• Title/Summary/Keyword: surface energy

Search Result 9,017, Processing Time 0.039 seconds

Molecular Simulation of Influence of Surface Energy on Water Lubrication (표면 에너지가 물 윤활 현상에 미치는 영향에 대한 분자시뮬레이션 연구)

  • Hyun-Joon Kim
    • Tribology and Lubricants
    • /
    • v.39 no.6
    • /
    • pp.273-277
    • /
    • 2023
  • This paper presents a molecular dynamics simulation-based numerical investigation of the influence of surface energy on water lubrication. Models composed of a crystalline substrate, half cylindrical tip, and cluster of water molecules are prepared for a tribological-characteristic evaluation. To determine the effect of surface energy on lubrication, the surface energy between the substrate and water molecules as well as that between the tip and water molecules are controlled by changing the interatomic potential parameters. Simulations are conducted to investigate the indentation and sliding processes. Three different normal forces are applied to the system by controlling the indentation depth to examine the influence of normal force on the lubrication of the system. The simulation results reveal that the solid surface's surface energy and normal force significantly affect the behavior of the water molecules and lubrication characteristics. The lubrication characteristics of the water molecules deteriorate with the increasing magnitude of the normal force. At a low surface energy, the water molecules are readily squeezed out of the interface under a load, thus increasing the frictional force. Contrarily, a moderate surface energy prevents expulsion of the water molecules due to squeezing, resulting in a low frictional force. At a high surface energy, although squeezing of the water molecules is restricted, similar to the case of moderate surface energy, dragging occurs at the soil surface-water molecule interface, and the frictional force increases.

Neural Network Modeling of Ion Energy Impact on Surface Roughness of SiN Thin Films (신경망을 이용한 SiN 박막 표면거칠기에의 이온에너지 영향 모델링)

  • Kim, Byung-Whan;Lee, Joo-Kong
    • Journal of the Korean institute of surface engineering
    • /
    • v.43 no.3
    • /
    • pp.159-164
    • /
    • 2010
  • Surface roughness of deposited or etched film strongly depends on ion bombardment. Relationships between ion bombardment variables and surface roughness are too complicated to model analytically. To overcome this, an empirical neural network model was constructed and applied to a deposition process of silicon nitride (SiN) films. The films were deposited by using a pulsed plasma enhanced chemical vapor deposition system in $SiH_4$-$NH_4$ plasma. Radio frequency source power and duty ratio were varied in the range of 200-800 W and 40-100%. A total of 20 experiments were conducted. A non-invasive ion energy analyzer was used to collect ion energy distribution. The diagnostic variables examined include high (or) low ion energy and high (or low) ion energy flux. Mean surface roughness was measured by using atomic force microscopy. A neural network model relating the diagnostic variables to the surface roughness was constructed and its prediction performance was optimized by using a genetic algorithm. The optimized model yielded an improved performance of about 58% over statistical regression model. The model revealed very interesting features useful for optimization of surface roughness. This includes a reduction in surface roughness either by an increase in ion energy flux at lower ion energy or by an increase in higher ion energy at lower ion energy flux.

Calculating of the Unrelaxed Surface Energy of Spinel Ferrites (스피넬 페라이트의 비이완 표면에너지 계산)

  • Shin, Hyung-Sup;Sohn, Jeongho
    • Korean Journal of Materials Research
    • /
    • v.25 no.12
    • /
    • pp.713-718
    • /
    • 2015
  • A new method is proposed for the calculation of the unrelaxed surface energy of spinel ferrite. The surface energy calculation consists of (1) setting the central and computational domains in the semi-infinite real lattice, having a specific surface, and having an infinite real lattice; (2) calculation of the lattice energies produced by the associated portion of each ion in the relative domain; and (3) dividing the difference between the semi-infinite lattice energy and the infinite lattice energy on the exposed surface area in the central domain. The surface energy was found to converge with a slight expansion of the domain in the real lattice. This method is superior to any other so far reported due to its simple concept and reduced computing burden. The unrelaxed surface energies of the (100), (110), and (111) of $ZnFe_2O_4$ and $Fe_3O_4$ were evaluated by using in the semi-infinite real lattices containing only one surface. For the normal spinel $ZnFe_2O_4$, the(100), which consisted of tetrahedral coordinated $Zn^{2+}$ was electrostatically the most stable surface. But, for the inverses pinel $Fe_3O_4$, the(111), which consisted of tetrahedral coordinated $Fe^{3+}$ and octahedral coordinated $Fe^{2+}$ was electrostatically the most stable surface.

Effects of Substrate and Surface Energy on Ink-jet Printing

  • Lee, Jin-Ho;Kim, Hong-Doo
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2009.10a
    • /
    • pp.1457-1458
    • /
    • 2009
  • The fundamental parameters controlling ink-jet printing liquids are the viscosity and surface energy. The wetting contact angle determines the spread of a liquid drop on the surface and depends on the relative surface energy. The characteristics of silver ink-jet printing were studied with control of surface energy and head temperature. Polyethylene terephthalate(PET) film and Si-wafer(ptype) were used as substrates and atmospheric plasma was treated to control the surface energy. With silver ink, the hydrophilic surface treatment could reduce the radius of droplets due to the hydrophobic nature of silver ink.

  • PDF

SWR as Tool for Determination of the Surface Magnetic Anisotropy Energy Constant

  • Maksymowicz, L.J.;Lubecka, M.;Jablonski, R.
    • Journal of Magnetics
    • /
    • v.3 no.4
    • /
    • pp.105-111
    • /
    • 1998
  • The low energy excitations of spin waves (SWR) in thin films can be used for determination of the surface anisotropy constant and the nonhomogeneities of magnetization in the close-to-surface layer. The dispersion relation in SWR is sensitive on the geometry of experiment. We report on temperature dependence of surface magnetic anisotropy energy constant in magnetic semiconductor thin films of$ CdCr_{2-2x}In_{2x}Se_4$ at spin glass state. Samples were deposited by rf sputtering technique on Corning glass substrate in controlled temperature conditions. Coexistence of the infinite ferromagnetic network (IFN) and finite spin slusters (FSC) in spin glass state (SG) is know phenomena. Some behavior typical for long range magnetic ordering is expected in samples at SG state. The spin wave resonance experiment (microwave spectrometer at X-band) with excited surface modes was applied to describe the energy state of surface spins. We determined the surface magnetic anisotropy energy constant versus temperature using the surface inhomogeneities model of magnetic thin films. It was found that two components contribute to the surface magnetic anisotropy energy. One originates from the exchange interaction term due to the lack of translation symmetry for surface spin as well as from the originates from the exchange interaction term due to the lack of translation symmetry for surface spin as well as from the stray field of the surface roughness. The second one comes from the demagnetizing field of close-to surface layer with grad M. Both term linearly decrease when temperature is increased from 5 to 123 K, but dominant contribution is from the first component.

  • PDF

Effects of Surface Order Parameter on Polar Anchoring Energy in NLC on Weakly Rubbed Polyimide Surface

  • Seo, Dae-Shik
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.11 no.12
    • /
    • pp.1128-1132
    • /
    • 1998
  • We have investigated the relationship between the polar anchoring energy and the surface order parameter in nematic liquid crystal (NLC), 4-n-pentyl-4-cyanobiphenyl (5CB), on the two kinds of the weakly rubbed polyimide (PI) surfaces. The observed polar anchoring energy of 5CB is approximately 2${\times}10^{-4}(J/m^2$) and then increases with increasing the rubbing strength (RS) on weakly rubbed surface (RS=57mm) with side chain at $30^{\circ}C$; same results are obtained on weakly rubbed PI surface without side chain. The surface order parameter of 5CB on rubbed PI surfaces increases with increasing the RS at a weak rubbing region. The surface order parameter of 5CB is strongly related to the characteristics of PI material. Consequently, we suggest that the polar anchoring energy of NLC is strongly attributed to the surface order parameter on rubbed PI surfaces.

  • PDF

Effect of O2 Plasma Treatment on the Surface Morphology and Characteristics of Poly (imide) to Develop Self-cleaning Industrial Materials (자기세정산업용 소재 개발을 위한 O2 플라즈마 처리가 Poly(imide) 필름의 표면 형태 및 특성에 미치는 영향)

  • Kang, In-Sook
    • Journal of the Korean Society of Clothing and Textiles
    • /
    • v.36 no.10
    • /
    • pp.1117-1124
    • /
    • 2012
  • This study was a preliminary study to investigate the influence of surface morphology and characteristics on the self-cleaning of substrates. PI film was treated by $O_2$ plasma to modify the surface; in addition, AFM and Fe-SEM were employed to examine the morphological changes induced on a PI film treated by $O_2$ plasma and surface energies calculated from measured contact angles between several solutions and PI film based on the geometric mean and a Lewis acid base method. The surface roughness of PI film treated by $O_2$ plasma increased with the duration of the $O_2$ plasma on PI film due to the increased surface etching. The contact angle of film treated by $O_2$ plasma decreased with the increased treatment time in water and surfactant solution; in addition, the surface energy increased with the increased treatment times largely attributed to the increased portion on the polar surface energy of PI film. The coefficient of the correlation between surface roughness and surface polarity such as contact angle and surface energy was below 0.35; however, it was over 0.99 for the contact angle and surface energy.

Surface Energy of Graphene Transferred by Wet and Dry Transfer Methods (전사 방법에 따른 그래핀의 표면 에너지 변화)

  • Yoon, Min-Ah;Kim, Chan;Won, Sejeong;Jung, Hyun-June;Kim, Jae-Hyun;Kim, Kwang-Seop
    • Tribology and Lubricants
    • /
    • v.35 no.1
    • /
    • pp.9-15
    • /
    • 2019
  • Graphene is a fascinating material for fabricating flexible and transparent devices owing to its thickness and mechanical properties. To utilize graphene as a core material for devices, the transfer process of graphene is an inevitable step. The transfer process can be classified into wet and dry methods depending on the surrounding environment. The adhesion between graphene and a target substrate determines the success or failure of the transfer process. As the surface energy of graphene is an important parameter that provides adhesion, it is useful to estimate the surface energy to understand the mechanisms of the transfer process. However, the exact surface energy of graphene is still disputed because the wetting transparency of graphene depends on the polarity of the liquid and target substrate. Previously reported results use graphene transferred by the wet method. However, there are few reports on the surface energy of graphene transferred by the dry method. In this study, the surface energy of graphene transferred by the wet and dry methods is estimated. Wetting transparency occurs for certain combinations of liquids and substrates. For graphene on a polar substrate, the surface energy decreases by 25 and 35% for the wet and dry transfer methods, respectively. However, the surface energy of graphene on dispersive substrates decreases by ~10% regardless of the transfer method. In conclusion, the surface energy of graphene is $36{\sim}38mJ/m^2$, and differs depending on the transfer method and polarity of the substrate.

Atomic Force Microscopy Simulation for Si (001) Surface Defects (Si (001) 표면 결함 원자힘 현미경 전산모사)

  • Jo, Junyeong;Kim, Dae-Hee;Kim, Yurie;Kim, Ki-Yung;Kim, Yeong-Cheol
    • Journal of the Semiconductor & Display Technology
    • /
    • v.17 no.4
    • /
    • pp.1-5
    • /
    • 2018
  • Atomic force microscopy (AFM) simulation for Si (001) surface defects was conducted by using density functional theory (DFT). Three major defects on the Si (001) surface are difficult to analyze due to external noises that are always present in the images obtained by AFM. Noise-free surface defects obtained by simulation can help identify the real surface defects on AFM images. The surface defects were first optimized by using a DFT code. The AFM tip was designed by using five carbon atoms and positioned on the surface to calculate the system's energy. Forces between tip and surface were calculated from the energy data and converted into an AFM image. The simulated AFM images are noise-free and, therefore, can help evaluate the real surface defects present on the measured AFM images.