• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.119-124
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• 1996

End milling operation is very important in machining precision components. Deterioration of surface roughness and surface geometry will cause more process for surface finishing. According to the feed rate and the cutting edge geometry, the cusp which is geometrically uncut surface is determined. To reduce the cost for dinishing operation after end milling, the cusp must be remaianed in small size as possible. Due to the cylindrical type of the end mill, tool deflection is one of the main problems in surface generation. The cutting resistance and the rigidity of the end mill will determine the size of tool deflection. One more important factor which deteriorate surface quality comes from the error in manufacturing end mills. Run-out of end mill which is the difference of the radius of each cutting edges will produce the difference of the cusp size in every rotation of end mill. These three major factors to the surface quality will be analized and the result will be compared with experimental ressult.

• Journal of Electrical Engineering and Technology
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• v.10 no.1
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• pp.320-324
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• 2015

Mutual coupling between antenna elements of a linear microstrip patch antenna array positioned along the H-plane including the effect of edge reflections is investigated. Simple formulas are presented for the estimation of the grounded dielectric substrate size with minimum mutual coupling. The substrate sizes calculated by these formulas are in good agreement with those obtained by the full-wave simulation and experimental measurement. The substrate size with minimum mutual coupling is a function of the effective dielectric constant for surface waves and the distance between the antenna centers. The substrate size with minimum mutual coupling decreases as the effective dielectric constant for surface waves on a finite grounded dielectric substrate increases.

• Journal of the Korean Society for Precision Engineering
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• v.10 no.4
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• pp.64-72
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• 1993

Analytical models for the prediction of the size of hardened zone in laser surface hardening are presented. The models are based on the solutions to the problem of three-dimensional heat flow in plates with infinite thickness. The validity of the model was tested on medium carbon steel for Gaussian mode of beam. Then the model for rectagular beam was used for the predicition of the size of hardened zone on various hardening process parameters. From the calculation results it appeared that the size and shape of the hardened zone are strongly dependent on process parameters such as beam mode, beam size, and traverse speed.

• Journal of the Korean Ceramic Society
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• v.34 no.11
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• pp.1121-1128
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• 1997

In this study, the Ar plasma treatment was used to improve the surface roughness of Poly-Si1-xGex thin film deposited by RTCVD. The surface roughness and the resistivity of Si1-xGex thin film were investigated with variation of Ar plasma treatment parameters (electrode distance, working pressure, time, substrate temperature and R.F power). When the Ar plasma treatment was used, the cluster size decreased by the surface etching effect due to the increasing surface collision energy of particles (ion, neutral atom) in plasma under the conditions of decreasing electrode distance and increasing pressure, time, temperature, and R. F power. Although the surface roughness value decreased by the reduction of the cluster size due to surface etching effect, however, the resistivity increased. This may be due to the surface damage caused by the increasing surface collision energy. It was concluded that the surface roughness could be improved by the Ar plasma treatment, while the resistivity was increased by the surface damage on the substrate.

• Transactions of the Korean Society of Automotive Engineers
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• v.6 no.1
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• pp.134-142
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• 1998

The effects of small hole defect size and effective case depth(ECD) on the four point bending fatigue limit of induction surface hardened S45C steel were investigated the fatigue limit evaluation of hardened materials is very difficult because of relations of the hardness gradient and residual stress. In this study, it was possible to characterize fatigue limit and fatigue life of induction surface hardened S45C steel in terms of the hole defect size and effective case depth(ECD) and quantitative evaluation of the fatigue limit with hole defects use Murakami's evaluation method and the range of evaluated values is a good accuracy compared with results.

• Advances in Computational Design
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• v.5 no.1
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• pp.13-34
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• 2020

As small size and complex metal machining components demand increases, cutting processes in microscale become necessary. Ball-end milling is a commonly used finishing process, which nowadays can be applied in the microscale size. Surface quality and dimensional accuracy are two basic parameters that affect small size components in their assembly and functionality. Thus, good quality can be achieved by optimizing the cutting conditions of the procedure. This study presents a 3D simulation model of ball-end milling in microscale developed in a commercial CAD software and its optical and computing results. These carried out results are resumed to surface topomorphy, surface roughness, chip geometry and cutting forces calculations that arising during the cutting process. A great number of simulations were performed in a milling machine centre, applying the discretized kinematics of the procedure and the final results were compared with measurements of Al7075-T651 experiments.

• Journal of the Korean institute of surface engineering
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• v.47 no.6
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• pp.303-310
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• 2014

In this study, the average in-situ stress in metallic thin film was measured during deposition of the Cu thin films on the Si(111) wafer and then the phenomenon of stress shift by the interruption of deposition was measured using Cu thin films. We have observed the stress shift in accordance with changing amount of atom's movement between the surface and grain boundary through altering the grain size of the Cu thin film with variety of parameters. The grain size is known to be affected on the deposition rate, film thickness and deposition temperature. As a experimental results, the these parameters was not adequate to explain stress shift because these parameters affect directly on the amount of atom's movement between the surface and grain boundary as well as the grain size. Thus, we have observed the stress shift toward tensile side in accordance with the grain size changing through the interlayer deposition. From an experiment with inserting interlayer before deposit Cu, in thin film which has big grain size with high roughness, amount of stress movement is higher along direction of tensile stress after deposition that means, after deposition process, driving force of atoms moving in grain boundary and on the surface of the film is relatively higher than before.

• Journal of Dental Rehabilitation and Applied Science
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• v.30 no.2
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• pp.102-111
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• 2014

Purpose: Surface damage and bonding strength difference after micromechanical treatment of zirconia surface are to be studied yet. The aim of this study was to evaluate the difference of fracture resistance and bonding strength between more surface-damaged group from higher air-blasting particle size and pressure, and less damaged group. Materials and Methods: Disk shape zirconia ($LAVA^{TM}$) was sintered and air-blasted with $30{\mu}m$ particle size (Cojet), under 2.8 bar for 15 seconds, $110{\mu}m$ particle size (Rocatec), under 2.8 bar for 15 seconds, and $110{\mu}m$ particle size (Rocatec), under 3.8 bar for 30 seconds respectively. Biaxial flexure test and bonding failure load test were performed serially (n = 10 per group). For bonding test, specimens were bonded on the base material having similar modulus of elasticity of dentin with $200{\mu}m$-thick resin cement for tension of surface damage. Failure load of bonding was detected with acoustic emission (AE) sensor. Results: There were no significant differences both in the biaxial flexure test and bonding failure load test between groups (P > 0.05). Sub-surface cracks were all radial cracks except for two specimens. Conclusion: Within the limitations of no aging under monotonic load test, surface damage from higher air-blasting particle size and pressure was not significant. Evaluations of failure load with bonded zirconia disks was clinically relevant modality for surface damage and bonding strength, simultaneously.

• Textile Coloration and Finishing
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• v.15 no.5
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• pp.327-332
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• 2003

In this study, the polyurethane microcapsules for non-aqueous dyeing containing iron oxide and disperse dyes were prepared by in-situ polymerization method using hexamethylene diisocyanate(HDI) with ethylene glycol(EG). And the size, shape, and particle size distribution of microcapsules prepared were investigated. The size and shape of microcapsule were observed by optical microscope and scanning elecron microscope. The particle size distribution was analyzed by particle size analyzer. The microcapsule size and its distribution were largely effected by the existance of surface active agent in the system. When a surfactant did not exist in the system, the size distribution of microcapsules prepared was much uneven. By adding a surfactant, this phenomenon was disappeared. And the size of microcapsule was also effeced by the hydrophobicity of core material(disperse dye). It was considered due to the difference of dispersity of core materials. And the size of microcapsule prepared was inversely proportional to the stirring speed.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.9
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• pp.32-37
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• 2008

Freestanding hydride vapor phase epitaxy grown GaN(Gallium Nitride) substrates subjected to various polishing methods were characterized for their surface and subsurface conditions, Although CMP(Chemical Mechanical Polishing) is one of the best approaches for reducing scratches and subsurface damages, the removal rate of Ga-polar surface in CMP is insignificant($0.1{\sim}0.3{\mu}m$/hr) as compared with that of N-polar surface, Therefore, conventional MP(Mechanical Polishing) is commonly used in the GaN substrate fabrication process, MP of (0001) surface of GaN has been demonstrated using diamond slurries with different abrasive sizes, Diamond abrasives of size ranging from 30nm to 100nm were dispersed in ethylene glycol solutions and mineral oil solutions, respectively. Significant change in the surface roughness ($R_a$ 0.15nm) and scratch-free surface were obtained by diamond slurry of 30nm in mean abrasive size dispersed in mineral oil solutions. However, MP process introduced subsurface damages confirmed by TEM (Transmission Electronic Microscope) and PL(Photo-Luminescence) analysis.