• Title/Summary/Keyword: structural detail

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Seismic Performance of HyFo Beam with High Depth-to-SRC Column Connections (춤이 큰 하이브리드 합성보와 SRC기둥 접합부의 내진성능에 관한 연구)

  • Kim, Sung Bae;Jeon, Yong Han;Cho, Seong Hyun;Choi, Young Han;Kim, Sang Seup
    • Journal of Korean Society of Steel Construction
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    • v.29 no.2
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    • pp.135-145
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    • 2017
  • This study is a secondary study that is a cyclic seismic test of High depth hybrid composite beam and column connection after the primary bending strength test of a high depth Hybrid composite beam. Total of 3 seismic test specimens were prepared to cyclic test. The bracket and beam web spliced by high strength bolt and the bracket and beam upper flange was spliced by welding. Test results showed that the seismic strength was higher than the plastic moment($M_p$) in the positive negative moment section, the requirement of composite intermediate moment frame wes satisfied. Therefore, the requirement of intermediate moment frame can be secured by applying the details of connection of this study results.

Numerical study on the mitigation of rain-wind induced vibrations of stay cables with dampers

  • Li, Shouying;Wu, Teng;Li, Shouke;Gu, Ming
    • Wind and Structures
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    • v.23 no.6
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    • pp.615-639
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    • 2016
  • Although the underlying mechanism of rain-wind induced vibrations (RWIVs) of stay cables has not been fully understood, some countermeasures have been successfully applied to mitigating this kind of vibration. Among these, installing dampers near the bridge deck was widely adopted, and several field observations have shown its effectiveness. In this study, the effectiveness of dampers to RWIVs of stay cables is numerically investigated comprehensively by means of finite difference method (FDM). Based on the free vibration analysis of a taut string, it is found that the 3-points triangle scheme, which can be easily implemented in FDM, can offer an excellent approximation of the concentrated damping coefficient (expressed as a Dirac delta function) at the location where the damper is installed. Then, free vibration analysis of a 3-D continuous stay cable attached with two dampers is carried out to study the relationship of modal damping ratio and damping coefficient of the dampers. The effects of orientation of the dampers and cable sag on the modal damping ratio are investigated in detail. Finally, the RWIV response of a 3-D continuous stay cable attached with two dampers is examined. The results indicate that 0.5% of damping ratio is sufficient to reduce the RWIV vibration of the Cable A20 on the No.2 Nanjing Bridge over Yangtze River.

Behavior of improved through-diaphragm connection to square tubular column under tensile loading

  • Qin, Ying;Zhang, Jing-Chen;Shi, Peng;Chen, Yi-Fu;Xu, Yao-Han;Shi, Zuo-Zheng
    • Structural Engineering and Mechanics
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    • v.68 no.4
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    • pp.475-483
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    • 2018
  • Square tubular columns are commonly used in moment resisting frames, while through-diaphragm connection is the most typical configuration detail to connect the H-shaped beam to the column. However, brittle fracture normally occurs at the complete joint penetration weld between the beam flange and the through-diaphragm due to the stress concentration caused by the geometrical discontinuity. Accordingly, three improved types of through-diaphragm are presented in this paper to provide smooth force flow path comparing to that of conventional connections. Tensile tests were conducted on four specimens and the results were analyzed in terms of failure modes, load-displacement response, yield and ultimate capacity, and initial stiffness. Furthermore, strain distributions on the through-diaphragm, the beam flange plate, and the column face were comprehensively evaluated and discussed. It was found that all the proposed three types of improved through-diaphragm connections were able to reduce the stress concentration in the welds between the beam flange and the through-diaphragm. Furthermore, the stress distribution in connection with longer tapered through-diaphragm was more uniform.

Seismic risk investigation for reinforced concrete buildings in Antalya, Turkey

  • Kepenek, Engin;Korkmaz, Kasim A.;Gencel, Ziya
    • Computers and Concrete
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    • v.26 no.3
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    • pp.203-211
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    • 2020
  • Turkey is located in one of the most seismically active regions of in Europe. The majority of the population living in big cities are at high seismic risk due to insufficient structural resistance of the existing buildings. Such a seismic risk brings the need for a comprehensive seismic evaluation based on the risk analysis in Turkey. Determining the seismic resistance level of existing building stock against the earthquakes is the first step to reduce the damages in a possible earthquake. Recently in January 2020, the Elazig earthquake brought the importance of the issue again in the public. However, the excessive amount of building stock, labor, and resource problems made the implementation phase almost impossible and revealed the necessity to carry out alternative studies on this issue. This study aims for a detailed investigation of residential buildings in Antalya, Turkey. The approach proposed here can be considered an improved state of building survey methods previously identified in Turkey's Design Code. Antalya, Turkey's fifth most populous city, with a population over 2.5 Million, was investigated as divided into sub-regions to understand the vulnerability, and a threshold value found for the study area. In this study, 26,610 reinforced concrete buildings between 1 to 7 stories in Antalya were examined by using the rapid visual assessment method. A specific threshold value for the city of Antalya was determined with the second level examination and statistical methods carried out in the determined sub-region. With the micro zonation process, regions below the threshold value are defined as the priority areas that need to be examined in detail. The developed methodology can be easily calibrated for application in other cities and can be used to determine new threshold values for those cities.

Effect of Milling Time on the Microstructure and Mechanical Properties of Ta20Nb20V20W20Ti20 High Entropy Alloy (Ta20Nb20V20W20Ti20 하이엔트로피 합금의 미세조직 및 기계적 특성에 미치는 밀링 시간의 영향)

  • Song, Da Hye;Kim, Yeong Gyeom;Lee, Jin Kyu
    • Journal of Powder Materials
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    • v.27 no.1
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    • pp.52-57
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    • 2020
  • In this study, we report the microstructure and characterization of Ta20Nb20V20W20Ti20 high-entropy alloy powders and sintered samples. The effects of milling time on the microstructure and mechanical properties were investigated in detail. Microstructure and structural characterization were performed by scanning electron microscopy and X-ray diffraction. The mechanical properties of the sintered samples were analyzed through a compressive test at room temperature with a strain rate of 1 × 10-4 s-1. The microstructure of sintered Ta20Nb20V20W20Ti20 high-entropy alloy is composed of a BCC phase and a TiO phase. A better combination of compressive strength and strain was achieved by using prealloyed Ta20Nb20V20W20Ti20 powder with low oxygen content. The results suggest that the oxide formed during the sintering process affects the mechanical properties of Ta20Nb20V20W20Ti20 high-entropy alloys, which are related to the interfacial stability between the BCC matrix and TiO phase.

A design and implementation of DIDL mapping system preserving semantic constraints (의미적 제약조건을 보존하는 DIDL 매핑 시스템의 설계 및 구현)

  • 송정석;김우생
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.29 no.5B
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    • pp.482-490
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    • 2004
  • Recently, XML has been emerging as a standard for storing and exchanging of data for various distributed applications based on the Internet. Since there are increasing demands to store and manage XML documents, a lot of research works are going on this area to develop new took and techniques based on the XHL. However, most of the researches are concentrated on mapping techniques based on instance or DTD, and the main focus is on structural transformation. Current trend of research is toward the usage of XML documents based on XML schema, and demands not only conversion of structure but also preservation of the semantic constraints. This paper sets up the using of DIDL standing on the basis of XML schema from MPEG-21 as an application domain, and proposes the mapping model that can preserve semantic constraints in addition. We expand previous research techniques in the preprocessing step for the specific domain, and then, apply various new mapping methods in the postprocessing step. We present and discuss the system architecture for implementation, and introduce the algorithms and present implementation environment and semantic extension methodology in detail. Finally we show actual table and query processing based on our proposal.

Effects of Conventional Rolling and Differential Speed Rolling on Microstructure and Mechanical Properties of a Copper Alloy Sheet (동속압연과 이속압연이 동합금판재의 조직 및 기계적 성질에 미치는 영향)

  • Lee, Seong-Hee;Lim, Jung-Youn;Yoon, Dae-Jin;Euh, Kwang-Jun;Han, Seung-Zeon
    • Korean Journal of Materials Research
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    • v.21 no.1
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    • pp.15-20
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    • 2011
  • The effects of conventional rolling (CR) and differential speed rolling (DSR) on the microstructure and mechanical properties of a copper alloy sheet were investigated in detail. A copper alloy with thickness of 3 mm was rolled to a 50% reduction at ambient temperature without lubrication with a differential speed ratio of 2:1; sample was then annealed for 0.5h at various temperatures from 100 to $800^{\circ}C$. Conventional rolling, in which the rolling speed of the upper and lower rolls is identical, was performed under the same rolling conditions. The shear strain introduced by the CR showed positive values at positions on the upper roll side and negative values at positions on the lower roll side. However, the shear strain showed a zero or positive value at all positions for the samples rolled by the DSR. The microstrucure and mechanical properties of the as-rolled copper alloy did not show very significant differences between the CR and DSR for the microstructure and mechanical properties. However, those properties showed very significant differences in the case of the annealed samples. The effects of rolling method on the microstructure and mechanical properties of the as-rolled and subsequently annealed materials are discussed in terms of the shear strain.

Fabrication of Microcrystalline NaPbLa(WO4)3:Yb3+/Ho3+ Phosphors and Their Upconversion Photoluminescent Characteristics

  • Lim, Chang Sung;Atuchin, Victor V.;Aleksandrovsky, Aleksandr S.;Denisenko, Yuriy G.;Molokeev, Maxim S.;Oreshonkov, Aleksandr S.
    • Korean Journal of Materials Research
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    • v.29 no.12
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    • pp.741-746
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    • 2019
  • New triple tungstate phosphors NaPbLa(WO4)3:Yb3+/Ho3+ (x = Yb3+/Ho3+ = 7, 8, 9, 10) are successfully fabricated by microwave assisted sol-gel synthesis and their structural and frequency upconversion (UC) characteristics are investigated. The compounds crystallized in the tetragonal space group I41/a and the NaPbLa(WO4)3 host have unit cell parameters a = 5.3927(1) and c = 11.7961(3) Å, V = 343.05(2) Å3, Z = 4. Under excitation at 980 nm, the phosphors have yellowish green emissions, which are derived from the intense 5S2/5F45I8 transitions of Ho3+ ions in the green spectral range and strong 5F55I8 transitions in the red spectral range. The optimal Yb3+:Ho3+ ratio is revealed to be x = 9, which is attributed to the quenching effect of Ho3+ ions, as indicated by the composition dependence. The UC characteristics are evaluated in detail under consideration of the pump power dependence and Commission Internationale de L'Eclairage chromaticity. The spectroscopic features of Raman spectra are discussed in terms of the superposition of Ho3+ luminescence and vibrational lines. The possibility of controlling the spectral distribution of UC luminescence by the chemical content of tungstate hosts is demonstrated.

A Study on the Spatial Characteristics from the "The Holy Trinity" Fresco Painted by Masaccio (마사치오의 "삼위일체" 벽화에서 나타난 공간적인 특성에 관한 연구)

  • Kim, Seok-Man
    • Journal of architectural history
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    • v.22 no.6
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    • pp.7-22
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    • 2013
  • The purpose of this paper is to study on the spatial characteristics from the "The Holy Trinity" fresco painted by Masaccio in the early Renaissance paintings. The results of this study are as follows. 1. The elevation composition of the "The Holy Trinity" fresco is divided into the upper and lower structure through horizontal axis on horizontal line around vanishing point. The upper structure is composed of vertical axis formed through the disposition of the "Trinity" elements and horizontal axis on horizontal line. The lower structure is composed of the sarcophagus and skeleton in such inside and the altar supported through circular columns of left and right. 2. The section composition of the "The Holy Trinity" fresco is composed of the ceiling structure of cylindrical-shaped vault on upper part around basic square floor plan that is interior space and upper structure. The exterior space and lower structure is placed with sarcophagus in inner part that altar and step is projected as same height and width in the outside direction. 3. The basic floor composition of the "The Holy Trinity" fresco is planned by square shape around structural columns that is placed at corners as symmetry through transverse, longitudinal and diagonal axis. The whole floor composition planned through the altar and step that is in exterior space at front, the apse of round form at rear part and the structure of the middle story concept at interior. 4. The visual aspect of the "The Holy Trinity" fresco is composed of the stable balance in relation with distance and height because the interior and exterior space as well as the upper structure and lower structure is formed by regular proportion system. The elevation angle of visual range was planned to view in detail generally or partially the architectural composition system and element, characters through proper visual distance, center and position.

Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity

  • Yim, Myung-Jin;Kim, Hyoung-Joon;Paik, Kyung-Wook
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.1 s.34
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    • pp.9-16
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    • 2005
  • This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

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