• Korean Journal of Optics and Photonics
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• v.22 no.4
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• pp.170-178
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• 2011

The spectroscopic ellipsometric constants are analyzed to determine the thickness and the complex refractive index of a film coated on a semi-transparent substrate, with the reflection from the backside of the substrate properly considered. Expressions representing the effect of the backside reflection on ellipsometric constants are derived using the thickness and the complex refractive index of the substrate. The thickness and the complex refractive of an ITO thin film coated on a glass substrate are obtained by using this method. The results agree quite well with the ones obtained by following the conventional modeling procedure where the backside reflection is neglected during ellipsometric measurement and analysis.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.3
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• pp.189-192
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• 2001

A simple metal-insulator-metal (MIM) capacitor in a standard $0.25{\;}\mu\textrm{m}$ digital CMOS process is described. Using all six interconnect layers, this capacitor exploits both the lateral and vertical electrical fields to increase the capacitance density (capacitance per unit area). Compared to a conventional parallel plate capacitor in the four upper metal layers, this capacitor achieves lower parasitic substrate capacitance, and improves the capacitance density by a factor of 4. Measurements and an extracted model for the capacitor are also presented. Calculations, model and measurements agree very well.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.75-79
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• 2013

A power distribution network (PDN) is a network that provides connection between the voltage source supply and the power/ground terminals of a microprocessor chip. It consists of a voltage regulator module, a printed circuit board, a package substrate, a microprocessor chip as well as decoupling capacitors. For power integrity analysis, the board and package layouts have to be transformed into an electrical network of resistor, inductor and capacitor components which may be expressed using the S-parameters models. This modeling process generally takes from several hours up to a few days for a complete board or package layout. When the board and package layouts change, they need to be re-extracted and the S-parameters models also need to be re-generated for power integrity assessment. This not only consumes a lot of resources such as time and manpower, the task of PDN modeling is also tedious and mundane. In this paper, a block-based PDN modeling is proposed. Here, the board or package layout is partitioned into sub-blocks and each of them is modeled independently. In the event of a change in power rails routing, only the affected sub-blocks will be reextracted and re-modeled. Simulation results show that the proposed block-based PDN modeling not only can save at least 75% of processing time but it can, at the same time, keep the modeling accuracy on par with the traditional PDN modeling methodology.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.59-63
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• 2013

In this paper, the impact of the copper densities of substrate layers on IC package warpage is studied experimentally and numerically. The substrate strips used in this study contained two metal layers, with the metal densities and patterns of these two layers varied to determine their impacts. Eight legs of substrate strips were prepared. Leg 1 to leg 5 were prepared with a HD (high density) type of strip and leg 6 to leg 8 were prepared with UHD (ultra high density) type of strip. The top copper metal layer was designed to feature meshed patterns and the bottom copper layer was designed to feature circular patterns. In order to consider the process factors, the warpage of the substrate bottom was measured step by step with the following manufacturing process: (a) bare substrate, (b) die attach, (c) applying mold compound (d) and post reflow. Furthermore, after the post reflow step, the substrate strips were diced to obtain unit packages and the warpage of the unit packages was measured to check the warpage trends and differences. The experimental results showed that the warpage trend is related to the copper densities. In addition to the experiments, a Finite Element Modeling (FEM) was used to simulate the warpage. The nonlinear material properties of mold compound, die attach, solder mask, and substrate core were included in the simulation. Through experiment and simulation, some observations were concluded.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.39 no.1
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• pp.49-57
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• 2002

Including RF Package inductance, substrate coupling through conductive silicon(Si)-substrate is modeled and quantitatively characterized. 2-port substrate coupling model is extended for the characterization of multi-port substrate coupling between digital circuit block and analog/RF circuit block. Furthermore, scalable parameter extraction model is developed. Multi-port substrate coupling can be investigated by linearly superposing a frequency-dependent 2-port substrate coupling model using scalable parameters. In addition, Substrate coupling including RF package inductance effect is quantitatively investigated. It is shown that package effect increases substrate coupling and shifts a characteristic frequencies(i.e., poles) to the higher frequency range. The proposed methodology can be efficiently used to the mixed-signal circuit performance verification.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.9
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• pp.909-913
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• 2013

Various types of large substrate handling robots are used in the thin file solar cell manufacturing line as well as LCD or PDP production line. Because the robot handles the heavy substrate at high speed, there are some issues such as vibration control and the optimal design of arms and forks. As the substrate becomes larger and heavier, robot systems are also larger and the vibration issue of the robot end-effector becomes more important. In the paper, we established the robot modeling and the control architecture including the flexible part such as forks. Then, we performed dynamic simulation in the various condition and analyzed the characteristics of the fork vibration. We can reduce the vibration using the trajectory planning and input shaping algorithm and it was proved by experiment.

• Korean Journal of Optics and Photonics
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• v.35 no.1
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• pp.1-8
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• 2024

Explicit expressions for the transmission pseudo-ellipsometric constants and transmittance of a semi-transparent glass substrate coated with thin films are presented to determine the optical constants of a very weakly absorbing thin film coated on a glass substrate. The intensity of the multiply reflected light inside the semi-transparent substrate is superposed incoherently and the light absorption by the substrate is properly treated, so that modeling analysis of thin films coated on a semi-transparent substrate can be performed with increased accuracy. The extinction coefficient derived from transmittance analysis is compared to that from ellipsometric analysis in the weakly absorbing region, and the difference between the two extinction coefficients is discussed in relation to the sensitivities of the transmittance and ellipsometric constants. This transmittance analysis, together with ellipsometric analysis, is applied to a glass substrate coated with a SiN thin film, and it is shown that the thickness and complex refractive index of the SiN thin film can be determined accurately, even though the extinction coefficient is very small.

• Transactions of Materials Processing
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• v.13 no.1
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• pp.39-44
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• 2004

Transcribability of pit or land groove structures in replicating an optical disk substrate greatly affects the performance of a high-density optical disk. However, a solidified layer, generated during the polymer filling, deteriorates transcribability because the solidified layer prevents the polymer melt from filling the sub-micro patterns. Therefore, the development of the solidified layer during filling stage of injection molding must be delayed. For this delay, passive heating by insulation layer has been used. In the present study, to examine the development of the solidified layer delayed by passive heating, the flow of polymer melt with passive heating was analyzed. Passive heating markedly delayed the development of the solidified layer, reduced the viscosity of the polymer melt, and increased the fluidity of the polymer melt in the vicinity of the stamper surface with the sub-micro patterns. As a result, we predict that passive heating can improve transcribability of an optical disk substrate. To verify our prediction, we fabricated an optical disk substrate by using passive heating of a mold and measured the transcribability of an optical disk substrate.

• Journal of Korean Society of Water and Wastewater
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• v.25 no.6
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• pp.971-979
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• 2011

Palm Oil Mill Effluent (POME) is the mixed organic wastewater generated from palm oil industry. In this study, kinetic analysis with treating POME in an anaerobic hybrid reactor (AHR) was performed. Therefore, the AHR was monitored for its performances with respect to the changes of COD concentrations and hydraulic retention time (HRT). Batch tests were performed to find out the substrate removal kinetics by granular sludge from POME. Modified Stover Kincannon, First-order, Monod, Grau second-order kinetic models were used to analyze the performance of reactor. The results from the batch test indicate that the substrate removal kinetics of granular sludge is corresponds to follow Monod's theory. However, Grau second-order model were the most appropriate models for the continuous test in the AHR. The second order kinetic constant, saturation value constant, maximum substrate removal rate, and first-order kinetic constant were 2.60/day, 41.905 g/L-day, 39.683 g/L-day, and 1.25/day respectively. And the most appropriate model was Grau second-order kinetic model comparing the model prediction values and measured COD concentrations of effluent, whereas modified Stover-Kincannon model showed the lowest correlation.

• Journal of Microbiology and Biotechnology
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• v.22 no.12
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• pp.1758-1766
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• 2012

An extensive investigation was carried out to describe the kinetics of cell growth, substrate consumption, and product formation in the batch fermentation using starch as substrate. Evaluation of intrinsic kinetic parameters was carried out using a best-fit unstructured model. A nonlinear regression technique was applied for computational purpose. The Andrew's model showed a comparatively better $R^2$ value among all tested models. The values of specific growth rate (${\mu}_{max}$), saturation constant ($K_S$), inhibition constant ($K_I$), and $Y_{X/S}$ were found to be 0.109 $h^{-1}$, 11.1 g/l, 0.012 g/l, and 1.003, respectively. The Leudeking-Piret model was used to study the product formation kinetics and the process was found to be growth-associated. The growth-associated constant (${\alpha}$) for protease production was sensitive to substrate concentration. Its value was fairly constant up to a substrate concentration of 30.8 g/l, and then decreased.