• Advances in aircraft and spacecraft science
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• 제5권3호
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• pp.385-400
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• 2018

In this paper dynamic behavior (modal analysis and dynamic transient response) of a novel sandwich T-joint is numerically and experimentally investigated. An epoxy adhesive is selected for bonding purpose and making the step wise graded behavior of adhesive region. The effect of the step graded behavior of the adhesive zone on dynamic behavior of a sandwich T-joint is numerically studied. Finite element analysis (FEA) of the T-joints with carbon fiber reinforced polymer (CFRP) face-sheets is performed by ABAQUS 6.12-1 FEM code software. Modal analysis and dynamic half-sine transient response of the sandwich T-joint are presented in this paper. Two verification processes employed to verify the dynamic modeling of the manufactured sandwich panels and T-joint modeling. It has been shown that the step wise graded adhesive zone cases have changed the second natural frequency by about 5%. Also, it has been shown that the different arranges in the step wise graded adhesive zone significantly affect the maximum stresses due to transient dynamic loading by 1112% decrease in maximum peel stress and 691.9% decrease in maximum shear stress on the adhesive region.