• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.39-39
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• 2003

As the design rules in semiconductor manufacturing process become more and more stringent, the higher degree of planarization of device surface is required for a following lithography process. Also, it is great challenge for chemical mechanical polishing to achieve global planarization of 12” wafer or beyond. To meet such requirements, it is essential to understand the CMP equipment and process itself. In this paper, authors suggest the velocity distribution on the wafer, direction of friction force and the uniformity of velocity distribution of conventional rotary CMP equipment in an analytical method for an intuitive understanding of variation of kinematic variables. To this end, a novel dimensionless variable defined as “kinematic number” is derived. Also, it is shown that the kinematic number could consistently express the velocity distribution and other kinematic characteristics of rotary CMP equipment.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.29-38
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• 2003

As the design rules in semiconductor manufacturing process become more and more stringent, the higher degree of planarization of device surface is required for a following lithography process. Also, it is great challenge for chemical mechanical polishing to achieve global planarization of 12” wafer or beyond. To meet such requirements, it is essential to understand the CMP equipment and process itself. In this paper, authors suggest the velocity distribution on the wafer, direction of friction force and the uniformity of velocity distribution of conventional rotary CMP equipment in an analytical method for an intuitive understanding of variation of kinematic variables. To this end, a novel dimensionless variable defined as “kinematic number” is derived. Also, it is shown that the kinematic number could consistently express the velocity distribution and other kinematic characteristics of rotary CMP equipment.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.376-376
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• 2006

The process of weaving fabrics with high levels of tension and abrasion can cause damage to the yarn threads. To protect threadlines during the process, a protective polymer is coated on the surface of the yarns prior to weaving. This application process is known as slashing. The current slashing system is incompatible with today's demand activated manufacturing strategies. Methods of improving the uniformity of polymer coating application were studied, and several applicators were designed and evaluated. Prewetting of the threadlines before coating application was shown to greatly improve coating uniformity. The objective of the research is to design a single-end slashing process that is environmentally friendly and will improve productivity and flexibility.

• Journal of Information Display
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• v.1 no.1
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• pp.52-58
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• 2000

We observed that static electricity has an influence on the etching unformity of dry etching process. When the static electricity was applied from-200[V]to-1000[V] on glass substrates, the etching rate uniformity was changed to 1.5%-15%. In this experiment, the soft X-ray to neutralize static electricity was adopted as ore of neutralization methods. As an experimental result, soft X-ray irradiation improved neutralization capability on the surface of LCD glass substrate within the short time, about 15-30sec. The difference of etching rate uniformity was below 0.5%.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.768-771
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• 2006

Uniformity and performance characteristics of LTPS TFTs are important parameters for making advanced active-matrix displays. In this paper, we describe an SLS-based crystallization approach for producing orientation-controlled Si films with reduced concentrations of planar defects that stand to potentially deliver unprecedented levels of device uniformity and performance. Specifically, a 2-step process referred to as hybrid SLS has been developed that produces a variety of high-quality {100} surface-oriented Si films.

• 유체기계공업학회:학술대회논문집
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• 2006.08a
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• pp.561-564
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• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(printed circuit boards), Thermal control of the reflow process is required in oder to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD tool(Fluent) for predicting flow and temperature distributions. There was flow recirculation region that had a weak point in the temperature uniformity. Porous plate was installed to prevent and minimize flow recirculation region for acquiring uniform temperature in oven. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• 한국전산유체공학회:학술대회논문집
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• 2010.05a
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• pp.187-194
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• 2010

Shape optimization of an upper plenum of PBMR type gas cooled nuclear reactor has been performed by using three-dimensional Reynolds-Averaged Navier-Stokes (RANS) analysis and surrogate modeling technique. The objective function is defined as a linear combination of uniformity of flow distribution in the core and pressure drop in the upper plenum and the core. The ratio of thickness of slot to diameter of rising channels, ratio of height of upper plenum to diameter of rising channels, and ratio of eight of the slot at inlet to outlet, are used as design variables for optimization. Design points are selected through Latin-hypercube sampling. The optimal point is determined through surrogate-based optimization method which uses 3-D RANS analyses at design points. The results show that the optimum shape represent remarkably improved performance in flow uniformity and friction loss than the reference shape.

• Journal of computational fluids engineering
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• v.15 no.3
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• pp.16-23
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• 2010

Shape optimization of an upper plenum of a PBMR type gas cooled nuclear reactor has been performed by using three-dimensional Reynolds-Averaged Navier-Stokes (RANS) analysis and surrogate modeling technique. The objective function is defined as a linear combination of uniformity of flow distribution in the core and pressure drop in the upper plenum and the core. The ratio of thickness of slot to diameter of rising channels, ratio of height of upper plenum to diameter of rising channels, and ratio of height of the slot at inlet to outlet, are used as design variables for optimization. Design points are selected through Latin-hypercube sampling. The optimal point is determined through surrogate-based optimization method which uses 3-D RANS analyses at design points. The results show that the optimum shape represent remarkably improved performance in flow uniformity and friction loss than the reference shape.

• Tribology and Lubricants
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• v.28 no.6
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• pp.272-277
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• 2012

Finite element analysis was carried out using wafer-scale and particle-scale models to understand the mechanism of the fast removal rate(edge effect) at wafer edges in the chemical-mechanical polishing process. This is the first to report that a particle-scale model can explain the edge effect well in terms of stress distribution and magnitude. The results also revealed that the mechanism could not be fully understood by using the wafer-scale model, which has been used in many previous studies. The wafer-scale model neither gives the stress magnitude that is sufficient to remove material nor indicates the coincidence between the stress distribution and the removal rate along a wafer surface.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.23 no.3
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• pp.216-222
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• 2011

Recently, hybrid air-conditioning system has been proposed and applied to achieve building energy saving. One example is a system combining radiation panel with natural wind-induced cross-ventilation. However, few research works have been conducted on the non-uniformity of thermal comfort in such hybrid air-conditioning system. In this paper, both thermal environment and non-uniform thermal comfort of human thermal model under various air-conditioning system, including hybrid system, were evaluated in a typical office room using coupled simulation of computation fluid dynamics, radiation model and a human thermal model. The non-uniformity of thermal comfort was evaluated from the deviation of surface temperature of human thermal model. Flow fields and temperature distribution in each case were represented.