• Bulletin of the Korean Chemical Society
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• v.9 no.4
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• pp.213-217
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• 1988

A new paradigm for the viscosity of fluid is presented by considering the fact that the viscosity is equal to the shear stress divided by the shear rate. The shear stress is obtained from the sum of kinetic and internal pressures of fluid, and the shear rate is found from the phonon velocity divided by the mean free path of the phonon. The calculated viscosities for various simple substances are in excellent agreements with those of the observed data through the wide temperature range covered both of liquid and gas phase.

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.1
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• pp.201-208
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• 1991

In case that an interface crack exists in an infinite two-dimensional elastic bimaterial, the crack surface is insulated under traction free and the uniform heat flow vertical to the crack from infinite boundary is given. Temperature and stress potentials are obtained by using complex variable approach to solve Hilbert problems. The results are used to obtain thermal stress intensity factors. Only mode I thermal stress intensity factor occurs in case of the homogeneous material. Otherwise, mode I and II thermal stress intensity factor is much smaller than one of mode II.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.209-213
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• 2008

In this work, we have proposed a method for calculating the residual stress developed during the PCB thermo-compression bonding precess. Residual stress is the most important factor that causes PCB warpage in accordance with the pattern design. In this work, a single-layed double-sided PCB, which is comprised of the dielectric (FR-4) substrate in the middle and copper cladding on the both top and bottom sides, is considered. A reference temperature, where all stress is free, is calculated by comparing the calculated and measured warapge of a PCB of which copper cladding of the top side is removed. Then, the reesidual stress values is calculated for the double-sided PCB.

• Proceedings of the Korean Society of Crop Science Conference
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• 2017.06a
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• pp.202-202
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• 2017

Global climate change resulted in unwarranted change in global temperature and caused heat and cold stress, which are consider major threat to agriculture productivity around the world. The use of plant growth-promoting microbes is an eco-friendly strategy to counteract such stresses and confer tolerance to the plants. In current study, previously isolated endophytic fungi Preussia sp. BSL-10 has been found to produce phytohormones such as IAA and GA and as such, endophyte Preussia sp. BSL-10 found to induced tolerance against heat and cold stress. The results showed that under both heat and cold stress the plant growth parameter such as shoot, root length, shoot fresh weight and root fresh weight is higher in Preussia sp. BSL-10 treated plants as compare to free Preussia sp. BSL-10 control plants. In addition, the stress-sensitive endogenous ABA levels were significantly increased in Preussia sp. BSL-10 host plant. The current result suggest that the phytohormone-producing endophyte Preussia sp. BSL-10 can increase plant resistance toheat and cold stress, in turn improving agricultural productivity.

• Journal of the Korean Society for Heat Treatment
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• v.24 no.3
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• pp.133-139
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• 2011

This study has been investigated for tensile properties with lead-free brass containing 1 wt.% of Bi. And also characteristic of corrosion resistance was analyzed by polarization test. An increase of tempering temperature was found to tend to decrease tensile strength, and percentage of elongation was shown to be the lowest value at $300^{\circ}C$. On the other hand, the elongation was increased with an increase of tempering temperature after $300^{\circ}C$. The change of mechanical properties was closely related with the content and shape of acicular Witmanst$\ddot{a}$tten ${\alpha}$ formed at the interface of ${\beta}$ phase as well as in ${\beta}$ phase. Tensile strength had a tendency to be decreased with an increase of test temperature. The elongation was shown to be the lowest value at around $300^{\circ}C$, while it began to increase as test temperature rose after $300^{\circ}C$. It might be speculated that the reason that elongation was decreased was found to form bismuth film at the interface of ${\alpha}/{\beta}$ phase leading to be easily brittle when loaded by tensile stress. The lead-free brass containing 1 wt.% of Bi had similar characteristic of corrosion resistance with a free-cutting brass with 3.4 wt. % of Pb in spite of higher fraction of ${\beta}$ phase.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.2
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• pp.130-138
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• 2006

We have investigated pattern scaling down of silicon stamps through the oxidation technique, During oxidizing the silicon stamps, silicon dioxide that has 300 nm and 500 nm thickness was grown, and critical deformations were not observed in the patterns. There was positive effect to reduce size of patterns because vertical and horizontal patterns have different orientation. We achieved pattern reduction rate of $26\%$. In addition, the formation of polymer patterns had been investigated with varied temperature and pressure conditions to improve the filling characteristics of polymers during nanoimprint lithography when pattern sizes were few micrometers. In these varied conditions, polymers had been affected by free space compensation and elastic stress relaxation for filling the cavities. Based on the results, defect control which is an important issue in the nanoimprint lithography were facilitated.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.53-56
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• 2003

The disappearance of continuous yielding and the formation of an extended region in engineering stress-strain curves at tempering temperatures of 673-873K is closely related to the reduction of mobile dislocations during tempering and dynamic recovery during tensile deformation. In addition, the occurrence of discontinuous yielding at tempering temperature above 923K would be attributed to the formation of new strain-free polygonal ferrite grain.

• Journal of Powder Materials
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• v.4 no.2
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• pp.83-89
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• 1997

A finite element analysis to solve the coupled thermomechanical problem in the plane strain upsetting of the porous metals was performed. The analysis was formulated using the yield function advanced by Lee and kim and developed using the thermo-elasto-plastic time integration procedure. The density and temperature dependent thermal and mechanical properties of porous metals were considered. The internal heat generation by the plastic deformation and the changing thermal boundary conditions corresponding to the geometry were incorporated in the program. The distributions of the stress, strain, pressure, density and temperature were predicted during the free resting period, deformation period and dwelling period of the forging process.

• Corrosion Science and Technology
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• v.14 no.4
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• pp.161-165
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• 2015

This paper presents an analysis of thermal stress induced along the interface between a polymeric coating layer and a steel substrate as a result of uniform temperature change. The epoxy layer is assumed to be a linear viscoelastic material and to be theromorheologically simple. The viscoelastic boundary element method is employed to investigate the behavior of interface stresses. The numerical results exhibit relaxation of interface stresses and large stress gradients, which are observed in the vicinity of the free surface. Since the exceedingly large stresses cannot be borne by the polymeric coating layer, local cracking or delamination can occur at the interface corner.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.3
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• pp.261-268
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• 2001

An investigation on nondestructive evaluation of thermal stress-nduced damage in the composite laminates (3mm in thickness and $[+45_6/-45_6]_s$ lay-up angles) has been performed using the thermo-acoustic emission technique. Reduction of thermo-AE events due to repetitive thermal load cycles showed a Kaiser effect. An analysis of the thermo-AE behavior determined the stress free temperature of composite laminates. Fiber fracture and matrix cracks were observed using the optical microscopy, scanning electron microscopy and ultrasonic C-sean. Short-Time Fourier Transform of thermo-AE signals offered the time-frequency characteristics which might classily the thermo-AE as three different types to estimate the damage processes of the composites.