• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.1003-1006
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• 2003

본 논문에서는 sub-micron 소자에서 SCE(Short Channel Effect) 억제를 위한 Halo 와 SSR(Super Steep Retrograde Well) 적용에 따른 analog 특성의 열화를 석하고 이를 개선하기 위해 Twist 이온주입과 In, Sb Halo 를 채택하였다. Analog 특성은 CMOS 의 amplifier 과 Comparator 로의 사용을 고려해 Drain Rout과 Early voltage를 이용해 나타내었으며 Digital 성능을 함께 고려하였다. 실험결과 NMOS 의 경우 45 twist Halo 조건에서, PMOS의 경우 As보다 Sb를 Halo 로 적용하는 경우 더 우수한 analog 특성을 나타내었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.203-206
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• 2001

This paper presents a straightness measurement system for flat and long workpieces. The measurement system consists of a laser optical unit, a CCD camera and processing system, and a carrier system with a stylus. The carrier system accompanies the stylus, which displaces a retroreflector along the surface profile. The optical unit is used to optically amplify the displacement of retroreflector. The CCD camera and processing system finally identifies the vertical displacement of the stylus unit. The developed system is applied to two surfaces: ground surface and LM guide surface. The experimental results show that the developed system can measure the straightness of flat surfaces within sub-micron error.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.8 s.173
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• pp.42-49
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• 2005

Our purpose is to develop a precision magnetic displacement sensor that has sub-micron resolution and small size probe. To achieve this, we first have tried to establish mathematical models of a magnetic sensor in this paper. The inductance model that presents basic measuring principle of a magnetic sensor is based on equivalent magnetic circuit method. Especially we have concentrated on modeling of magnetic flux leakage and magnetic flux fringing. The induced model is verified by experimental results. The model, including the magnetic flux leakage and flux fringing effects, is in good agreement with the experimental data. Subsequently, based on the augmented model, we will design magnetic sensor probe in order to obtain high performances and to scale down the probe.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.05a
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• pp.496-503
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• 2001

The suspension of the optical pickup actuator is damped by the presence of silicone rubber damper bond at its termination. In spite of the presence of it, the actuator still exhibits a strong mechanical resonance which affects its settling time and vibrational characteristics. This resonance can cause errors in reading information from the disk, particularly in high speed CD-ROM and DVD-ROM drives. Ferrofluids are stable colloidal suspensions of sub-micron sized magnetic particles in a carrier liquid. In the actuator design, ferrofluid is applied to the surface of the magnets until the quantity is sufficient to maintain intimate contact with the bobbin/carrier assembly. The fluid is retained in the magnetic field and its viscosity provides the desired mechanical damping to the moving assembly, improving the actuators settling time and vibrational characteristics. Access time is also improved, particularly on warped or eccentric discs.

• 제어로봇시스템학회:학술대회논문집
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• 1995.10a
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• pp.79-82
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• 1995

The problem of temperature control for rapid thermal processing (RTP) in semiconductor manufacturing is discussed in this paper. Among sub=micron technologies for VLSI devices, reducing the junction depth of doped region is of great importance. This paper investigates existing methods for manufacturing wafers, focusing on the RPT which is considered to be good for formation of shallow junctions and performs the wafer fabrication operation in a single chamber of annealing, oxidation, chemical vapor deposition, etc., within a few minutes. In RTP for semiconductor manufacturing, accurate and uniform control of the wafer temperature is essential. In this paper, a robustr controller is designed using a recently developed optimization technique. The controller designed is then tested via computer simulation and compared with the other results.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2000.04a
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• pp.167-170
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• 2000

Recently the sub-micron structured substrates of 0.74 ${mu}ell$ track pitch and 800 $\AA$groove depth are required for DVD-RAM and the track pitch is expected to be narrower as the need for the information storage density is getting higher. For the accurate replication of the land-groove structure in the stamper to the plastic substrates it is important to control the injection -compression molding process such that the integrity of the replication for the land-groove structure is maximized. in the present study polycarbonate substrates were fabricated by injection comression molding and the land-groove structure regarded as one of mold temperature and the compression pressure on the integrity of the replication were examined experimentally. An efficient design methodology using the response surface method (RSM) the central composite design(CCD) technique and the analysis-of-variance (ANOVA) was developed to obtain the optimum processing conditions which maximize the integrity of the replication with a limited number of experiments.

• The Bulletin of The Korean Astronomical Society
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• v.35 no.1
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• pp.91.1-91.1
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• 2010

Despite a surface dominated by carbon-based life, the bulk composition of the Earth is dramatically carbon poor when compared to the material available at formation. Bulk carbon deficiency extends into the asteroid belt representing a fossil record of the conditions under which planets are born. The initial steps of planet formation involve the growth of primitive sub-micron silicate and carbon grains in the Solar Nebula. We present a solution wherein primordial carbon grains are preferentially destroyed by oxygen atoms ignited by heating due to stellar accretion at radii < 5 AU. This solution can account for the bulk carbon deficiency in the Earth and meteorites, the compositional gradient within the asteroid belt, and for growing evidence for similar carbon deficiency in rocks surrounding other stars.

• International Journal of Control, Automation, and Systems
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• v.6 no.3
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• pp.386-393
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• 2008

A position control method for interpolating aspherical grinding and polishing tool path was reviewed and experimented in a nano precision machine. The position-base algorithm was reformed from the time-base algorithm, proposed in the previous study. The characteristics of the algorithm were in the velocity control loop with position feedback. The aspherical surface was divided by an interval at which each velocity and acceleration were calculated. The theoretical velocity was corrected by position error during processing. In the experiment, a machine was constructed and nano-scale linear encoders were installed at each axis. Relation between process parameters and the variation of position error was monitored and discussed. The best result from optimized parameters showed that the accuracy was 150nm and improved from the previous report.

• Progress in Superconductivity and Cryogenics
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• v.17 no.4
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• pp.1-7
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• 2015

This paper addresses technical problems of thermal contact conductance or resistance which inevitably occurs in most cryogenic engineering systems. The main focus of this paper is to examine what kind of physical factors primarily influences the thermal contact resistance and to suggest how it can be minimized. It is a good practical rule that the contact surface must have sub-micron roughness level with no oxide layer and be thinly covered by indium, gold, or Apiezon-N grease for securing sufficient direct contact area. The higher contact pressure, the lower the thermal contact resistance. The general description of this technique has been widely perceived and reasonable engineering results have been achieved in most applications. However, the detailed view of employing these techniques and their relative efficacies to reduce thermal contact resistances need to be thoroughly reviewed. We should consider specific thermal contact conditions, examine the engineering requirements, and execute each method with precautions to fulfil their maximum potentials.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.89-92
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• 2004

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). we investigated the performance of $WO_3$ CMP used silica slurry, ceria slurry, tungsten slurry. In this paper, the effects of addition oxidizer on the $WO_3$ CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity.