• Transactions of Materials Processing
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• v.18 no.6
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• pp.476-481
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• 2009

The present work demonstrates the mechanical and electrical responses of submicrocrystalline Cu-3%Ag alloy as a function of strain imposed by equal channel angular pressing(ECAP). From transmission electron microscope observation, the resulting microstructures of Cu-3%Ag alloy deformed by ECAP for 8-pass or more consist of reasonably fine, equiaxed grains without having a strong preferred orientation, suggesting that microstructure evolution is slower than that of pure-Al and its alloys owing to low stacking fault energy. The results of room temperature tension tests reveal that, as the amount of applied strain increases, the tensile strength of submicrocrystalline Cu-3%Ag alloy increases whereas losing both the ductility and the electrical conductivity. Such phenomenon can be explained based on microstructure featured by the non-equilibrium grain boundaries.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.427-430
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• 2008

The influence of subsequent annealing treatment on the dynamic deformation and the fracture behavior of submicrocrystalline Al-4.4%Mg alloy is investigated in this study. After inducing an effective strain of 8 via equal-channel angular pressing at $200^{\circ}C$, most of the grains are considerably reduced to nearly equiaxed grains of $0.3{\mu}m$ in size. With an increment of various subsequent heat treatments for 1 hour, resultant microstructures are found to be fairly stable at temperatures up to $200^{\circ}C$, suggesting that static recovery will be dominantly operative, whereas grain growth is pronounced above $250^{\circ}C$. The results of tensile tests show that yield and ultimate tensile strength decrease, but elongation-to-failure and strain hardening rate increase with an increase in annealing temperatures. The dynamic deformation and the fracture behavior retrieved with a series of torsional tests are explored with respect to annealed microstructures. Such mechanical response is analyzed in relation to resultant microstructure and fracture mode.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.328-331
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• 2009

Microstructural evolution of alpha and beta phases during dynamic globularization of near-beta Ti-13Nb-13Zr alloy was investigated to determine the optimum processing conditions. The submicrocrystalline alloy sheet with ${\sim}80%$ of high-angle grain boundaries was produced utilizing dynamic globularization at temperature of $600^{\circ}C$, equivalent strain rate of $10^{-1}\;s^{-1}$ and strain of 1.4. The refined structure with the gain size of ${\sim}0.4{\mu}m$ showed 25-60% enhanced mechanical compatibility as compared to those of the conventional mill-annealed or solution treated and aged microstructures.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.413-416
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• 2009

The paper deals with the mechanical and electrical responses of submicrocrystalline Cu-3%Ag alloy as a function of strain imposed by equal-channel angular pressing. When inducing the effective strain of 12, the initial grain site of ${\sim}50{\mu}m$ is evidently reduced within the range of $0.2-0.3{\mu}m$ in size, having a reasonably equiaxed shape. The results of tension tests at room temperature exhibit that the tensile strength of the present alloy increases with increasing the amount of strain whereas losing electrical conductivity slightly. This phenomenon can be explained based on fine grained structure together with the non-equilibrium state of grain boundaries.