The TEM Characterization of the Interfacial Microstructure between In Solder and Au/Ni/Ti Thin Films during Reflow Process (리플로 공정 후에 형성된 In과 Au/Ni/Ti 다층 박막의 계면 구조의 TEM 분석)
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- Journal of the Korean institute of surface engineering
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- v.32 no.4
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- pp.503-512
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- 1999