• Elastomers and Composites
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• v.50 no.1
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• pp.55-61
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• 2015

Manufacturing process of OLED contains adsorption-desorption process of glass substrate. There are several adsorption methods of glass substrate such as atmospheric pressure, vacuum and electrostatic adsorption. However, these methods are very complex to connect system. Therefore, the adsorption method using silicone rubber based sticking chuck was proposed in this study. Three types of silicone rubbers having 0, 19.3 and 32.2 wt% of fluorine were used and their mechanical properties, surface energies and adsorption properties were examined. According to the results ${\sigma}_{300}$ and hardness increased with increasing fluorine contents, but elongation was decreased. Also, fluorosilicone rubber containing 32.2 wt% of fluorine showed the lowest surface tension, among three types of rubber and resulted in the highest initial tack with glass substrate. After the adsorption-desorption test of 300,000 cycles was performed, the adsorption force of S-1 (silicone rubber) decreased largely from 2.34 to 0.73 MPa. However, the S-3 (fluorosilicone rubber having 32.2 wt%. of fluorine) decreased only from 3.15 to 2.24 MPa. From this study, we obtained the valuable equations related to long term durability of silicone based sticking chuck. Finally the transfer of silicone rubber to glass substrate with the adsorption-desorption process was not occurred and this phenomenon was examined by UV-Visible spectroscopy.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.203.1-203.1
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• 2016

Poly etch 설비에서 발생하는 dechuck 불량에 의한 Dynamic Alignment(DA) error는 poly etch 설비에서의 고질 적인 문제이다. 발생 원인은 ElectroStatic Chuck(ESC)의 노후화 혹은process plasma에 의한 attack 등으로 ESC와 wafer간 dechucking이 진행될 때 wafer내의 전하가 완전히 discharge되지 못하여 wafer Sticking에 의한 sliding이 발생되며 심해지면 Dynamic Alignment(DA) Error가 발생한다. DA error 발생 되면 particle down으로 wafer는 scrap 되며 DA error가 지속적으로 발생하는 설비는 ESC 교체를 하고 있다. ESC 교체비용도 매우 크며 교체 전까지 설비가 멈추어있는 시간적인 손실이 발생하게 된다. Dechucking을 진행할 때 Wafer에 잔존하는 전하를 제거 하여 Wafer의 sticking을 줄여 DA error를 근원적으로 방지하기 위해 plasma를 이용하여 wafer와 ESC를 하나의 electric circuit으로 연결시키는 방법으로 wafer에 잔존하는 전하를 제거 시키고자 하였다.