The coated surface is free of oxide marks and edge overcoated. The coating uniformity is excellent ; the standard deviation of the coating thickness along width of the specimen was $1~1.2\mu\textrm{m}$ in the box whereas $2.5~3\mu\textrm{m}$ in the air. Considering surface quality of the coating such as oxide mark, edge overcoated and zinc dust, the oxygen content between 40 and 200 ppm was suggested in the box in addition the oxygen content of at least 40 ppm or the minimum dew point of $-27^{\circ}C$ is required to prevent a zinc vaporization.

• Design & Manufacturing
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• v.2 no.4
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• pp.1-4
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• 2008

Micro pattern is applied to the light guiding plate(LGP) to enhance the uniformity of the brightness of the LCD. The micro cones are molded in intaglio on the surface of the LGP. The surface roughness of each cone was 40nm and 38nm in negative and positive die for laser ablation. In chemical etching, the surface roughness was 25nm, 24nm in negative and positive. And the surface roughness of negative and positive dies were 4nm and 5nm for LIGA-reflow process.