• Journal of the Korean institute of surface engineering
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• v.36 no.4
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• pp.307-316
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• 2003

Salt spray, CASS(copper accelerated acetic salt spray) and EC(electrolytic corrosion) tests were performed in order to evaluate the corrosion resistance of plated Ni and Ni-Cr layers on Fe substrate. Compared with the conventional methods such as salt spray and CASS, the electrochemical method such as EC test may be beneficial in terms of test time span and quantitative accuracy. Furthermore, EC test can also become the alternative method to evaluate the resistance to corrosion of coatings by measuring the corrosion potentials of the coated layers in the electrolyte during the off-time of EC cycles. Compared with the corrosion potentials of pure iron, nickel, chromium, those potentials of coated layers can be used to anticipate the extent of corrosion. Results showed that in terms of the test time span, EC test gave 14 times and 21 times faster results than the salt spray test in cases of $5\mu\textrm{m}$ Ni and $20\mu\textrm{m}$ Ni plated layers, respectively. In addition, EC test also offered the shorter test time span than CASS test in cases of $5 \mu\textrm{m}$ Ni + $0.5\mu\textrm{m}$ Cr, and $20\mu\textrm{m}$ Ni + $0.5\mu\textrm{m}$ Cr on Fe substrate by 78 times and 182 times, respectively. Therefore, EC test can be regarded as the better method to evaluate the resistance to corrosion of coated layers than the conventional methods such as salt spray and CASS.

• Korean Journal of Metals and Materials
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• v.46 no.5
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• pp.321-327
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• 2008

Cu based amorphous ($Cu_{54}Zr_{22}Ti_{18}Ni_6$) coating was produced by cold spraying as a new fabrication process. The microstructure and macroscopic properties of amorphous coating layer was investigated and compared with those of cold sprayed pure Cu coating. Amorphous powders were prepared by gas atomization and Al 6061 was used as the substrate plate. X-ray diffraction results showed that Cu based amorphous powder could be successfully deposited by cold spraying without any crystallization. The Cu based amorphous coating layer ($300{\sim}400{\mu}m$ thickness) contained 4.87% porosity. The hardness of Cu based amorphous coating represented $412.8H_v$, which was correspond to 68% of the hardness of injection casted bulk amorphous material. The wear resistance of Cu based amorphous coating was found to be three times higher than that of pure Cu coating. The 3-point bending test results showed that the adhesion strength of Cu based amorphous coating layer was higher than that pure Cu coating. It was also observed that hard Cu base amorphous particle could easily deform soft substrate by particle collisions and thus generated strong adhesion between coating and substrate. However, the amorphous coating layer unexpectedly represented lower corrosion resistance than pure Cu coating, which might be resulted from the higher content of porosity in the cold sprayed amorphous coating.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

• Korean Journal of Metals and Materials
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• v.47 no.5
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• pp.322-329
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• 2009

60 nm- and 20 nm-thick hydrogenated amorphous silicon (a-Si:H) layers were deposited on 200 nm $SiO_2/Si$ substrates using ICP-CVD (inductively coupled plasma chemical vapor deposition). A 10 nm-Ni layer was then deposited by e-beam evaporation. Finally, 10 nm-Ni/60 nm a-Si:H/200 nm-$SiO_2/Si$ and 10 nm-Ni/20 nm a-Si:H/200 nm-$SiO_2/Si$ structures were prepared. The samples were annealed by rapid thermal annealing for 40 seconds at $200{\sim}500^{\circ}C$ to produce $NiSi_x$. The resulting changes in sheet resistance, microstructure, phase, chemical composition and surface roughness were examined. The nickel silicide on a 60 nm a-Si:H substrate showed a low sheet resistance at T (temperatures) >$450^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate showed a low sheet resistance at T > $300^{\circ}C$. HRXRD analysis revealed a phase transformation of the nickel silicide on a 60 nm a-Si:H substrate (${\delta}-Ni_2Si{\rightarrow}{\zeta}-Ni_2Si{\rightarrow}(NiSi+{\zeta}-Ni_2Si)$) at annealing temperatures of $300^{\circ}C{\rightarrow}400^{\circ}C{\rightarrow}500^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate had a composition of ${\delta}-Ni_2Si$ with no secondary phases. Through FE-SEM and TEM analysis, the nickel silicide layer on the 60 nm a-Si:H substrate showed a 60 nm-thick silicide layer with a columnar shape, which contained both residual a-Si:H and $Ni_2Si$ layers, regardless of annealing temperatures. The nickel silicide on the 20 nm a-Si:H substrate had a uniform thickness of 40 nm with a columnar shape and no residual silicon. SPM analysis shows that the surface roughness was < 1.8 nm regardless of the a-Si:H-thickness. It was confirmed that the low temperature silicide process using a 20 nm a-Si:H substrate is more suitable for thin film transistor (TFT) active layer applications.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1795-1796
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• 1999

ITO thin films have been deposited on PET substrate by reactive dc magnetron sputtering without substrate heater and post heat treatment. The electrical and optical properties of as-deposited films are dominated by oxygen gas ratio. As the experimental results, the excellent ITO films are prepared on PET substrate at the operating conditions as follows: operating pressure of 5 mTorr, target-substrate distance of 4.5 cm, dc power of $20{\sim}30W$, and oxygen gas ratio of 10 %. The optical transmittance is above 80 % at 550 nm, and the sheet resistance and resistivity of films are $24{\Omega}$/square and $1.5{\times}10^{-3}{\Omega}cm$, respectively.

• Journal of Korea Society of Industrial Information Systems
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• v.7 no.5
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• pp.147-153
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• 2002

In this paper, a substrate network model to be used with BSIM3 MOSFET model for submicron MOSFETs in giga hertz frequencies and its direct parameter extraction with physically meaningful values are proposed. The proposed substrate network model includes a conventional resistance and single inductance originated from ring-type substrate contacts around active devices. Model parameters are extracted from S-parameter data measured from common-bulk configured MOS transistors with floating gate and use where needed without any optimization process. The proposed modeling technique has been applied to various-sized MOS transistors. The substrate model has been validated for frequency up to 300Hz.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.633-636
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• 2006

GE has developed a plastic substrate technology comprised of a superior high-heat polycarbonate substrate film and a unique transparent coating package that provides the ultrahigh barrier to moisture and oxygen, and chemical resistance to solvents used in device fabrication. This contribution will update recent progresses made at GEFlexible Ultra-high Gas Barrier Substrate for Organic Electronics on ultra-high barrier coated plastic substrate, both in batch mode and in roll-to-roll mode

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.11
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• pp.1597-1604
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• 2002

In this study, numerical investigation has been performed on the impingement, spreading and solidification of a coating material droplet impacting onto a solid substrate in the thermal spray process. The numerical model is validated through the comparison of the present numerical result with experimental data fer the flat substrate without surface defects. An analysis of deposition formation on the non-polished substrate with surface defects is also performed. The parametric study is conducted with various surface defect sizes and shapes to examine the effect of surface defects on the impact and solidification of the liquid droplet on the substrate.

• Journal of the Korean institute of surface engineering
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• v.28 no.6
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• pp.343-351
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• 1995

Titanium nitride films have been prepared on various substrates (silicon wafer, HSS) by cathode arc ion plating process to measure microhardness, adhesion and wear-resistant behaviors by changing the substrate bias voltages (0∼-300V), thickness and roughness. Microhardnesses were measured by micro vickers hardness tester, the adhesion strengths were evaluated by acoustic signals through the scratch test with incremental applied load. As the substrate bias voltages were increased, the ｛111｝ orientation was predominant, the microhardnesses and adhesion strengths of tool steel were observed to be stronger than those of without subatrate bias voltage. Adhesion strengths of the substrate bias were 4-7 times higher than those of without the substrate bias, confirmed by SEM with EDX. Wear resistances were used pin-on-disk tribotester and TiN costing reduced the abrasive wear. As the substrate bias was increased, the weight loss and the friction coefficient was decreased.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.671-676
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• 1999

ITO (indium tin oxide) thin films on PET (polyethylene terephthalate) substrate have been deposited by a dc reactive magnetron sputtering without heat treatments such as substrate heater and post heat treatment. Each sputtering parameter during the sputtering deposition is an important factor for the high quality of ITO thin films deposited on polymeric substrate. Particularly, the material, electrical and optical properties of as-deposited ITO oxide films are dominated by the ratio of oxygen partial pressure. As the experimental results, the excellent ITO films are prepared on PET substrate at the operating conditions as follows : operating pressure of 5 mTorr, target-substrate distance of 45mm, do power of 20~30W, and oxygen gas ratio of 10%. The optical transmittance is above 80% at 550 nm, and the sheet resistance and resistivity of films are 24 Ω/square and $1.5\times$10$^{-3}$ Ωcm, respectively.