• Restorative Dentistry and Endodontics
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• v.19 no.1
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• pp.64-72
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• 1994

Zinc Phosphate Cement hand been used for about more than 100 years in luting of cast gold inlay. But many scientists had been trying to develop the new form of luting agent because the ZPC hand shown the lack of adhesiveness on the tooth structure and the toxicity to the pulp tissue. Recently many researches about the surface treatment of the cast body are being done to increase the adhesion of cement to it. The conventional Class I gold inlays were fabricated in the 20 permanent molars. After the internal surface of the cast body was sandblasted with $Al_2O_3$ particles and was tin-plated, the inlays were cemented with adhesive cement [G I cement and resin cement(Super-Bond & $Panavia_{EX}$)] and the evaluation on the adhesion pattern, adhesive strength and the fracture pattern of the adhesive cast gold inlay was compared to that of the cast gold inlay cemented conventionally with ZPC. The results were as follows : 1. The surface roughness of the cast body was increased significantly after sandblasting with the $Al_2O_3$ particles and the tin oxide layer, which was consisted of round particles, came into being. 2. The bond strength was in the order of Super-Bond, ZPC, Fuji I, $Panavia_{EX}$ group. The group cemented with Super-Bond showed statistically greater strength than the other groups(p<0.05). 3. The group cemented with ZPC was fallen apart by principal adhesion failure and that with Fuji I was by complete adhesion failure. But the group with Super-Bond showed pricncipal cohesive failure pattern and in the group with $Panavia_{EX}$, complete cohesive fracture pattern was shown and small protion of tooth structure was fractured out with cast body and the fractured surface showed the figure just as the enamel prism. 4. Various gaps were shown at the pulpal side regardless of little gap at the side walls of the cavity in all groups. Only the Super-Bond was attached to the tooth structure and the other cements were detached from both the tooth and the cast body.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.5
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• pp.865-870
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• 2013

In recent years, aluminum processing has been increasing in the aerospace, vehicle, airplane industries etc., because aluminum has abundant resources and has a high specific strength. Aluminum alloys have a high coefficient of thermal expansion therefore, it is necessary to consider the temperature problem in the cutting process. The objective of this research is to investigate the machinability of a hardened aluminum alloy Al7075-T6 by using cryogenic heat treatment. The machining test is conducted by comparing the cutting force and surface roughness, corresponding to various cutting conditions of depth of cut, cutting speed, and feed rate, with those of Al7075-T0.

• Journal of the Korean Society for Precision Engineering
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• v.34 no.3
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• pp.185-189
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• 2017

Recently, titanium alloys have been widely used in aerospace, biomedical engineering, and military industries due to their high strength to weight ratio and corrosion resistance. However, it is well known that titanium alloys are difficult-to-cut materials because of a poor machinability characteristic caused by low thermal conductivity, chemical reactivity with all tool materials at high temperature, and high hardness. To improve the machinability of titanium alloys, cryogenic cooling with LN2 (Liquid Nitrogen) and nanofluid MQL (Minimum Quantity Lubrication) technologies have been studied while turning a Ti-6Al-4V alloy. For the analysis of turning process characteristics, the cutting force, the coefficient of friction, and the surface roughness are measured and analyzed according to varying lubrication and cooling conditions. The experimental results show that combined cryogenic cooling and nanofluid MQL significantly reduces the cutting forces, coefficients of friction and surface roughness when compared to wet condition during the turning process of Ti-6Al-4V.

• Journal of Power System Engineering
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• v.19 no.1
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• pp.64-69
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• 2015

Aluminum alloy is a material with a high strength-weight ratio and excellent thermal conductivity. It neither readily corrodes nor quickly weakens at low temperatures, but can be easily recycled. Because of these features, aluminum heat exchangers are widely used in aluminum alloy. In addition, the aluminum alloy used in other areas is expected to gradually increase. As a result, researchers have been continuously studying the cutting patterns of aluminium alloy. However, such studies are fewer than those on the cutting patterns of ordinary steel. Moreover, the research on ball endmilling with aluminium alloys has not received much attention. Therefore, in this study, an attempt was made to find the optimal cutting pattern among the seven cutting patterns for the machining of the commonly used aluminum alloy using ball endmilling for a heat exchanger. The optimal pattern was found by comparing the different shapes and surface roughness values produced by the seven patterns.

• Journal of the Korean Society of Safety
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• v.24 no.1
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• pp.1-6
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• 2009

In machining of ceramic materials, they are very difficult-to cut materials because of there high strength and hardness. Machining of ceramics are characterized by cracking and brittle fracture. Generally, ceramics are machined using conventional method such as grinding and polishing. However these processes are generally costly and have low MRR(material removal rate). This paper focuses on machinability evaluation of machinable ceramics for products with CNC machining center. Thus, in this paper, experiment applying cutting parameters is performed based on experimental design method. A design and analysis of experiments is conducted to study the effects of these parameters on the surface roughness by using the S/N ratio, analysis of ANOVA, and F-test. And multiple linear regression analysis is applied to compare experimental with predicted data in consideration of surface roughness. Cutting parameters, namely, feed, cutting speed and depth of cut are used to accomplish purpose of this paper. Required experiments are performed, and the results are investigated.

• Journal of the Semiconductor & Display Technology
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• v.19 no.4
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• pp.28-33
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• 2020

Plasma etching process employs high density plasma to create surface chemistry and physical reactions, by which to remove material. Plasma chamber includes silicon-based materials such as a focus ring and gas distribution plate. Focus ring needs to be replaced after a short period. For this reason, there is a need to find materials resistant to erosion by plasma. The developed chemical vapor deposition processing to produce silicon carbide parts with high purity has also supported its widespread use in the plasma etch process. Silicon carbide maintains mechanical strength at high temperature, it have been use to chamber parts for plasma. Recently, besides the structural aspects of silicon carbide, its electrical conductivity and possibly its enhanced life time under high density plasma with less generation of contamination particles are drawing attention for use in applications such as upper electrode or focus rings, which have been made of silicon for a long time. However, especially for high purity silicon carbide focus ring, which has usually been made by the chemical vapor deposition method, there has been no study about quality improvement. The goal of this study is to reduce surface roughness and depth of damage by diamond tool grit size and tool dressing of diamond tools for precise dimensional assurance of focus rings.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1640-1644
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• 2006

The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.143-146
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• 2002

Unsized AS-4 carbon fibers were etched by RF plasma and then coated via plasma polymerization in order to enhance adhesion to vinyl ester resin. The gases utilized for the plasma etching were Ar, $N_2 and O_2$, while the monomers used for the plasma polymerization coating were acetylene, butadiene and acrylonitrile. The conditions for the plasma etching and the plasma polymerization were optimized by measuring interfacial adhesion with vinyl ester resin via micro-droplet tests. Among the treatment conditions, the combination of Ar plasma etching and acetylene plasma polymerization provided greatly improved interfacial shear strength (IFSS) of 69MPa compared to 43MPa with as-received carbon fiber. Based on the SEM analysis of failure surface and load-displacement curve, it was assume that the failure might be occurred at the carbon fiber and plasma polymer coating. The plasma etched and plasma polymer coated carbon fibers were subjected to analysis with SEM, XPS, FT-IR or Alpha-Step, and dynamic contact angles and tensile strengths were also evaluated. Plasma polymer coatings did not change tensile strength and surface roughness of fibers, but decreased water contact angle except butadiene plasma polymer coating, possibly owing to the functional groups introduced, as evidenced by FT-IR and XPS.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.6
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• pp.479-485
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• 2002

We have investigated the effects of various wafers cleaning on glass/Si bonding using 4 inch Pyrex glass wafers and 4 inch silicon wafers. The various wafer cleaning methods were examined; SPM(sulfuric-peroxide mixture, $H_2SO_4:H_2O_2$ = 4 : 1, $120^{\circ}C$), RCA(company name, $NH_4OH:H_2O_2:H_2O$ = 1 : 1 : 5, $80^{\circ}C$), and combinations of those. The best room temperature bonding result was achieved when wafers were cleaned by SPM followed by RCA cleaning. The minimum increase in surface roughness measured by AFM(atomic force microscope) confirmed such results. During successive heat treatments, the bonding strength was improved with increased annealing temperatures up to $400^{\circ}C$, but debonding was observed at $450^{\circ}C$. The difference in thermal expansion coefficients between glass and Si wafer led debonding. When annealed at fixed temperatures(300 and $400^{\circ}C$), bonding strength was enhanced until 28 hours, but then decreased for further anneal. To find the cause of decrease in bonding strength in excessively long annealing time, the ion distribution at Si surface was investigated using SIMS(secondary ion mass spectrometry). tons such as sodium, which had been existed only in glass before annealing, were found at Si surface for long annealed samples. Decrease in bonding strength can be caused by the diffused sodium ions to pass the glass/si interface. Therefore, maximum bonding strength can be achieved when the cleaning procedure and the ion concentrations at interface are optimized in glass/Si wafer direct bonding.

• Tribology and Lubricants
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• v.37 no.3
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• pp.83-90
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• 2021

In this study, an ultrasonic nanocrystal surface modification (UNSM) was used to improve the mechanical properties, scratch resistance and tribological performance of Cu-based bimetals, which are usually used to manufacture sliding bearings and bushings for internal combustion engines (ICEs). Two different Cu-based bimetals, namely CuPb10Sn10 and CuSn10Bi7, were sintered onto a low carbon steel substrate. The mechanical properties and dry tribological performance using a tensile tester and micro-tribo tester were evaluated, respectively. The scratch resistance was assessed using a micro-scratch tester at an incremental load. The tensile test results showed that the yield strength (YS) and ultimate tensile strength (UTS) of both Cu-based bimetals increased after UNSM. Furthermore, the scratch and tribological tests results revealed that the scratch resistance and tribological performance of both Cu-based bimetals were improved by the application of UNSM. These improvements were mainly attributed to the eliminated pores, increased hardness and reduced roughness after UNSM. CuSn10Bi7 demonstrated better mechanical properties, scratch resistance and tribological performance than CuPb10Sn10. It was found that the presence of Bi in CuSn10Bi7 formed a Cu₁₁Bi₇ intermetallic phase, which is harder than Cu₃Sn. Hence, CuSn10Bi7 demonstrated higher strength and wear resistance than CuPb10Sn10. In addition, a CuSn10Bi7 formed both SnO₂ and Bi₂O₃ that prevented adhesion and improved the tribological performance. It can be expected that under dry tribological conditions, ICEs can utilize UNSM bearings and bushings made of CuSn10Bi7 instead of CuPb10Sn10 under oil-lubricated conditions.