• Title/Summary/Keyword: stress-sensor

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Measurement of Load Transfer between Anchor and Grout using Optical FBG Sensors embedded in Smart Anchor (FBG 센서가 내장된 스마트 앵커를 이용한 앵커와 그라우트의 하중전이 측정)

  • Suh, Dong-Nam;Kim, Young-Sang;Kim, Jae-Min
    • Proceedings of the Korean Geotechical Society Conference
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    • 2008.03a
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    • pp.505-510
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    • 2008
  • FBG Sensor, which is smaller than strain gauge and has better durability and does not have a noise from electromagnetic waves, was adapted to develope a smart anchor. A series of pullout tests were performed to verify the feasibility of smart anchor and find out the load transfer mechanism around the steel wire fixed to rock with grout. Distribution of shear stresses at steel wire-grout interface is assessed from the measured strain distribution by the optical fiber sensors and compared with stress distributions predicted by Farmer's and Aydan's formulas. It was found that present theoretical formulas may underestimate the failure depth and magnitude of shear stresses when the pullout loads increase.

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Reliability Assessment and Improvement of MEMS Vacuum Package with Accelerated Degradation Test (ADT) (가속열화시험을 적용한 MEMS 진공패키지의 신뢰성 분석 및 개선)

  • 최민석;김운배;정병길;좌성훈;송기무
    • Journal of Applied Reliability
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    • v.3 no.2
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    • pp.103-116
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    • 2003
  • We carry out reliability tests and investigate the failure mechanisms. of the wafer level vacuum packaged MEMS gyroscope sensor using an accelerated degradation test. The accelerated degradation test (ADT) is used to evaluate reliability (and/or life) of the MEMS vacuum package and to select the accelerated test conditions, which reduce the reliability testing time. Using the failure distribution model and stress-life model, we are able to estimate the average life time of the vacuum package, which is well agreed with the measured data. After improving several package reliability issues such as prevention of gas diffusion through package, we carry out another set of accelerated tests at the chosen acceleration level. The results show that reliability of the vacuum packaged gyroscope has been greatly improved and can survive without degradation of performance, which is the Q-factor in gyroscope sensor, during environmental stress reliability tests.

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A Study on the Safety Evaluation of the Landing Pier Structure Using FBG Sensor (FBG 센서를 이용한 잔교식 안벽 구조물의 안전성 평가에 대한 연구)

  • Lee, Heung-Su
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.23 no.2
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    • pp.44-50
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    • 2019
  • The underwater structures of landing pier are not easy to access and it is difficult to check the damage. Lately, typhoons and earthquakes have occurred frequently, which may cause damage to underwater structures of landing pier. In this study, to prevent collapse of underwater structures and to maintain systematically, the application method of FBG sensors and safety evaluation methods were studied. In order to confirm the application of the FBG sensor to the circular steel pipe used as a pile on the landing pier, we conducted laboratory tests and confirmed that the FBG sensor should be applied by welding. As a result of structural analysis of the landing pier structure, the optimal position of FBG sensor confirmed. The stresses on the dead load were calculated by structural analysis, the stresses on the live load were calculated by using the data obtained from the FBG sensor, and then the stress acting on the pile was calculated by adding the two stresses. The calculated stress was compared with the allowable stress to evaluate the safety of the pile. This study was carried out as a basic study to find a way to evaluate the safety of the landing pier in real time.

A Study of Hull Stress Monitoring System considering Thermal Effect

  • Shim, Chun-Sik;Kang, Joong-Kyoo;Heo, Joo-Ho
    • Journal of Navigation and Port Research
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    • v.32 no.2
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    • pp.121-126
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    • 2008
  • This paper presents hull stress monitoring system installed in LNGC damaged by a Typhoon Elongation/contraction of removed areas has been assessed in terms of possible residual stress that will take place in replaced blocks when the applied load is removed. The bending moment of a vessel changes actually in terms of loss of longitudinal members and the change of weight distribution in repair procedure. The change of bending moment affects mainly in hull stress of longitudinal members. Hull stress monitoring system was installed on upper deck to prove LNGC stable in the criteria to be less than 40MPa during the period of repair procedure. A temperature measuring system was also installed to exclude the additional stress due to thermal effect from the measured hull stress. As a result, the hull stress was modified with the data measured by the temperature measuring system. This hull stress considering thermal effect was used as a guide stress to check the safety of LNGC during the period of repair procedure.

Investigation of piezoelectric ceramic size effect for miniaturing the piezoelectric energy harvester (소형 압전 에너지 하베스터 구현을 위한 세라믹 크기 변화)

  • Kim, Hyung-Chan;Jung, Woo-Suk;Kang, Chong-Yun;Yoon, Seok-Jin;Ju, Byeong-Kwon;Jeong, Dae-Yong
    • Journal of Sensor Science and Technology
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    • v.17 no.4
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    • pp.267-272
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    • 2008
  • Energy harvesting from the vibration through the piezoelectric effect has been studied for powering the small wireless sensor nodes. As piezoelectric uni-morph cantilever structure can transfer low vibration to large displacement, this structure was commonly deployed to harvest electric energy from vibrations. Through our previous results, when stress was applied on the cantilever, stress was concentrated on the certain point of the ceramic of the cantilever. In this study, for miniaturing the energy harvester, we investigated how the size of ceramics and the stress distribution in ceramic affects energy harvester characteristics. Even though the area of ceramic was 28.6 % decreased from $10{\times}35{\times}0.5mm^3$ to $10{\times}25{\times}0.5mm^3$, both samples showed almost same maximum power of 0.45 mW and the electro-mechanical coupling factor ($K_{31}$) of 14 % as well. This result indicated that should be preferentially considered to generate high power with small size energy harvester.

A Design of Pressure Sensor for Improving Linearity at Low Pressure Range (저압에서의 선형성을 향상시키기 위한 압력센서의 설계)

  • Lee, Bo-Na;Lee, Moon-Key
    • Journal of Sensor Science and Technology
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    • v.5 no.2
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    • pp.1-8
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    • 1996
  • In this paper, We have designed silicon pressure sensor with center-bossed diaphragm which improving sensitivity and linearity by reducing diaphragm deflection. Designed center-bossed pressure sensor showed maximum deflection of $0.125{\mu}m$, maximum stress of $2.24{\times}10^7 Pa$ and sensitivity of 27.67 mV/V.psii. As a result, diaphragm deflection was reduced to 1/160 that of diaphragm thickness and 1/35 that of square diaphragm. Also, sensitivity was increased 19 times compared to square diaphragm.

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Polymer Based Slim Tactile Sensor: Optimal Design and New Fabrication Method (폴리머 기반 슬림형 촉각센서의 최적 설계 및 새로운 공정 방법)

  • Lee, Jeong-Il;Sato, Kazuo
    • Journal of Institute of Control, Robotics and Systems
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    • v.17 no.2
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    • pp.131-134
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    • 2011
  • In this study, we propose an optimal design and new fabrication method for a slim tactile sensor. Slim tactile sensor can detect 3-axial forces and has suitable flexibility for intelligent robot fingers. To amplify the contact signal, a unique table-shaped structure was attempted. A new layer-by-layer fabrication process for polymer micromachining that can make a 3D structure by using a sacrificial layer was proposed. A table-shaped epoxy sensing plate with four legs was built on top of a flexible polymer substrate. The plate can convert an applied force to a concentrated stress. Normal and shear forces can be detected by combining responses from metal strain gauges embedded in the polymer substrate. The optimal positions of the strain gauges are determined using the strain distribution obtained from finite element analysis.

Non-Contact Magnetoelastic Torque Sensor Using Amorphous Alloys (비정질합금을 이용한 비접촉 자기탄성 토오크센서)

  • 손대락;임순재;유중렬;김창석
    • Journal of the Korean Magnetics Society
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    • v.1 no.2
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    • pp.89-93
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    • 1991
  • A new kind of a non-contact torque sensor which uses the difference of the maximum magnetic inductions as measurand was constructed. The torque sensor utilizes the tensile and compressive stress of two cores which are attached on the rotating shaft. This sensor shows that the linearity was better than 1 %, and the transient torque can be measured at the sampling rate of 10 kHz which is the same as magnetizing frequency of the core.

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Strain Sensor Application using Cellulose Electro-Active Paper (EAPap) (셀룰로오스 기반 Electro-Active Paper (EAPap)를 이용한 변형률 센서 응용)

  • Jang, Sang-Dong;Lee, Sang-Woo;Kim, Joo-Hyung;Kim, Jae-Hwan
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2009.04a
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    • pp.462-465
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    • 2009
  • Cellulose based electro-active paper (EAPap) is a new smart material that has a potential to be used in biomimetic actuator and sensor. Beside of the natural abundance, cellulose EAPap is fascinating with its biodegradability, lightweight, high mechanical strength and low actuation voltage. An actuating mechanism of EAPap is revealed to be the combination of ion migration effect and piezoelectricity. EAPap can generate the electrical current and voltage when the mechanical stress applied due to its electro-mechanical characteristics. In this paper, we investigated the feasibility of EAPap as a mechanical strain sensor.

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Analyses Thermal Stresses for Microaccelerometer Sensors using SOI Wafer(I) (SOI웨이퍼를 이용한 마이크로가속도계 센서의 열응력해석(I))

  • Kim, O.S.
    • Journal of Power System Engineering
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    • v.5 no.2
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    • pp.36-42
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    • 2001
  • This paper deals with finite element analyses of residual stresses causing popping up which are induced in micromachining processes of a microaccelerometer sensors. The paddle of the micro accelerometer sensor is designed symmetric with respect to the direction of the beam. After heating the tunnel gap up to 100 degree and get it through the cooling process and the additional beam up to 80 degree and get it through the cooling process. We learn the thermal internal stresses of each shape and compare the results with each other, after heating the tunnel gap up to 400 degree during the Pt deposition process. Finally we find the optimal shape which is able to minimize the internal stresses of microaccelerometer sensor. We want to seek after the real cause of this pop up phenomenon and diminish this by change manufacturing processes of microaccelerometer sensor by electrostatic force.

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