• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.63-63
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• 2010

Using both experimental and theoretical approaches, we have investigated the adsorption properties of an organic molecule (HATCN), which is used in OLEDs as an efficient hole injection layer, on metal and inert surfaces. We have also studied the structural and electronic properties of such interfaces and the dependences on deposition thickness. We have observed different trends in work function changes with different surfaces. Our photoelectron spectroscopic measurements have revealed an abnormal phenomenon in HATCN on a metal (Cu) surface: the work function decreases at lower coverage (~monolayer) of HATCN on a metal (Cu) surface, but it increases back and becomes higher than that of a bare Cu surface at higher coverage. It has, on the contrary, been observed that the work function of graphene surface just increases as the HATCN coverage increases. Our first-principles density functional calculations has not only verified our experimental observations, but also disclosed the underlying mechanism of such abnormal and different work function behaviors. We have found that the change in work function results from mutual polarization induced by the geometrical deformation and the bond dipole formed at the interface due to the charge redistribution. At low coverage of HAT-CN on Cu substrate, the former reduces the work function significantly by pulling down the vacuum level, while the latter tends to push up the vacuum level resulting in the work function increase.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.178-178
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• 2010

With the scaling down of ULSI(Ultra Large Scale Integration) circuit of CMOS(Complementary Metal Oxide Semiconductor)based electronic devices, the electronic devices become more faster and smaller size that are promising field of semiconductor market. However, very narrow line width has some disadvantages. For example, because of narrow line width, deposition of conformal and thin barrier is difficult. Besides, proportion of barrier width is large, thus resistance is high. Conventional PVD(Physical Vapor Deposition) thin films are not able to gain a good quality and conformal layer. Hence, in order to get over these side effects, deposition of thin layer used of ALD(Atomic Layer Deposition) is important factor. Furthermore, it is essential that copper atomic diffusion into dielectric layer such as silicon oxide and hafnium oxide. If copper line is not surrounded by diffusion barrier, it cause the leakage current and devices degradation. There are some possible methods for improving the these secondary effects. In this study, TaNx, is used of Tertiarybutylimido tris (ethylamethlamino) tantalum (TBITEMAT), was deposited on the 24nm sized trench silicon oxide/silicon bi-layer substrate with good step coverage and high quality film using plasma enhanced atomic layer deposition (PEALD). And then copper was deposited on TaNx barrier using same deposition method. The thickness of TaNx was 4~5 nm. TaNx film was deposited the condition of under $300^{\circ}C$ and copper deposition temperature was under $120^{\circ}C$, and feeding time of TaNx and copper were 5 seconds and 5 seconds, relatively. Purge time of TaNx and copper films were 10 seconds and 6 seconds, relatively. XRD, TEM, AFM, I-V measurement(for testing leakage current and stability) were used to analyze this work. With this work, thin barrier layer(4~5nm) with deposited PEALD has good step coverage and good thermal stability. So the barrier properties of PEALD TaNx film are desirable for copper interconnection.

• 한국진공학회지
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• 제17권1호
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• pp.46-50
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• 2008

Febry-Perot 프린지 패턴의 광 반사성을 가지고 있는 다공성 실리콘을 이용하여 암호화된 광학 이미지를 제작하였다. 암호화된 광학이미지 다공성 실리콘 샘플은 p-type 실리콘 웨이퍼 (boron-doped,<100> orientation, resistivity $0.8{\sim}1.2m{\Omega}-cm$)를 이용하여 빔 프로젝트의 광원과 전기화학적 식각을 통하여 만들어 졌다. 광학 이미지 다공성 실리콘 샘플은 전기화학적 식각과정에 빔 프로젝트의 광원에 의하여 톡특한 Febry-Perot 프린지 패턴을 나타낸다. 실리콘 웨이퍼의 광 반사성의 프린지 패턴을 퓨리에 변환을 통하여 유효광학두께를 측정하고 실리콘웨이퍼에 암호화 시킨 광학이미지를 제작하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.361.2-361.2
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• 2014

Transition metal dichalcogenides (MoS2, WS2, WSe2, MoSe2, NbS2, NbSe2, etc.) are layered materials that can exhibit semiconducting, metallic and even superconducting behavior. In the bulk form, the semiconducting phases (MoS2, WS2, WSe2, MoSe2) have an indirect band gap. Recently, these layered systems have attracted a great deal of attention mainly due to their complementary electronic properties when compared to other two-dimensional materials, such as graphene (a semimetal) and boron nitride (an insulator). However, these bulk properties could be significantly modified when the system becomes mono-layered; the indirect band gap becomes direct. Such changes in the band structure when reducing the thickness of a WS2 film have important implications for the development of novel applications, such as valleytronics. In this work, we report for the controlled synthesis of large-area (~cm2) single-, bi-, and few-layer WS2 using a two-step process. WOx thin films were deposited onto a Si/SiO2 substrate, and these films were then sulfurized under vacuum in a second step occurring at high temperatures ($750^{\circ}C$). Furthermore, we have developed an efficient route to transfer these WS2 films onto different substrates, using concentrated HF. WS2 films of different thicknesses have been analyzed by optical microscopy, Raman spectroscopy, and high-resolution transmission electron microscopy.

• 한국재료학회지
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• 제20권5호
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• pp.267-270
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• 2010

Sn doped $In_2O_3$ (ITO) and ITO/Cu/ITO (ICI) multilayer films were prepared on glass substrates with a reactive radio frequency (RF) magnetron sputter without intentional substrate heating, and then the influence of the Cu interlayer on the methanol gas sensitivity of the ICI films were considered. Although both ITO and ICI film sensors had the same thickness of 100 nm, the ICI sensors had a sandwich structure of ITO 50 nm/Cu 5 nm/ITO 45 nm. The ICI films showed a ten times higher carrier density than that of the pure ITO films. However, the Cu interlayer may also have caused the decrement of carrier mobility because the interfaces between the ITO and Cu interlayer acted as a barrier to carrier movement. Although the ICI films had two times a lower mobility than that of the pure ITO films, the ICI films had a higher conductivity of $3.6{\cdot}10^{-4}\;{\Omega}cm$ due to a higher carrier density. The changes in the sensitivity of the film sensors caused by methanol gas ranging from 50 to 500 ppm were measured at room temperature. The ICI sensors showed a higher gas sensitivity than that of the ITO single layer sensors. Finally, it can be concluded that the ICI film sensors have the potential to be used as improved methanol gas sensors.

• 한국재료학회지
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• 제9권7호
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• pp.735-739
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• 1999

본 연구에서는 sol-gel법으로 제조된 $PbTiO_3$ (PT) 단층박막내의 실시간 응력과 두께 수축거동, 그리고 다층박막의 미세경도를 온도의 함수로 측정하여 열처리에 따른 PT박막내의 물리화학적 변화를 설명하였다. 단층박막은 상온에서 $220^{\circ}C$까지 급격한 수축을 보였으며 총수축량의 83%가 이 온도구간에서 일어났다. as-spun된 박막 내에는 이미 75MPa의 인장응력이 존재하였으며 13$0^{\circ}C$부터 뚜렷이 증가하여 $250^{\circ}C$에서 147MPa의 최대 인장응력을 나타냈다. 인장응력의 급격한 감소가 일어나는 $370^{\circ}C$부터는 본격적으로 치밀화된 PT박막과 Si 기판과의 열팽창계수 차이가 주로 박막내의 응력을 결정하며, 이것은 다층박막의 미세경도가 $300^{\circ}C$ 이후에서 급격히 증가하는 사실로도 뒷받침된다. 한편 다층박막에서 단층박막과 달리 $550^{\circ}C$까지 열처리후 Perovskite 상이 많이 생성되었으며 이는 박막 두께의 증가에 따른 homogenous 핵생성 site의 증가 때문이라고 생각된다

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.420-423
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• 2003

[ $TiO_2$ ] thin films were fabricated by DC magnetron sputtering system at by controlling deposition times, ratios of $Ar:O_2$ partial presser ratio and substrate conditions. And the surface, cross-section morphology, microstructure, and composition ratio of the films were analyzed by FE-SEM, TEM and XPS. Besides, the optical absorption and transmittance of the $TiO_2$ films were measured by a UV-VIS-NIR Spectrophotometer, and photocatalytic properties were studied by G C Analyzer & Data Analysis system. As the result, when $TiO_2$ thin film was made at deposition time of 120[min] and $Ar:O_2$ ratio of 60:40, the best structural and optical properties among many thin films could be accepted. The best results of properties were as follows: thickness; $360{\sim}370[nm]$, grain size; 40[m], gap between two peak binding energy, $5.8{\pm}0.05[eV]$ ($2p_{3/2}$ peak and $2p_{1/2}$ peak of Ti was show at $458.3{\pm}0.05[eV]$ and $464.1{\pm}0.05[eV]$ respectively), binding energy; $530{\pm}0.05\;[eV]$, opticalenergy band gap; 3.4[eV].

• 한국산학기술학회논문지
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• 제6권1호
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• pp.58-63
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• 2005

레이저 용발법을 이용하여 폴리테트라플루오르에틸렌(PTFE: polytetrafluoroethylene) 박막을 증착하였다 사용한 레이저는 1064 nm Nd:YAG 레이저이고, 타겟은 그라파이트 분말이 도핑된 PTFE 펠릿(pellet) 이었다. 그라파이트는 포톤에너지를 효과적으로 흡수하여 열에너지로 전환시키고, 이 에너지를 인접한 PTFE에 전달한다. PTFE는 전달받은 열에너지에 의해서 열분해 된다. 타겟 표면에서 열분해에 의해 형성된 PTFE 단량체(monomer)들은 기판위에서 재중합반응(repolymerization)하여 필름을 형성하게 된다. 증착된 필름은 투명하고 결정화된 필름이었다. 주사전자현미경(SEM: scanning electron microscopy)과 원자현미경(AFM: atomic force microscopy)으로 분석한 결과, 필름의 표면은 박막의 두께가 증가할수록 섬유구조(fibrous structure)를 보였다. X선 광전자 분광기(XPS: X-ray photoelectron spectroscopy), 퓨리에 변화 적외선 분광기(FTIR: fouirer transform infrared spectroscopy)와 X선 회절분광기(XRD: X-ray diffraction)로 분석한 결과, 필름의 F/C 비는 1.7이고 분자축(molecular axis)은 기판과 나란했다.

• 한국산학기술학회논문지
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• 제17권2호
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• pp.259-264
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• 2016

본 논문에서는 코프래너 그라운드 도파관(CPWG)에 의해 급전되는 패치 안테나의 설계 방법 및 안테나 특성을 연구하였다. 안테나의 패치 길이, 폭, 위치를 조절하여 안테나와 CPWG 급전선이 임피던스 정합 되도록 하였다. 또한 안테나의 특성을 향상시키기 위해 CPWG 안테나의 설계 변수인 패치 길이. 패치 넓이, 패치 위치 및 그라운드 포지션에 따른 안테나 특성 변화를 HFSS 프로그램을 사용하여 안테나의 주파수 특성을 시뮬레이션 하였다. 이 결과를 바탕으로 1.8GHz LTE 대역에서 사용 가능한 CPWG 안테나를 설계하고, 설계 된 안테나를 유전율 4.4, 두께 0.8mm인 FR4-epoxy 기판을 사용 하여 포토리소그래피 방법으로 안테나를 제작하였다. 제작된 안테나는 최종적으로 회로망 분석기(Network Analyzer)를 통해 안테나 특성을 분석하였다. 측정된 안테나의 주파수 특성은 시뮬레이션 결과와 잘 일치하여 본 연구의 타당성을 확인 할 수 있었다. 제작된 CPWG 안테나는 중심주파수 1.80 GHz, 입력반사손실 -32.1 dB, 대역폭 22 MHz, 임피던스 $50.2{\Omega}$의 결과 값을 보였다. 본 연구에서 제안된 안테나는 LTE 대역에 응용이 가능할 것으로 기대된다.

• 한국분말재료학회지
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• 제18권3호
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• pp.226-237
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• 2011

W-ZrC and W-HfC composite powders were fabricated by the Plasma Alloying & Spheroidization (PAS) method and the powders were sprayed into hybrid coating layers by using Low Vacuum Plasma Spray (LVPS) process, respectively. Microstructure, mechanical properties, and ablation characteristics of the fabricated coating layers were investigated. The LVPS process led to successful production of W-Carbide hybrid coatings, approximately 400 ${\mu}M$ or above in thickness. As the substrate preheating temperature increased from $870^{\circ}C$ to $917^{\circ}C$, the hardness of the W-ZrC coating layer increased due to decreased porosity. Vickers hardness showed higher value (about 108.4 HV) in W-ZrC hybrid coating material compared to that of W-HfC while adhesive strength was found to be similar in both coating layers. The plasma torch test revealed good ablation resistance of the W-Carbide hybrid coating layers. The relatively high performance W-ZrC coating layer at the elevated temperature is thought to be attributed to both the strengthening effect of ZrC particle remained in the layer and the formation of ZrO2 phase with high temperature stability.