• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.1092-1095
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• 2001

Steady state thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin with a thickness of 25${\mu}$m. It was assumed that the generated heat which is mainly by the on-state voltage drop, 9V for 12kV diode, is dissipated by way of the conduction through diodes layers to bonding wire and of the convection at the surface of passivating resin. It was predicted by the thermal analysis that the temperature rise of a pn junction of the 12kV diode can reach at the range of 16∼34$^{\circ}C$ under the given boundary conditions. The thickness and thermal conductivity(0.3∼3W/m-K) of the passivating resin did little effect to lower thermal resistance of the diode. As the length of the bonding wire increased, which means the distance of heat conduction path became longer, the thermal resistance increased considerably. The thermal analysis results imply that the generated heat of the diode is dissipated mainly by the conduction through the route of diode-dummy wafer-bonding wire, which suggests to minimize the length of the wire for the lowest thermal resistance.

• Journal of Biomedical Engineering Research
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• v.16 no.1
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• pp.67-76
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• 1995

Explosive evaporative removal process of biological tissue by absorption of a CW laser has been simulated by using gelatin and a multimode Nd: YAG laser. Because the point of maximun temperature of laser-irradiated gelatin exists below the surface due to surface cooling, evaporation at the boiling temperature is made explosively from below the surface. The important parameters of this process are the conduction loss to laser power absorption (defined as the conduction-to-laser power parameter, Nk), the convection heat transfer at the surface to conduction loss (defined as Bi), dimensionless extinction coefficient (defined as BrJ, and dimensionless irradiation time (defined as Fo). Dependence of Fo on Nk and Bi has been observed by experiment, and the results have been compared with the numerical results obtained by solving a 2-dimensional conduction equation. Fo and explosion depth (from the surface to the point of maximun temperature) are increased when Nk and Bi are increased. To find out the minimum laser power for explosive evaporative removal process, steady state analysis has been also made. The limit of Nk to induce evaporative removal, which is proportional to the inverse of the laser power, has been obtained.

• The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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• v.16 no.1
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• pp.103-108
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• 1987

The heat transfer processes taking place in the side wall of a thermocline enclosure have been analyzed for idealized conditions based on the assumption that, at any instant time, side wall heat transfer processses are independent of the thermocline bulk motion. However, the axial tempera-ture distribution in the thermocline core provides the means for specifying the liquid medium-side boundary condition to the enclosure side wall. A picture is drawn which reflects the side wan response to thermocline bulk motion within the frame work of a quasi-steady analytic approach. For valves of the parameters typical of systems of engineering interest, the analysis shows that a significant amount of heat transfer short - circuiting can take place along the side wall enclosure. This phenomenon is favored by high values of $H_l$ and low values of P and $H_g$ respec-tively. The location of the point of zero normal heat flux on the side wan can be expected to mark, approximately, the region of confluence of two sidewall boundary flows respectively driven by the buoyant effects.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2004.10a
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• pp.347-354
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• 2004

Using an efficient adjoint variable method, we develop a unified design sensitivity analysis (DSA) method considering both steady state nonlinear heat conduction and geometrical nonlinear elasticity problems. Design sensitivity expressions with respect to thermal conductivity and Young's modulus are derived. Beside the temperature and displacement adjoint equations, another coupled one is defined regarding the obtained adjoint displacement field as the adjoint load in temperature field. The developed DSA method is shown to be very efficient and further extended to a topology design optimization method for the nonlinear weakly coupled thermo-elasticity problems using a density approach.

• Journal of the Korean Institute of Telematics and Electronics
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• v.21 no.5
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• pp.90-99
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• 1984

A onetimensional distribution of the temperature and the heat source in the SOI (silicon-on-insulator) multi-layer structure illuminated by tungsten lamps from both sides was obtained by solving the heat equation in steady state on a finite difference grid using successive over-relaxation method. The heat source distribution was obtained by considering such features as spectral components of the light source, multiple reflection at the internal interfaces, temperature and frequency dependence of the light absorption coefficient, etc. The front and back surface temperatures, which are boundary conditions for the heat equation, were derived from a requirement that they satisfy the radiation conditions. The radiation flux as well as the conduction flux was considered in modelling the thermal behaviour at the internal interfaces. Since the temperature and the heat source profiles are strongly dependent upon each other, the calculation of each profile was iterated using the updated profile of the other until they are consistent with each other. The experimental temperature at the front surface of the wafer as measured by Pyrometer was about 1200$^{\circ}$K, while the simulated temperature was 1120$^{\circ}$K.

• Progress in Superconductivity and Cryogenics
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• v.3 no.1
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• pp.56-63
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• 2001

The thermal stability conditions are investigated for superconducting magnet systems cooled conductively by cryocooler without liquid cryogens. The worst scenario in the systems is that the heat generation in the resistive state exceeds the refrigeration. causing a rise in the temperature of the magnet winding and leading to the burnout. It is shown by an analytical solution that in the continuous resistive state, the temperature may increase indefinitely or a stable steady-state may be reached, depending upon the relative size of the magnet with respect to the refrigeration capacity of the cryocooler. The stability criteria include the temperature-dependent Properties of the magnet materials and the refrigeration characteristics of the cryocooler. A useful graphical scheme is Presented and discussed to demonstrate the physical importance of the results.

• Transactions of the Korean Society of Mechanical Engineers
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• v.7 no.4
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• pp.461-468
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• 1983

The series of experiments have been performed to study the transient heat transfer in air from a suddenly heated vertical thin wire. A platinum wire has been used as a resistance thermometer as well as a heating element to eliminate the disturbances in the measurements. The measured temperature as a function of time is compared with the calculated transient temperature with the aid of a pure conduction equation. The overshoot phenomena in terms of the Nusselt numbers have been detected and it is reasonable to define the delay time at which the onset of convection heat transfer occurs. The measured data are compared with the existing steady-state data and the agreements are reasonable within the comparable ranges.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 1996.10b
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• pp.193-205
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• 1996

This paper deals with experimental study on thermal characteristics that a cooling fluid is affected to ice ball as being measuring the temperature in storage tank and ice ball governing the rate of heat storage. Distributor was taken as inlet geometry factor. flow rate of cooling fluid which was a brine were 2, 4, and 6LPM, and 8, 10, and 12$^{\circ}C$ in the temperature difference for dynamic factors with respect to three ice ball types(103, 96, 76mm). In case of in flowing cooling fluid, since inertia force is suppressed by lower flow rate the amount of heat was transferred to ice ball by heat conduction high because density difference is high. And in case of larger ice ball, a long-term storage was available because reaching time at steady state is relatively long. consequently, smaller ice ball could be suitable to a short-term storage.

• Journal of the Korean Society of Industry Convergence
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• v.5 no.3
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• pp.219-224
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• 2002

We consider the problem y"=a(x,y)(y-b), y(0)=0, y'(1)=g(y(${\xi}$), y'(${\xi}$)), (0${\xi}$ fixed in(0,1)) as a model of steady-slate heat conduction in a rod when the heat flux at the end x = 1 is determined by observation of the temperature and heat flux at some interior point ${\xi}$. We establish conditions sufficient for existence, uniqueness.

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.3
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• pp.296-301
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• 2012

This paper describes an analytic method for infrared thermography to detect surface cracks in thin plates. Traditional thermographic method uses the spatial contrast of a thermal field, which is often corrupted by noise in the experiment induced mainly by emissivity variations of target surfaces. This study developed a robust analytic approach to crack detection for thermography using the holomorphic function of a temperature field in thin plate under steady-state thermal conditions. The holomorphic function of a simple temperature field was derived for 2-D heat flow in the plate from Cauchy-Riemann conditions, and applied to define a contour integral that varies depending on the existence and strength of singularity in the domain of integration. It was found that the contour integral at each point of thermal image reduced the noise and temperature variation due to heat conduction, so that it provided a clearer image of the singularity such as cracks.