• Journal of the Korean Institute of Intelligent Systems
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• v.13 no.4
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• pp.480-485
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• 2003

We Propose a Path planning method to reduce the Inspection time of AOI (automatic optical inspection) machines in SMT (surface mount technology) in-line system. Inspection windows of board should be clustered to consider the FOV (field-of-view) of camera. The number of clusters is desirable to be minimized in order to reduce the overall inspection time. We newly propose a genetic algorithm to minimize the number of clusters for a given board. Comparative simulation results are presented to verify the usefulness of proposed algorithm.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2011.10a
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• pp.440-445
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• 2011

Dynamic characteristic analysis is required in developing SMT mounter system with high installation speed and position precision, because of vibration source occurred by positioning head. This paper presents the method of improving dynamic characteristic of SMT(Surface Mount Technology) mounter with finite element method and modal test. The design direction is that natural frequencies of SMT mounter must be higher than the vibration source. In addition, the effect of input shaping on residual vibration reduction is investigated by simulating the response of a first-order system.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.10
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• pp.982-987
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• 2015

The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.9
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• pp.4138-4146
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• 2011

In surface mount technology, with cellular phones and flat panel displays shrinking in size, the electric goods for making these things are getting smaller as well. Therefore, the technology of mounting components such as 0402 and 0603 Chip is on the rise. The chip mount manufacturing companies have studied the mount technology to prevent the missing insertions or improper insertion. This study suggests arranging the mechanical structure by using fiber sensors to eliminate missing insertions or improper insertions and developing the technology for upgrading system algorithms.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.05a
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• pp.674-675
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• 2016

In this paper, we propose a manufacturing process model of Internet of Things devices using a Printed Circuit Board (PCB)-mounted RFID tag chip for reducing electronic wastes. Electrical and electronic products require a PCB surface mount and many examination. Also, conventional barcode systems cannot provide traceability management in PCB manufacturing before finishing Surface Mount Technology (SMT) process. The proposed process model does not require workers' attaching and detaching process unlike barcode systems. Also, RFID tag chip can record all the data in manufacturing steps. Thus, the number of connections to a database management system (DBMS) can be reduced.

• Journal of Institute of Control, Robotics and Systems
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• v.10 no.8
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• pp.711-717
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• 2004

We propose a path planning method to improve the productivity of SMT (surface mount technology) inspection machines with an area camera. A unified method is newly proposed to determine the FOV clusters and camera sequence simultaneously. The proposed method is implemented by a hybrid genetic algorithm to increase the convergence speed. Comparative simulation results are then presented to verify the usefulness of the proposed algorithm.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.31-35
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• 2022

Recently, with the 4th industrial revolution, the demand for high-density semiconductors for large-capacity data processing is increasing. Researchers are interested in researching the reliability of surface mount technology (SMT). In this study, the effect of PCB pad design on assembly and adhesion reliability of passive component was analyzed using design of experiment (DOE). The DOE method was established using the pad length, width, and distance between pads of the PCB as variables. The assembly defect rate of the passive element after the reflow process was derived according to the misplacement direction of the chip resistor. The shear force between the passive element and the PCB was measured using shear tests. In addition, the shape of the solder according to the pad design was analyzed through cross-sectional analysis.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.494-495
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• 2007

As a pocket size electronic device have developed and electronic parts is increased, it need dual face soldering using SMT(Surface Mount Technology) and it can be getting high density soldering. Inductor is one of their electronic parts using SMT and inductor was developed to make electromagnetic energy. In this study, it is analyzed temperature properties of surface mount type Inductor due to current injection which is satisfied the demand of utmost small size and the substance of high density simultaneously.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.1-5
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• 2011

In this paper, we introduce knowledge sharing platform for production technology. Surface mount technology (SMT) is one of the important production technologies to fabricate electronic devices. The production technology of the SMT, however, has been propagated from an experienced worker to an inexperienced worker in a manufacturing field. The objective of the knowledge sharing platform is to convert the production experiences like a solder printing knowhow into quantitative values, to construct the database of the process technologies, and to share the technologies systematically via web portal service. In addition, the knowledge sharing platform contains the total production process of mobile products, the information of experts and facilities, and recent R&D output. In this manner, the knowledge sharing platform for production technology could strengthen the technological competitiveness of small and medium manufacturing companies in Korea.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.3
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• pp.2146-2150
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• 2015

The surface mount technology is used, as mounting relay using Chip Mounter that is inserted into the junction box, etc. car and small components such as 0402 and 0603 Chip. In this study we developed stick tube for supplying the relay that cause problems as components is heavy and suggested the technology using fiber sensors to eliminate missing insertions or improper insertions because of small components. And we show to result of the experiment how to increased the productivity.