• Corrosion Science and Technology
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• v.6 no.4
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• pp.154-158
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• 2007

For the application of flexible printed circuit board (FPCB), electroplated copper is required to have low surface roughness and residual stress. In the paper, the effects of surface roughness and residual stress of electroplated copper as thick as $8{\mu}m$ were studied on organic additives such as inhibitor, leveler and accelerator. Polyimide film coated with sputtered copper was used as a substrate. Surface roughness and surface morphology were measured by 3D-laser surface analysis and FESEM, respectively. Residual stress was calculated by Stoney's equation after measuring radius curvature of specimen. The addition of additives except high concentration of accelerator in the electrolyte decreased surface roughness of electroplated copper film. Such a tendency was explained by the function of additives among which the inhibitor and the leveler inhibit electroplating on a whole surface and prolusions, respectively. The accelerator plays a role in accelerating the electroplating in valley parts. The inhibitors and the leveler increased residual stress, whereas the accelerator decreased it. It was thought to be related with entrapped additives on electroplated copper film rather than the preferred orientation of electroplated copper film. The reason why additives lead to residual stress remains for the future work.

• Design & Manufacturing
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• v.11 no.2
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• pp.51-56
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• 2017

Nitinol, a shape memory alloy (SMA), is manufactured from titanium and nickel and it used in various fields such as electrical applications, micro sensors. It is also recommended as a material in medical for implant because it has excellent organic compatibility. Nitinol is intended to be inserted into the human body, products require a high-quality surface and low residual stress. To overcome this problems, explore electrolyte polishing (EP) is being explored that may be appropriate for use with nitinol. EP is a particularly useful machining method because, as a non contact machining method, it produces neither machining heat nor internal stress in the machined materials. Sandpaper polishing is also useful machining method because, as a contact machining method, it can easily good surface roughness in the machined materials. The electrolyte polishing (EP) process has an effect of improving the surface roughness as well as the film polishing process, but has a characteristic that the residual stress is hardly generated because the work hardened layer is not formed on the processed surface. The sandpaper polishing process has the effect of improving the surface roughness but the residual stress remains in the surface. We experimented with three conditions of polishing process. First condition is the conventional polishing. Second condition is the electrochemical polishing(EP). And Last condition is a mixing process with the conventional polishing and the EP. Surface roughness and residual stress of the nitinol before a polishing process were $0.474{\mu}mRa$, -45.38MPa. Surface roughness and residual stress of the nitinol after mixing process of the conventional polishing and the EP were $1.071{\mu}mRa$, -143.157MPa. Surface roughness and residual stress of the nitinol after conventional polishing were $0.385{\mu}mRa$ and -205.15MPa. Surface roughness and residual stress of sandpaper and EP nitinol were $1.071{\mu}mRa$, -143.157MPa. The result shows that the EP process is a residual stress free process that eliminates the residual stress on the surface while eliminating the deformed layer remaining on the surface through composite surface machining rather than single surface machining. The EP process can be used for biomaterials such as nitinol and be applied to polishing of wafers and various fields.

• The korean journal of orthodontics
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• v.32 no.5 s.94
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• pp.343-353
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• 2002

This study was designed to investigate the stress distribution of alveolar bone in case of on masse retraction with lingual K-loop archwire using the 3-dimensional photoelastic stress analysis followed by stress freezing process. Lingual K-loop archwire which had loop in 15mm height was used and activated by retraction force of 350gm per each side. The results were as follows 1. Central incisor : As the closer side to crown, the larger tensile stress was distributed at both mesial and labial surfaces and the larger compressive stress was distributed at distal surface. As the closer side to root apex, the larger compressive stress was distributed at lingual surface. The compressive stress was distributed at root apex. 2. Lateral incisor : The tensile stress was distributed at the coronal side of mesial surface. The compressive stress was distributed at distal surface. As the closer side to crown, the larger tensile stress was distributed at labial surface. The tensile stress was distributed at coronal side and the compressive stress was distributed at apical side of lingual surface. The compressive stress was distributed at root apex. 3. Canine The tensile stress was distributed at coronal side and the compressive stress was distributed at apical side of mesial surface. The tensile stress was distributed at distal surface. As the closer side to crown, the larger tensile stress was distributed at both mesial and distal surfaces. The compressive stress was distributed at root apex. 4. Second premolar : The tensile stress was distributed at mesial surface. The compressive stress was distributed at coronal side and the tensile stress was distributed at apical side of distal surface. The compressive stress was distributed at coronal side of buccal surface. As the closer side to crown, the larger tensile stress was distributed at lingual surface. The compressive stress was distributed at root apex. 5. First molar . As the closer side to crown, the larger tensile stress was distributed at both mesial and distal surfaces. No stress was distributed at buccal surface and palatal root apex. As the closer side to crown, the larger tensile stress was distributed at both lingual surfaces. The compressive stress was distributed a4 buccal root apexes. 6. Second molar The compressive stress was distributed at all root apexes. As the closer side to crown, the larger compressive stress was distributed at both mesial and lingual surfaces, and the larger tensile stress at both distal and buccal surfaces. Transverse bowing effect was observed in on-masse retraction with lingual K-loop archwire, however vertical towing effect was not. Rather, reverse vortical bowing effect was developed.

• Journal of Welding and Joining
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• v.7 no.4
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• pp.46-55
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• 1989

Zirconia coatings are performed by the plasma spraying on the substrate of Al-Si alloy. In case of plasma sprayed ceramic coatings, it is important to control properly residual stress occurred during cooling process. Residual stress in coating layer varies with sprayed conditions and is influenced greatly by the coating layer thickness. Surface residual stress due to coating layer thickness is measured by X-ray diffraction method and the residual stress in coating layer is estimated by the deflection of coating layer when the restraint force in substrate was removed. When zirconia was coated on the substrate, tensile residual stress remains on zirconia coated surface layer. The tensile stress is increased to 0.35mm thickness and after 0.45mm thickness it is decreased abrouptly. A thick bond and composite coating reduce the zirconia surface stress and composite coating controls effectively the thick zirconia surface stress.

• Journal of the Korean institute of surface engineering
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• v.29 no.2
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• pp.100-108
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• 1996

The internal stress of acidic electroless nickel deposits on zincated aluminum was determined by spiral contractometer. Several plating conditions such as inhibitor and complexing agent concentrations and pH affecting the internal stress were studied. The resulting intrinsic stress contribution to the total stress was discussed in terms of phosphorous content of the deposit, solution pH, and surface morphology. However, the most important was found to be thermal stress for the total stress of Al substrate, because of high thermal expansion coefficient of the aluminum substrate.

• Journal of the korean Society of Automotive Engineers
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• v.13 no.6
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• pp.109-118
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• 1991

In this study, it is intended to investigate the effect of the grinding conditions such as table feed, down feed, cross feed of residual stress distribution. And this distribution is investigated upon the grinding direction and the its orthogonal direction at ground layers. The material is used carbon steel (SM20C) which usually used to motor axis. And in order to be considered as Bernoulli-Euler beam, the dimension of the specimen is appropriately designed. According as corroiding the ground surface, the residual stress layers are removed and strain which occured on account of unbalance of internal stress is detected by rosette-gate. Through A/D converter and computer, these values are saved and evaluated residual stress by stress-strain relation formula. Finally, these results are diagrammatized with Auto Cad. The results obtained are as follows. As the depth from the ground surface increases in grinding direction and its orthogonal direction, tensile residual stress exists in the surface, and subsequently it becomes compressive residual stress as it goes downward. As the table feed, the cross feed and the down feed increase, maximum residual stress is transformed form the tensile to the compressive.

• Journal of the Korean institute of surface engineering
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• v.13 no.4
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• pp.211-220
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• 1980

Internal stress of electrodeposited metals affect physical and mechanical characteristics of deposits. Internal stress of nickel deposits was reviewed intensively. Important outcomes are as follows. Substrate have an important effect on internal stress of electrodeposit. Origin of its internal stress could be explained mismatch of crystal lattice and coalescence of crystallites. When surface cleaning is not satisfying, instantaneous stress is low but the electrodeposited layer being thickened increasingly stress become to high and peeling phenomenon occurs. Effect of current density and temperature on internal stress is variable. Internal stress increases rapidly at pH 5 and above because of codepositing colloidal materials caused hydrolysis. Concentrations of nickel ion and $H_3BO_3$ ion affect little on internal stress and solution which contains impurities tend to increase stress. Especially impurities of $H_2O_2$ and iron ion have a great effect on internal stress. Additives are divided in two kind. One is increasing tensile stress another is increasing compressive stress. Concentrations of additives have a great effect on internal stress.

• Transactions of the Korean Society of Mechanical Engineers
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• v.10 no.1
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• pp.62-69
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• 1986

Fatigue surface crack growth was studied in 7075-T651 aluminum alloy plates subjected largely to bending loads. The surface crack length and its depth were measurement by the unloading elastic compliance method. The surface crack growth rate dc/dN, on the surface and da/dN, in the depth direction were obtained by the secant method. The stress intensity factor range .DELTA.K was computed by means of Newman and Raju equation. The aspect ratio a/c was presented in form of a/c=0.815-0.853(a/T). The effect of the stress ratio on the stable surface crack growth rates under increasing .DELTA.T is larger in lower .DELTA.K, while the relation between dc/dN, da/dN and the effective stress intensity factor range .DELTA.K$_{eff}$ is weakly dependent on the stress ratio.o.

• Korean Journal of Metals and Materials
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• v.47 no.8
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• pp.466-473
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• 2009

Our group previously observed the intrinsic stress evolution of Cu thin films during deposition by changing the deposition rate. Intrinsic stress of Cu thin films, which show Volmer-Weber growth, is reported to display three unique stress stages, initial compressive, broad tensile, and incremental compressive stress. The mechanisms of the initial compressive stress and incremental compressive stages remain subjects of debate, despite intensive research inquiries. The tensile stress stage may be related to volume contraction through grain growth and coalescence to reduce over-accumulate Cu adatoms on the film surface. The in-situ intrinsic stresses behavior in Cu thin films was investigated in the present study using a multi-beam curvature measurement system attached to a thermal evaporation device. The effect of substrate surface roughness was monitored by observed the in-situ intrinsic stress behavior in Cu thin films during deposition, using $100{\mu}m$ thick Si(111) wafer substrates with three different levels of surface roughness.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.1 s.173
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• pp.144-155
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• 2000

초록 The validity, of a single parameter such as stress intensity, factor K or J-integral in traditional fracture mechanics depends strongly on the geometry, and loading condition. Therefore the second parameter like T-stress measuring the stress constraint is additionally needed to characterize the general crack-tip fields. While many, research works have been done to verify, the J-T description of elastic-plastic crack-tip stress fields in plane strain specimens, limited works (especially. for bimaterials) have been performed to describe the structural surface crack-front stress fields with the two parameters. On this background, via detailed three dimensional finite element analyses for surface-cracked plates and straight pipes of homogeneous materials and bimaterials under various loadings, we investigate the extended validity or limitation of the two parameter approach. We here first develop a full 3D mesh generating program for semi-elliptical surface cracks, and calculate elastic T-stress from the obtained finite element stress field. Comparing the J-T predictions to the elastic-plastic stresses from 3D finite element analyses. we then confirm the extended validity of fracture mechanics methodology based on the J-T two parameters in characterizing the surface crack-front fields of welded plates and pipes under various loadings.