• Polymer(Korea)
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• v.27 no.3
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• pp.189-194
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• 2003

Interfacial evaluation, damage sensing and cure monitoring of single carbon fiber/thermo setting composite with different curing processes were investigated using electro-micromechanical test. After curing, the residual stress was monitored by measurement of electrical resistance and then compared to various curing processes. In thermal curing case, matrix tensile strength, modulus and interfacial shear strength were higher than those of ultraviolet curing case. The shrinkage measured during thermal curing occurred significantly by matrix shrinkage and residual stress due to the difference in thermal expansion coefficient. The apparent modulus measured in the thermal curing indicated that mechanical and interfacial properties were highly improved. The reaching time to the same stress of thermal curing was faster than that of UV curing case.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.10a
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• pp.261-264
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• 2002

Interfacial evaluation, damage sensing and cure monitoring of single carbon fiber/thermosetting composite with different curing processes was investigated using electro-micromechanical test. After curing, residual stress was monitored by measurement of electrical resistance (ER) and then it was compared to correlate with various curing processes. In thermal curing, curing shrinkage appeared significantly by matrix shrinkage and residual stress due to the difference in thermal expansion coefficient (TEC). The change in electrical resistance (ΔR) on thermal curing was higher than that on ultraviolet (UV) curing. For thermal curing, apparent modulus was the highest and reaching time until same strain was faster. So far thermal curing shows strong durability on the IFSS after boiling test.

• Journal of Adhesion and Interface
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• v.9 no.3
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• pp.20-26
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• 2008

It is well know that the structure of shape memory alloy (SMA) can change from martensite austenite by either temperature or stress. Due to their inherent shape recovery properties, SMA fiber can be used such as for stress or cure-monitoring sensor or actuator, during applied stress or temperature. Incomplete superelasticity was observed as the stress hysteresis at stress-strain curve under cyclic loading test and temperature change. Superelasticity behavior was observed for the single-SMA fiber/epoxy composites under cyclic mechanical loading at stress-strain curve. SMA fiber or epoxy embedded SMA fiber composite exhibited the decreased interfacial properties due to the cyclic loading and thus reduced shape memory performance. Rigid epoxy and the changed interfacial adhesion between SMA fiber and epoxy by the surface treatment on SMA fiber exhibited similar incomplete superelastic trend. Epoxy embedded single SMA fiber exhibited the incomplete recovery during cure process by remaining residual heat and thus occurring residual stress in single SMA fiber/epoxy composite.