• Title/Summary/Keyword: substrate thickness

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Crystal Structure and Physical Property of Tetragonal-like Epitaxial Bismuth Ferrites Film

  • Nam, Joong-Hee;Biegalski, Michael;Christen, Hans M.;Kim, Byung-Ik
    • Proceedings of the Korean Magnestics Society Conference
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    • 2011.06a
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    • pp.7-8
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    • 2011
  • Basically, the lattice mismatch between film and substrate can make those BiFeO3(BFO) films distorted with strain structure. BFO phase can be stabilized on LaAlO3(LAO) represents the example of a multiferroic with giant axial ratio. Its crystal structure is not strictly tetragonal, but tetragonal with a slight monoclinic distortion and related to the rotation of the oxygen octahedra. In this study, we show that phases with a tetragonal-like epitaxial BFO films can indeed be ferroelectric and also can be stabilized via epitaxial growth onto LAO. Recent reports on epitaxial BFO films show that the crystal structure changes from nearly rhombohedral ("R-like") to nearly tetragonal("T-like") at strains exceeding approximately -4.5%, with the "T-like" structure being characterized by a highly enhanced c/a ratio. While both the "R-like" and the "T-like" phases are monoclinic, our detailed x-ray diffraction results reveal asymmetry change from MA and MC type, respectively. By applying additional strain or by modifying the unit cell volume of the film by substituting Ba for Bi, the monoclinic distortion in the "T-like" MC phase is reduced, i.e. the system approaches a true tetragonal symmetry. There are two different M-H loops for $Bi_{1-x}Ba_xFeO_{3-{\delta}}$(BBFO) and BFO films on SrTiO3(STO) & LAO substrates. Along with the ferroelectric characterization, these magnetic data indicate that the BFO phase stabilized on LAO represents the first example of a multiferroic with giant axial ratio. However, there is a significant difference between this phase and other predicted ferroelectrics with a giant axial ratio: its crystal structure is not strictly tetragonal, but tetragonal with a slight monoclinic distortion. Therefore, in going from bulk to highly-strained films, a phase sequence of rhombohedral(R)-to-monoclinic ["R-like" MA-to-monoclinic, "T-like" MC-to-tetragonal (T)] is observed. This sequence is otherwise seen only near morphotropic phase boundaries in lead-based solid-solution perovskites (i.e. near a compositionally induced phase instability), where it can be controlled by electric field, temperature, or composition. Our results show that this evolution can occur in a lead-free, stoichiometric material and can be induced by stress alone. Those major results are summarized as follows ; 1) Ba-doping increases the unit cell volume, 2) BBFO on LAO can be fully strained up to x=0.08 as a strain limit (Fig. 1), 3) P(E) & M(H) properties can be tuned by the variation of composition, strain, and film thickness.

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Fabrication of MEMS Test Socket for BGA IC Packages (MEMS 공정을 이용한 BGA IC 패키지용 테스트 소켓의 제작)

  • Kim, Sang-Won;Cho, Chan-Seob;Nam, Jae-Woo;Kim, Bong-Hwan;Lee, Jong-Hyun
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.11
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    • pp.1-5
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    • 2010
  • We developed a novel micro-electro mechanical systems (MEMS) test socket using silicon on insulator (SOI) substrate with the cantilever array structure. We designed the round shaped cantilevers with the maximum length of $350{\mu}m$, the maximum width of $200{\mu}m$ and the thickness of $10{\mu}m$ for $650{\mu}m$ pitch for 8 mm x 8 mm area and 121 balls square ball grid array (BGA) packages. The MEMS test socket was fabricated by MEMS technology using metal lift off process and deep reactive ion etching (DRIE) silicon etcher and so on. The MEMS test socket has a simple structure, low production cost, fine pitch, high pin count and rapid prototyping. We verified the performances of the MEMS test sockets such as deflection as a function of the applied force, path resistance between the cantilever and the metal pad and the contact resistance. Fabricated cantilever has 1.3 gf (gram force) at $90{\mu}m$ deflection. Total path resistance was less than $17{\Omega}$. The contact resistance was approximately from 0.7 to $0.75{\Omega}$ for all cantilevers. Therefore the test socket is suitable for BGA integrated circuit (IC) packages tests.

Growth of CdS thin film using hot wall epitaxy method and their photoconductive characteristics (HWE 방법에 의한 CdS 박막의 성장과 광전도 특성)

  • 홍광준
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.6 no.3
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    • pp.341-350
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    • 1996
  • The CdS thin films are grown on quartz plate by hot wall epitaxy. The source and substrate temperature is $590^{\circ}C$ and $400^{\circ}C$ respectively, and thickness of the film is $2.5\;\mu\textrm{m}$. Using extrapolation method of X-ray diffraction patterns for the CdS thin film, it was found hexagonal structure whose lattice constant a and c were $4.137\;{\AA}$ and $6.713\;{\AA}$, respectively. Hall effect on this sample was measured by the method of van der Pauw and studied on cattirer density and mobility depending on temperature. From hall data, the mobility was likely to be decreased by piezoelectric scattering in the temperature range 30 K to 200 K and by polar optical scattering in the temperature range 200 K to 293 K. In order to explore the applicability as a photoconductive cell we measured the sensitivity ($\gamma$), the ratio of photocurrent to darkcurrent (pc/dc), maximum allowable power dissipation (MAPD), spectral response and response time. The results indicated that for the samples annealed in Cu vapor the photoconductive characteristics are the best. Then we obtained the sensitivity of 0.99, the value of pc/dc of $9.42{\times}10^{6}$, the MAPD of 318 mW, and the rise and decay time of 10 ms and 9 ms, respectively.

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A Study on the Preparation and Application of Au/TiO2 Nanofiber from AAO Template (AAO Template를 이용한 Au/TiO2 나노섬유 제조 및 응용에 관한 연구)

  • Eom, Seon-Mi;Park, Sang-Sun;Kim, Young-Deok;Kim, Yong-Rok;Shul, Yong-Gun
    • Journal of the Korean Electrochemical Society
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    • v.12 no.1
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    • pp.47-53
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    • 2009
  • In this study, highly ordered AAO (Anodic Aluminum Oxide) with nanopores was prepared by commercial grade Al substrate containing 3.5 wt.% impurities through two step anodizing method. Nanopores of prepared AAO arrays were used as templates for preparing nanofiber. $TiO_2$ was deposited by using DP (deposition-precipitation) method into AAO pores to grow nanofiber. Au particles were loaded on this $TiO_2$ nanofiber which was grown vertically. Prepared 2 wt.% $Au/TiO_2$ nanofiber was characterized by XRD, SEM and Raman. The crystal structure was analyzed by the XRD. SEM was used to observe pore size and pore wall thickness. Photocatalytic activity of co-oxidation was compared with $TiO_2$ and $Au/TiO_2$ nanofiber on AAO arrays.

The Effect of Impact Velocity on Droplet-wall Collision Heat Transfer Above the Leidenfrost Point Temperature (Leidenfrost 지점 온도 이상에서 액적-벽면 충돌 열전달에 대한 충돌 속도의 영향)

  • Park, Jun-seok;Kim, Hyungdae;Bae, Sung-won;Kim, Kyung Doo
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.39 no.7
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    • pp.567-578
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    • 2015
  • Single droplet-wall collision heat transfer characteristics on a heated plate above Leidenfrost temperature were experimentally investigated considering the effects of impact velocity. The collision characteristics of the droplet impinged on the heated wall and the changes in temperature distribution were simultaneously measured using synchronized high-speed video and infrared cameras. The surface heat flux distribution was obtained by solving the three-dimensional transient heat conduction equation for the heated substrate using the measured surface temperature data as the boundary condition for the collision surface. As the normal impact velocity increased, heat transfer effectiveness increased because of an increase in the maximum spreading diameter and a decrease in the vapor film thickness between the droplet and heated wall. For We < 30, droplets stably rebounded from a heated wall without breakup. However, the droplets broke up into small droplets for We > 30. The tendency of the heat transfer to increase with increasing impact velocity was degraded by the transition from the rebounding region to the breakup region; this was resulted from the reduction in the effective heat transfer area enlargement due to the breakup phenomenon.

Effects on the Oxidation Rate with Silicon Orientation and Its Surface Morphology (실리콘배향에 따른 산화 속도 영향과 표면 Morphology)

  • Jeon, Bup-Ju;Oh, In-Hwan;Um, Tae-Hoon;Jung, Il-Hyun
    • Applied Chemistry for Engineering
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    • v.8 no.3
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    • pp.395-402
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    • 1997
  • The $SiO_2$ films were prepared by ECR(electron cyclotron resonance) plasma diffusion method, Deal-Grove model and Wolters-Zegers-van Duynhoven model were used to estimate the oxidation rate which was correlated with surface morphology for different orientation of Si(100) and Si(111). It was seen the $SiO_2$ thickness increased linearly with initial oxidation time. But oxidation rate slightly decrease with oxidation time. It was also shown that the oxidation process was controlled by the diffusion of the reactive species through the oxide layer rather than by the reaction rate at the oxide interface. The similar time dependency has been observed for thermal and plasma oxidation of silicon. From D-G model and W-Z model, the oxidation rate of Si(111) was 1.13 times greater than Si(100) because Si(111) had higher diffusion and reaction rate, these models more closely fits the experimental data. The $SiO_2$ surface roughness was found to be uniform at experimental conditions without etching although oxidation rate was increased, and to be nonuniform due to etching at experimental condition with higher microwave power and closer substrate distance.

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Spot marking of the multilayer thin films by Nd:YAG laser (Nd:YAG 레이저에 의한 다층 박막의 미소 점 마킹)

  • Kim, Hyun-Jin;Shin, Yong-Jin
    • Korean Journal of Optics and Photonics
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    • v.15 no.4
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    • pp.361-368
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    • 2004
  • We separated the multilayer structure of CD-R(compact disk-recordable) and investigated optimal spot marking conditions and physical and chemical transitions in response to various laser beam energh levels. Spot marking(80 ${\mu}{\textrm}{m}$ spot size) was produced on the surface of each layer using a Q-switched Nd:YAG laser between 27 mJ and 373mJ. By investigating resulting pit formation with Optical Microscopy(OM) and Optical Coherence Tomography(OCT), we analyzed the formation process of spot marking in the multilayer structure of different chemical composition. The localized heating of the substrate in the multilayer thin film caused the short temporal thermal expansion, and absorbed optical energy between reflective and dye interfaces melted dye and increased the volume. During the cooling phase, formation of pit and surrounding rim can be explained by three distinct processes; effect of surface tension, evaporation by spontaneous temperature increase due to laser energy, and mass flow from the recoil pressure. Our results shows that the spot marking formation process in the multilayer thin film is closely related to the layers' physical, chemical, and optical properties, such as surface tension, melt viscosity, layer thickness, and chemical composition.

Multimode fiber-optic pressure sensor based on dielectric diaphragm (유전체 다이아프램을 이용한 다모드 광섬유 압력센서)

  • 김명규;권대혁;김진섭;박재희;이정희;손병기
    • Journal of the Korean Vacuum Society
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    • v.6 no.3
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    • pp.220-226
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    • 1997
  • An optical intensity-type pressure sensor has been fabricated by coupling multimode optical fiber with 100 nm-Au/30 nm-NiCr/150 nm-$Si_3N_4/300 nm-SiO_2/150 nm-Si_3N_4$ optical reflection layer supported by micromachined frame-shape silicon substrate, and its characteristics was investigated. For the application of $Si_3N_4/SiO_2/Si_3N_4$ diaphragm to the optical reflection layer of the sensor, NiCr and Au films were deposited on the backside of the diaphragm by thermal evaporation , respectively, and thus optical low caused by transmission in the reflection layer could be decreased to a few percents. Dielectric diaphragms with uniform thickness were able to be also reproduced because top- and bottom-$Si_3N_4$ layer of the diaphragm could automatically stop silicon anisotropic etching. The respective pressure ranges in which the sensor showed linear optical output power-pressure characteristics were 0~126.64 kPa, 0~79. 98 kPa, and 0~46.66 kPa, and the respective pressure sensitivities of the sensor were about 20.69 nW/kPa, 26.70 nW/kPa, and 39.33 nW/kPa, for the diaphragm sizes of 3$\times$3 $\textrm{mm}^2$, 4$\times$4 $\textrm{mm}^2$, and 5$\times$5 $\textrm{mm}^2$, indicating that the sensitivity increases as diaphragm size increases.

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Dual-band Monopole Antenna with Half X-slot for WLAN (절반의 X-슬롯을 가진 무선랜용 이중대역 모노폴 안테나)

  • Shin, Dong-Gi;Lee, Young-Soon
    • Journal of Advanced Navigation Technology
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    • v.22 no.5
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    • pp.449-455
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    • 2018
  • For the size reduction, we propose a microstrip-fed monopole antenna with half X-slot in the radiation patch and cover WLAN dual band 2.4 GHz band (2.4 ~ 2.484 GHz) and 5 GHz band (5.15 ~ 5.825 GHz). The frequency characteristics such as impedance bandwidth and resonant frequencies were satisfied by optimizing the numerical values of various parameters, while the reflection loss in 5 GHz was improved by using defected ground structure (DGS). The proposed antenna is designed and fabricated on a FR-4 substrate with dielectric constant 4.3, thickness of 1.6 mm, and size of $24{\times}41mm^2$. The measured impedance bandwidths (${\mid}S_{11}{\mid}{\leq}-10dB$) of fabricated antenna are 450 MHz (2.27 ~ 2.72 GHz) in 2.4 GHz band and 1340 MHz (4.79 ~ 6.13 GHz) in 5 GHz band which sufficiently satisfied with the IEEE 802. 11n standard in dual band. In particular, radiation patterns which are stable as well as relatively omni-direction could be obtained, and the gain of antennas in each band was 1.31 and 1.98 dBi respectively.

Electrical Characteristic of IGZO Oxide TFTs with 3 Layer Gate Insulator

  • Lim, Sang Chul;Koo, Jae Bon;Park, Chan Woo;Jung, Soon-Won;Na, Bock Soon;Lee, Sang Seok;Cho, Kyoung Ik;Chu, Hye Yong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.344-344
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    • 2014
  • Transparent amorphous oxide semiconductors such as a In-Ga-Zn-O (a-IGZO) have advantages for large area electronic devices; e.g., uniform deposition at a large area, optical transparency, a smooth surface, and large electron mobility >10 cm2/Vs, which is more than an order of magnitude larger than that of hydrogen amorphous silicon (a-Si;H).1) Thin film transistors (TFTs) that employ amorphous oxide semiconductors such as ZnO, In-Ga-Zn-O, or Hf-In-Zn-O (HIZO) are currently subject of intensive study owing to their high potential for application in flat panel displays. The device fabrication process involves a series of thin film deposition and photolithographic patterning steps. In order to minimize contamination, the substrates usually undergo a cleaning procedure using deionized water, before and after the growth of thin films by sputtering methods. The devices structure were fabricated top-contact gate TFTs using the a-IGZO films on the plastic substrates. The channel width and length were 80 and 20 um, respectively. The source and drain electrode regions were defined by photolithography and wet etching process. The electrodes consisting of Ti(15 nm)/Al(120 nm)/Ti(15nm) trilayers were deposited by direct current sputtering. The 30 nm thickness active IGZO layer deposited by rf magnetron sputtering at room temperature. The deposition condition is as follows: a rf power 200 W, a pressure of 5 mtorr, 10% of oxygen [O2/(O2+Ar)=0.1], and room temperature. A 9-nm-thick Al2O3 layer was formed as a first, third gate insulator by ALD deposition. A 290-nm-thick SS6908 organic dielectrics formed as second gate insulator by spin-coating. The schematic structure of the IGZO TFT is top gate contact geometry device structure for typical TFTs fabricated in this study. Drain current (IDS) versus drain-source voltage (VDS) output characteristics curve of a IGZO TFTs fabricated using the 3-layer gate insulator on a plastic substrate and log(IDS)-gate voltage (VG) characteristics for typical IGZO TFTs. The TFTs device has a channel width (W) of $80{\mu}m$ and a channel length (L) of $20{\mu}m$. The IDS-VDS curves showed well-defined transistor characteristics with saturation effects at VG>-10 V and VDS>-20 V for the inkjet printing IGZO device. The carrier charge mobility was determined to be 15.18 cm^2 V-1s-1 with FET threshold voltage of -3 V and on/off current ratio 10^9.

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