Journal of the Institute of Electronics Engineers of Korea SD
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v.47
no.2
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pp.68-76
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2010
Touch-enabled technology is increasingly being accepted as a main communication interface between human and computers. However, conventional touchscreen technologies, such as resistive overlay, capacitive overlay, and SAW(Surface Acoustic Wave), are not cost-effective for large screens. As an alternative to the conventional methods, we introduce a newly emerging method, an optical imaging touchscreen which is much simpler and more cost-effective. Despite its attractive benefits, optical imaging touchscreen has to overcome some problems, such as heavy computational complexity, intermittent ghost points, and over-sensitivity, to be commercially used. Therefore, we designed a hardware controller for signal processing and multi-coordinate computation, and proposed Infrared-blocked DA(Dark Area) manipulation as a solution. While the entire optical touch control took 34ms with a 32-bit microprocessor, the designed hardware controller can manage 2 valid coordinates at 200fps and also reduce energy consumption of infrared diodes from 1.8Wh to 0.0072Wh.
Proceedings of the Korean Vacuum Society Conference
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2010.02a
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pp.93-93
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2010
Semiconductor nanocrystal quantum dots (NQDs) have recently attracted considerable interest for use in photovoltaics. Band gaps of NQDs can be tuned over a considerable range by varying the particle size thereby allowing enhance absorption of solar spectrum. NQDs, synthesized using colloidal routes, are solution processable and promise for a large-area fabrication. Recent advancements in multiple-exciton generation in NQD solutions have afforded possible efficiency improvements. Various architectures have attempted to utilize the NQDs in photovoltaics, such as NQD-sensitized solar cell, NQD-bulk-heterojuction solar cell and etc. Here we have fabricated CdSe NQDs with the band gap of 1.8 eV to 2.1 eV on thin-layers of p-type organic crystallites (1.61 eV) to realize a donor-acceptor type heterojuction solar cell. Simple structure as it was, we could control the interface of electrode-p-layer, and n-p-layer and monitor the following efficiency changes. Specifically, surface molecules adsorbed on the NQDs were critical to enhance the carrier transfer among the n-layer where we could verify by measuring the photo-response from the NQD layers only. Further modifying the annealing temperature after the deposition of NQDs on p-layers allowed higher conversion efficiencies in the device.
In this study, we have investigated the role of a metal oxide hole injection layer (HIL) between an Indium Tin Oxide (ITO) electrode and an organic hole transporting layer (HTL) in organic light emitting diodes (OLEDs). Nickel Oxide films were deposited at different deposition times of 0 to 60 seconds, thus leading to a thickness from 0 to 15 nm on ITO/glass substrates. To study the influence of NiO film thickness on the properties of OLEDs, the relationships between NiO/ITO morphology and surface properties have been studied by UV-visible spectroscopy measurements and AFM microscopy. The dependences of the I-V-L properties on the thickness of the NiO layers were examined. Comparing these with devices without an NiO buffer layer, turn-on voltage and luminance have been obviously improved by using the NiO buffer layer with a thickness smaller than 10 nm in OLEDs. Moreover, the efficiency of the device ITO/NiO (< 5 nm)/NPB/$Alq_3$/ LiF/Al has increased two times at the same operation voltage (8V). Insertion of a thin NiO layer between the ITO and HTL enhances the hole injection, which can increase the device efficiency and decrease the turn-on voltage, while also decreasing the interface roughness.
Seo, Seong Min;Sri Harini, Rajendran;Jung, Jae Pil
Journal of the Microelectronics and Packaging Society
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v.29
no.1
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pp.35-41
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2022
In the era of Fifth-Generation (5G), technology requirements such as Artificial Intelligence (AI), Cloud computing, automatic vehicles, and smart manufacturing are increasing. For high efficiency of electronic devices, research on high-intensity circuits and packaging for miniaturized electronic components is important. A solder paste which consists of small solder powders is one of common solder for high density packaging, whereas an electroplated solder has limitation of uniformity of bump composition. Researches are underway to improve wettability through the addition of nanoparticles into a solder paste or the surface finish of a substrate, and to suppress the formation of IMC growth at the metal pad interface. This paper describes the principles of improving the wettability of solder paste and suppressing interfacial IMC growth by addition of nanoparticles.
Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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v.20
no.1
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pp.43-63
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2022
The aim of this review is to communicate some essential knowledge of the underlying mechanism of the corrosion of structural containment alloys during molten salt reactor operation in the context of prospective online monitoring in future MSR installations. The formation of metal halide species and the progression of their concentration in the molten salt do reflect containment corrosion, tracing the depletion of alloying metals at the alloy salt interface will assure safe conditions during reactor operation. Even though the progress of alloying metal halides concentrations in the molten salt do strongly understate actual corrosion rates, their prospective 1st order kinetics followed by near-linearly increase is attributed to homogeneous matrix corrosion. The service life of the structural containment alloy is derived from homogeneous matrix corrosion and near-surface void formation but less so from intergranular cracking (IGC) and pitting corrosion. Online monitoring of corrosion species is of particular interest for molten chloride systems since besides the expected formation of chromium chloride species CrCl2 and CrCl3, other metal chloride species such as FeCl2, FeCl3, MoCl2, MnCl2 and NiCl2 will form, depending on the selected structural alloy. The metal chloride concentrations should follow, after an incubation period of about 10,000 hours, a linear projection with a positive slope and a steady increase of < 1 ppm per day. During the incubation period, metal concentration show 1st order kinetics and increasing linearly with time1/2. Ideally, a linear increase reflects homogeneous matrix corrosion, while a sharp increase in the metal chloride concentration could set a warning flag for potential material failure within the projected service life, e.g. as result of intergranular cracking or pitting corrosion. Continuous monitoring of metal chloride concentrations can therefore provide direct information about the mechanism of the ongoing corrosion scenario and offer valuable information for a timely warning of prospective material failure.
This study analyzes the thermal effects on the performance of an air foil thrust bearing (AFTB) using COMSOL Multiphysics to approximate actual bearing behavior under real conditions. An AFTB is a sliding-thrust bearing that uses air as a lubricant to support the axial load. The AFTB consists of top and bump foils and supports the rotating disk through the hydrodynamic pressure generated by the wedge effect from the inclined surface of the top foil and the elastic deformation of the bump foils, similar to a spring. The use of air as a lubricant has some advantages such as low friction loss and less heat generation, enabling air bearings to be widely used in high-speed rotating systems. However, even in AFTB, the effects of energy loss due to viscosity at high speeds, interface frictional heat, and thermal deformation of the foil caused by temperature increase cannot be ignored. Foil deformation derived from the thermal effect influences the minimum decay in film thickness and enhances the film pressure. For these reasons, performance analyses of isothermal AFTBs have shown few discrepancies with real bearing behavior. To account for this phenomenon, a thermal-fluid-structure analysis is conducted to describe the combined mechanics. Results show that the load capacity under the thermal effect is slightly higher than that obtained from isothermal analysis. In addition, the push and pull effects on the top foil and bump foil-free edges can be simulated. The differences between the isothermal and thermal behaviors are discussed.
In this study, adaptation of compomer to saliva contaminated dentin was evaluated with scanning electron microscope(SEM) and confocal laser scanning microscope(CLSM). For the SEM study, the occulusal surfaces of thirty two molar teeth were grounded to exposure dentin surfaces. The specimen were randomly assigned to control and three experimental groups with four samples in each group. In control group, Dyract and F-2000 compomer were bonded on the specimens according to the manufactures direction. Experimental groups were subdivided into three groups. They were contaminated with saliva on dentin surfaces ; Experimental group 1 : Saliva was dried with compressed air. Experimental group 2 : Saliva was rinsed with air-water spray and dried. Experimental group 3 : After polymerization of an adhesive, they were contaminated with saliva, and then saliva was rinsed with air-water spray and dried. Dyract and F-2000 compomer were bonded on saliva-treated dentin surfaces. The interfaces between dentin and compomer were observed with SEM. For the CLSM study, Class V cavities were prepared in buccal and ligual surfacess of thirty two molars. The specimens were divided into control and experimental groups. Class V cavities in experimental group were contaminated with saliva and those surfaces in each experimental groups received the same treatments as for the SEM study. Cavities were applied Prime & Bond 2.1 and F-2000 compomer primer/adhesive that were mixed with fluorescein, and then were filled with Dyract and F-2000 compomer. Specimens were embedded in transparent acrylic resin and sectioned buccolingual1y with diamond wheel saw, and then mounted on cover slide for CLSM study. The interface between cavity and compomer was observed by fluoresence imaging with a CLSM. The results were as follows : 1. In SEM exammination of Dyract group, control group, experimental group 2, 3 showed close adaptation to dentin and hybrid layer of $3{\sim}4{\mu}m$ diameter. Interfacial gap between compomer and dentin in experimental group 1 was wider than in control group. 2. In SEM examination of F-2000 group, adaptation to dentin of control group was closer than Dytact control group, but hybrid-like layer was not observed. Interfacial gap between compomer and dentin in experimental group 1 was wider than in Dyract experimental group 1. 3. In dissolution specimens of Dyract and F-2000 group, resin tags penetrated through dentinal tubules in control group and experimental group 1 and 3, but the penetration of resin tag was irregular and partial in experimental group 1. 4. In CLSM exammination of Dyract and F-2000 group, adhesive patterns of control and experimental groups showed same as in SEM. This result suggests the treatment methods, rinsing & drying, repeating all adhesive procedures, will produce good effect on adaptation of compomer to dentin if the dentin surface or polymerized adhesive is contaminated by saliva.
Dye-sensitized solar cells (DSSCs) have attracted considerable attention on account of their high solar energy-to-conversion efficiencies and low cost processes compared to conventional p-n junction solar cells. The mechanism of DSSC is based on the injection of electrons from the photo excited dyes into the conduction band of the semiconductor electrode. The oxidized dye is reduced by the hole injection into either the hole conductor or the electrolyte. Thus, the light harvesting effect of dye plays an important role in capturing the photons and generating the electron/hole pair, as well as transferring them to the interface of the semiconductor and the electrolyte, respectively. We used the organic fluorescence materials which can absorb short wavelength light and emit longer wavelength region where dye sensitize effectively. In this work, the DSSCs were fabricated with fluorescence materials added $TiO_2$ photo-electrode which were sensitized with metal-free organic dyes. The photovoltaic performances of fluorescence aided DSSCs were compared, and the recombination dark current curves and the incident photon-to-current (IPCE) efficiencies were measured in order to characterize the effects of the additional light harvesting effect in DSSC. Electro-optical measurements were also used to optimize the fluorescence material contents on TiO2 photo-electrode surface for higher conversion efficiency (${\eta}$), fill factor (FF), open-circuit voltage (VOC) and short-circuit current (ISC). The enhanced light harvesting effect by the judicious choice/design of the fluorescence materials and sensitizing dyes permits the enhancement of photovoltaic performance of DSSC.
Environmental and health concerns over the lead have led to investigation of the alternative Pb-free solders to replace commonly used Pb-Sn solders in microelectronic packaging application. The leading candidates for lead-free solder alloys are presently the near eutectic Sn-Ag-Cu alloys. Therefore, extensive studies on reliability related with the composition have been reported. However, the insufficient drop property of the near eutectic Sn-Ag-Cu alloys has demanded solder compositions of low Ag content. In addition, the solder interconnections in automobile applications like a smart box require significantly improved vibration resistance. Therefore, this study investigated the effect of alloying elements (Ag, Bi, In) on the vibration fatigue strength. The vibration fatigue was conducted in 10~1000Hz frequency and 20Grms. The interface of the as-soldered cross section close to the Cu pad indicated the intermetallic compound ($Cu_6Sn_5$) regardless of solder composition. The type and thickness of IMC was not significantly changed after the vibration test. It indicates that no thermal activities occurred significantly during vibration. Furthermore, as a function of alloying composition, the vibration crack path was investigated with a focus on the IMCs. Vibration crack was initiated from the fillet surface of the heel for QFP parts and from the plating layer of chip parts. Regardless of the solder composition, the crack during a vibration test was propagated as same as that during a thermal fatigue test.
The effect of application of dentin bonding agent to the exposed dentin on the intradental nerve activity (INA), dentinal fluid movement and sealing of the dentinal tubules, was investigated in this study. The INA was recorded from the single pulp nerve unit dissected from the inferior alveolar nerve. And specimen of dentin was observed by SEM. Dentinal fluid 'movement through exposed dentin surface was measured before and after the application of dentin bonding agent. 1. Eight Ao-fiber units (conduction velocity: $8.0{\pm}4.0m$/sec) were identified. 4M NaCl evoked an irregular burst of action potentials which ceased immediately after washing. 2. In 4 $A{\delta}$-fiber units, appliction of All Bond 2 completely abolished the INA induced by 4M NaCl. Also, application of Scotchbond Multipurpose(SBMP) totally abolished the INA induced by 4M NaCl in 4 $A{\delta}$-fiber units. 3. Before the application of dentin bonding agent, outward dentinal fluid movement of $10.2{\pm}5.7\;pl{\cdot}s^{-1}{\cdot}mm^{-2}$ was obsered. But after the application of dentin bonding agent the movement of dentinal fluid was stopped. 4. The gap width of 2-$3{\mu}m$ was formed between exposed dentin and adhesive resin in the specimens applied with dentin bonding agents of All Bone 2 and SBMP. But the formation of hybrid layer and the penetration of resin into were dentinal tubules were not clearly observed in interface between dentin and adhesive resin.
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