• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.113-119
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• 2022

In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.

• Journal of the Korean Society of Industry Convergence
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• v.20 no.4
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• pp.307-311
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• 2017

Ultra short pulse laser processing with the PI (polyimide) substrate is conducted to increase flexibility and radius of curvatures. A femtosecond laser is used to perform micro machining by minimizing the heat effect in PI substrate. The laser processing according to the parameters, such as fabricated line width, depth, laser power, distance between lines, is carried out to understand the characteristics of fabricated lines. A bending test is carried out to evaluate bending shapes and the radius of curvature after bending and spreading it 1000 times. The results demonstrates that the radius of curvature decreases in deepen lines and increases with the augment of the number of the fabricated lines, and distance between lines.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.400.2-400.2
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• 2016

Dye-sensitized solar cells (DSSCs) have been widely investigated as a next generation solar cell because of their simple structure and low manufacturing cost. To realize a commercially competitive technology of DSSCs, it is imperative to employ a technique to prepare nanocrystlline thin film on the flexible organic substrate, aiming at increasing the flexibility and reducing the weight as well as the overall device thickness of DSSCs. The key operation of glass-to-plastic substrates conversion is to prepare mesoporous TiO2 thin film at low temperature with a high surface area for dye adsorption and a high degree of crystallinity for fast transport of electrons. However, the electron transport in the TiO2 film synthesized at low temperature is very poor. So, in this study, TiO2 films synthesized at high temperature were transferred on the selective substrate. We fabricated DSSCs at low temperature using this method. So, we confirmed that the performance of DSSCs using TiO2 films synthesized at high temperature was improved.

• Journal of Microbiology and Biotechnology
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• v.28 no.4
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• pp.561-565
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• 2018

The late-stage doxorubicin biosynthesis pathway acting enzyme (DoxA) from Streptomyces peucetius CYP129A2 exhibited substrate promiscuity towards the stilbene group of compounds such as resveratrol. DoxA along with two accessory enzymes ferrdoxin reductase and ferredoxin from spinach hydroxylated resveratrol at the 3'-position in vitro to produce piceatannol. The product was identified by HPLC-PDA and high-resolution HR-qTOF-ESI/MS analyses in positive mode. The ESI/MS fragments resembled the hydroxylated product of resveratrol.

• Journal of Institute of Control, Robotics and Systems
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• v.17 no.2
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• pp.131-134
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• 2011

In this study, we propose an optimal design and new fabrication method for a slim tactile sensor. Slim tactile sensor can detect 3-axial forces and has suitable flexibility for intelligent robot fingers. To amplify the contact signal, a unique table-shaped structure was attempted. A new layer-by-layer fabrication process for polymer micromachining that can make a 3D structure by using a sacrificial layer was proposed. A table-shaped epoxy sensing plate with four legs was built on top of a flexible polymer substrate. The plate can convert an applied force to a concentrated stress. Normal and shear forces can be detected by combining responses from metal strain gauges embedded in the polymer substrate. The optimal positions of the strain gauges are determined using the strain distribution obtained from finite element analysis.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1075-1078
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• 2005

A UV-cured adhesive with a low $T_g$ below the room temperature was used as a substrate for manufacturing a film-like liquid crystal display. This film-like LCD shows a fully flexibility due to the low $T_g$ property, and the manufacture processes are roll-to-roll compatible due to the coating processes.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.441-441
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• 2014

The characteristics of hybrid conductive films based on multilayer graphene and silver grid have been investigated for the high-performance and flexible organic solar cells. The hybrid conductive films have been prepared on glass and polyethylene terephthalate (PET) substrates using conventional photolithography process and transfer process of graphene. The optical and electrical properties of prepared conductive films show transmittance of 87% at 550nm and sheet resistance of $28{\Omega}/square$. The electromechanical properties were also investigated in detail to confirm the flexibility of the hybrid films. OSCs have been fabricated on the hybrid conductive films based on graphene and silver grid on glass substrate. The power conversion efficiency of 2.38%, a fill factor of 51%, an open circuit voltage of 0.58V and a short circuit current of $8.05mA/cm^2$ were obtained from the device on glass substrate. The PCE was enhanced 11% compared with OSCs on the MLG films without silver grid.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.452-455
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• 2007

This paper provides an overview on the characteristics of a-SiC:H barrier film deposited for flexible display applications. Key characteristics such as high crack resistance, high thermal/hydro stability, excellent adhesion to the polymer substrate, as well as very low permeance has been demonstrated. The excellence of this barrier film has been shown from competitive analysis compared with other barrier coating materials. Finally, flexible Polymer Light Emitting Diode (PLED) test pixels have been fabricated on the barrier coated plastic substrate, demonstrating the viability of the device with lifetime data.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.4
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• pp.443-447
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• 2004

In this study, we investigated the necessity of encapsulation layer to maximize flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer han a significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that han a significant effect on internal thermal stress. To compare the magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.41-45
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• 2015

RtMLF (Routable Molded Lead Frame) based on molded substrate has been developed to maximize advantages of both leadframe product which has high thermal and electrical performance and laminate product which accommodates more I/O count and keeps fan-in/fan-out design flexibility. Due to its structural features, RtMLF provided excellent thermal and electrical performance which was confirmed with simulation. The RtMLF samples were manufactured and its reliability analysis was done to evaluate the opportunities of the production and application.