• 한국농공학회논문집
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• 제57권4호
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• pp.73-84
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• 2015

An embankment raising project on 113 agricultural reservoirs in Korea was implemented in 2009 to increase water supply capacity for agricultural water and instream uses. This study evaluated the future water supply capacity of the Imgo reservoir at which the agricultural reservoir embankment raising project was completed, considering climate change scenarios. The height of the embankment of the reservoir was increased by 4.5 m, thereby increasing its total storage from 1,657.0 thousand to 3,179.5 thousand cubic meters. To simulate the reservoir water storage with respect to climate changes, two climate change scenarios, namely, RCP 4.5 and RCP 8.5 (in which greenhouse gas reduction policy was executed and not executed, respectively) were applied with bias correction for reflecting the climate characteristics of the target basin. The analysis result of the agricultural water supply capacity in the future, after the agricultural reservoir embankment raising project is implemented, revealed that the water supply reliability and the agricultural water supply increased, regardless of the climate change scenarios. By simulating the reservoir water storage considering the instream flow post completion of the embankment raising project, it was found that water shortage in the reservoir in the future is not likely to occur when it is supplied with an appropriate instream flow. The range of instream flow tends to decrease over time under RCP 8.5, in which the greenhouse gas reduction policy was not executed, and the restoration of reservoir storage was lower in this scenario than in RCP 4.5, in which greenhouse gas reduction policy was executed.

• 방사성폐기물학회지
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• 제4권1호
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• pp.51-58
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• 2006

고리 원전 사용후핵연료 저장조의 저장용량을 확보하기 위하여 2002년부터 사용후핵연료 운반용기를 이용하여 400다발 이상의 PWR 사용후핵연료 집합체를 원전부지 내에 수송, 저장하였다. 이를 위하여 KN-12 운반용기, 관련장비 및 수송차량으로 구성되는 수송시스템을 구성하였다. KN-12 운반용기는 국내 원자력법 및 IAEA의 수송규정에 따라 설계, 제작되고, 정부로부터 인허가를 획득하였으며, 취급장비 역시 관련규정에 따라 구비하였다. 수송 저장작업은 2 대의 운반용기를 동시에 투입하여 수행하였으며, 모든 작업공정에 대하여 엄격한 품질관리 및 방사선 안전관리를 수행하여 수송 안전성을 확보하고 신뢰도를 제고하였다.

• 한국도서관정보학회지
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• 제47권1호
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• pp.149-173
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• 2016

클라우드 컴퓨팅에 대한 관심이 많아짐으로 인해 많은 기관들이 클라우드 컴퓨팅으로 전환을 결정하고 있다. 확장성, 비용 효율성, 접근성 등 다양한 장점으로 인해 의료 기관들도 정보 인프라를 클라우드 기반으로 전환하는 것을 추진하고 있다. 이러한 장점에도 불구하고 많은 양의 민감한 개인정보를 이동 (migration) 하는 것에 대한 여러 가지가 고려되어야 한다. 의료 기관은 민감한 환자 정보에 대한 보안, 안정성, 가용성을 고려하고 또한 HIPPA와 같은 법적인 요구 사항을 만족시켜야 한다. 본 연구는 전자의무기록을 클라우드 기반 저장소로 이동시 장점 및 문제점을 조사하고 또한 고려사항을 제안하고자 한다.

• Preventive Nutrition and Food Science
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• 제9권3호
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• pp.227-231
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• 2004

Green, black and oolong teas were irradiated by $^{60}$ Co-gamma rays (0～10 kGy) and were investigated for detection of irradiation treatment using pulsed photostimulated luminescence (PPSL) and thermoluminescence (TL) during storage. Teas irradiated at 2.5 kGy or more showed a photon count of greater than 5000 counts/60 sec while the non-irradiated yielded only 650～1000 count/60 sec. Correlation coefficients between irradiation dose and photon counts/60 sec were 0.8951, 0.7934 and 0.9007 for green, black and oolong teas, respectively. The TL glow curves for minerals isolated from the non-irradiated teas were situated at about 30$0^{\circ}C$ with a low intensity, but for irradiated samples were approximately 15$0^{\circ}C$ with a high intensity. The TL ratios (TL$_1$/TL$_2$), calculated from values after initial radiation and then after re-irradiation of the teas, were below 0.1 for the non-irradiated samples and higher than 1.44 for all irradiated samples, enhanced the reliability of the identification results for TL. The signal intensity of PPSL and TL for irradiated teas decreased with the lapse of post-irradiation storage time at room temperature but was still distinguishable from that of the non-irradiated samples even after one year.

• 마이크로전자및패키징학회지
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• 제17권3호
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• pp.27-32
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• 2010

Cu pillar 범프와 Sn 패드로 구성된 플립칩 접속부를 형성한 후, Sn 패드의 높이에 따른 Cu pillar 플립칩 접속부의 열 싸이클링 및 고온유지 신뢰성을 분석하였다. Cu pillar 플립칩 접속부를 구성하는 Sn 패드의 높이가 5 ${\mu}m$에서 30 ${\mu}m$로 증가함에 따라 접속저항이 31.7 $m{\Omega}$에서 13.8 $m{\Omega}$로 감소하였다. $-45^{\circ}C{\sim}125^{\circ}C$ 범위의 열 싸이클을 1000회 인가한 후에도 Cu pillar 플립칩 접속부의 접속저항의 증가가 12% 이하로 유지되었으며, 열 싸이클링 시험전과 거의 유사한 파괴 전단력을 나타내었다. $125^{\circ}C$에서 1000 시간 유지시에도 Cu pillar 플립칩 접속부의 접속저항의 증가가 20% 이하로 유지되었다.

• 한국수자원학회:학술대회논문집
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• 한국수자원학회 2011년도 학술발표회
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• pp.58-58
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• 2011

The Texas Commission on Environmental Quality(TCEQ) WAM(Water Availability Modeling) System consists of the generalized Water Rights Analysis Package(WRAP) river/reservoir system water management simulation model, 22 sets of WRAP hydrology and water rights input files for the 23 river basins of Texas, geographic information system tools, and other supporting databases. The WRAP/WAM modeling system, as routinely applied since the late 1990s, has not included consideration of water quality. Recently developed WRAP-SALT(Water Rights Analysis Package) is designed primarily for computing concentration frequency statistics and supply reliability indices at locations of interest in a river system for alternative water development and management scenarios. Though motivated primarily by natural salt pollution, WRAP-SALT water quality modeling features are applicable to essentially any conservative water quality constituent. The Brazos River studies discussed in this paper focus on total dissolved solids, though the available observed data also includes chloride and sulfate which can be modeled as individual constituents. The WRAP-SALT salinity input file contains loads or concentrations of salinity inflows during each month of the hydrologic period-of-analysis and reservoir storage at the beginning of the simulation. The WRAP-SALT model computes salt loads and concentrations for each control point of a river/reservoir system for inflows and outflows during the month and end-of-month reservoir storage for each month of the hydrologic period-of-analysis, for given loads entering the system. River reaches connect control points. The mass balance algorithms proceed from upstream to downstream, with outflow from one river reach contributing to inflow to the next downstream reach. In a given month, for each control point in sequence, the inflow loads are first computed. Loads and concentrations of outflows and reservoir storage at the control point are then determined. Complete mixing during the month is assumed at locations without reservoir storage.

• 정보처리학회논문지:컴퓨터 및 통신 시스템
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• 제3권11호
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• pp.409-418
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• 2014

최근 클라우드 서비스와 소셜 네트워크 서비스가 활성화되면서 스토리지 서버에 저장해야 할 데이터의 용량이 급격히 증가하고 있으며, 사용자의 고품질 미디어 데이터에 대한 높은 수요는 이러한 경향을 더더욱 가속화하고 있다. 이와 더불어 데이터의 효율적 참조를 통한 처리시간 감소는 이미 과거로부터 꾸준히 요구되어온 시스템 설계 주 고려사항이다. 이런 이유로 하이브리드 디스크의 효율적인 사용에 대한 많은 기술연구가 진행되고 있다. 그 핵심이라고 할 수 있는 리눅스 기반 SSD 캐시 기법은 내장된 DM-cache를 활용하여 구현하는데, 현재 이에 대한 최적화 관련 정책 연구가 많이 부족한 실정이다. 본 연구에서는, 다양한 환경에서 성능 평가를 통하여 현재 제공되고 있는 DM-cache의 문제점을 파악하였다. 그 결과, 일반 운영체제에서 실험한 DM-cache는 읽기 명령 시 나름대로의 효과를 보고 있지만, 특히 가상 머신이 탑재된 운영체제 환경에서는 DM-cache의 사용으로 인한 성능 개선을 찾을 수 없었으며 오히려 캐시 오버헤드로 성능 저하가 발생함을 확인하였다.

• 한국가스학회지
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• 제5권4호
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• pp.40-48
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• 2001

본 연구에서는 LPG 충전소에 대하여 Fussel-Vesely 중요도와 RDF 및 RIF 중요도를 수행하여 위험성 등급(Risk Rank)을 설정하였다 설정된 위험성 등급에서 위험성이 가장 큰 장치 및 설비에 대하여 정량적 위험성 분석을 수행하였다. LPG 충전소에 대한 중요도 분석결과 외부사고가 가장 위험하다고 확인되었으며, ekda 으로 구조물 결함과 파이프 배관의 부식의 위험등급이 높았다. 정량적 위험성 분석 결과로는 LPG 충전소 저장탱크의 완전히 파열하였을 경우에 대한 BLEVE의 경가 발생하였을 경우에 복사열에 의해 공정 설비에 손해를 입히기에 충분한 거리는 46.3m로 분석되었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.