• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.862-865
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• 2000

The surface grinding of STD-11 was attempted on the machining center. Grinding experiments were performed at the various grinding conditions and the grinding force, machining error, grinding ratio, and surface roughness were measured. The experimental results indicate that the grinding ratio decreases as the table speed and depth of cut increase. The surface roughness of ground surface was not affected by the change of depth of cut. The surface roughness values obtained on the experiments were 0.02 ～ 0.03${\mu}{\textrm}{m}$ which are fairy good and acceptable for ground surface.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.33-37
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• 1995

A side-cut grinding generates a machining error by the decrease of the quill rigidity. In this paper, The effect on the grinding force, machining error and surface roughness due to the change of the quill rigidity is investigated experimentally. The slenderness ratio of the quill is a significant factor to analyse the change of the grinding force and machining error.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.4 no.3
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• pp.12-24
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• 1995

Various surface grinding experiments using resin bonded diamond abrasive wheels are carried out for tungsten carbide materials in order to minimize the damage on the ground surface and to purse the precise dimension compared to conventional grinding machine. When grinding quality is constant, theoretical grinding effect is changed according to the speed of workpiece. Accordingly, grinding forces, which are Fn, Ft, were analyzed for the machining processes of tungsten-carbide material to obtain optimum grinding conditions. Brief investigation is carried out to decrease the dressing efficiency of resinoid bonded diamond grinding wheel to grind tungsten-carbide. Truing is also carried out to provide a desired shape on a wheel or to correct a dulled profile. High quality in dimensional accuracy and surface are often required as a structural components, therefore 3-points bending test is carried out to check machining damage on the ground surface layer, which in one of sintered brittle material. From this experimental study, some useful machining data and information to determine proper machining condition for grinding of tungsten-carbide materials are obtained.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.11
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• pp.41-46
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• 2019

The purpose of this study is to examine and propose a high quality blade manufacturing method by applying ELID grinding technology to machining the tungsten carbide blade edge for MLCC sheet cutting. In this study, experiments are performed according to the abrasive type of grinding wheel, grinding method and grinding direction using the non-stop continuous dressing ELID grinding technology. By comparing and analyzing the chipping phenomena and surface roughness of both the blade grinding surface and the processed surface, a method for machining the tungsten carbide blade for cutting MLCC sheet is proposed. From the analysis of the surface roughness and chipping phenomena, it is confirmed that the use of diamond abrasive is advantageous for the blade machining. In addition, it succeeds in the machining of $6{\mu}m$ fine blade without any chipping, by using the grinding wheel #4000 with the diamond abrasive.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.5
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• pp.73-79
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• 2016

In this paper, the grinding characteristics in thrust internal grinding have been studied using vitreous CBN wheels with a machining center. Grinding experiments have been performed according to grinding conditions such as wheel feed speed, cut depth, workpiece speed, rate of grinding width and number of grinding passes. The machining error, shape of machined surfaces, grinding force, and surface roughness have been investigated though these experiments. Based on the experimental results, the grinding characteristics on the machined surface in the internal thrust grinding are discussed.

• 연구논문집
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• s.28
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• pp.59-71
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• 1998

The ELID(electrolytic in-process dressing) grinding method is a new precision grinding technique with the special electrolytic in-process dressing by metal bonded grinding wheel, fluid, and power supply. It is possible to make a efficient precision machining of hard and brittle materials such as ceramics, hard metals, and quenched steels by using this method, In this study, a new efficient precision grinding method with ELID was attempted for application to the machining and finishing processes of cylindrical structural components. And, we try to develop the cylindrical grinding technique for mirror surface of ceramics, tungsten carbide and SCM steel, and for the high efficiency grinding of machined parts, for example, ball screw shaft. Electrical characteristics of three different wheel grit sizes of #325, #2000 and #4000 were investigated experimentally. ELID grinding method is proved to be useful for mirror surface generation and efficient machining.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.9
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• pp.196-203
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• 2004

SL(Stereolithography) part is made by piling up thin layers which causes the stair stepping effect at the surface of SL parts. The effect brings about excessive surface roughness and cuts down the merits of using SL part. Hence, additional post-machining finishing such as traditional grinding is required. But the traditional post-machining is detrimental to part geometry and time consuming. In this study, therefore, a paraffin coating and grinding post-machining is newly proposed to improve the surface quality of SL fart. The paraffin which has suitable properties for the proposed post-machining is coated all over the part surface. By grinding the only over-coated paraffin based on boundary of the SL part surface, the surface roughness can be improved without any damage on the part. Also, it is verified that SL part finished by the proposed post-machining process can be applied for rapid tooling as pattern through manufacturing silicon rubber molding and casting test.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.5
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• pp.58-64
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some finding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.946-949
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• 2001

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some grinding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametral silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpiece are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipped with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6nm in Ra.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.5
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• pp.36-41
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• 2013

One of the problems in grinding process using a machining center(MC) with a small diametric wheels is machining error due to decrease of the quill diameter. In this study, side-cut grinding is performed with a vitrified bonded CBN wheel on the machining center. Grinding experiments are performed at various grinding conditions including quill length, quill diameter and depth of cut. The effect on the grinding force, machining error and surface roughness due to the change of the quill rigidity are investigated experimentally. The slenderness ratio of the quill is significant factor to analyse the change of the grinding force and machining error.