• Analytical Science and Technology
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• v.5 no.2
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• pp.203-211
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• 1992

Fracture behavior and martensite substructure of Ni-36.5at.%Al alloy were investigated with the addition of vanadium which is known as scavenging element of grain boundary. The fracture surfaces were examined by scanning electron microscopy and the EDX spectrometer was applied for composition analysis of fracture surfaces. The substructure of martensite was studied by transmission electron microscopy. By addition of vanadium, fracture surfaces show mixed modes of intergranular and transgranular fracture and more Al content is found on the grain boundaries. For Ni-36.5at.%Al alloy, the planar faults observed in the martensite plates are the internal twins. By increasing the vanadium content, the modulated structure with stacking faults and dislocations dominates while the twinned martensite disappears. The stacking fault is determined to be extrinsic due to the substitution of V for Al. It is concluded that the segregation of sulfur on the high-energy state stacking fault area suppresses the intergranular fracture.

• Journal of the Korea Convergence Society
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• v.8 no.3
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• pp.185-190
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• 2017

This study investigates the bending stress, shear stress and deformation energy happening at the inner fiber structure when the bending moment is applied to he specimen with flat shape composed of carbon fiber. As CFRP is composed of innumerable fibers with multi-axes, the stress under bending condition can be effectively distributed. Theses stresses is shown to increase again at the starting point as this angle of $60^{\circ}$. Therefore, the condition at the stacking angle of $60^{\circ}$ is seen to become most adequate under the state where the bending stress happens. On the basis of this study result, the damage property by the bending at the plate due to stacking angle was examined through the analytic approach. it is thought that this study can be devoted to the safe design for damage prevention and durabilty improvement. Also, the esthetic sense can be shown as the designed factor of shape with flat plate is grafted onto the convergence technique.

• Proceedings of the Korean Society For Composite Materials Conference
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• 1999.11a
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• pp.57-62
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• 1999

In order to fabricate a involute construction structure, the pattern design for prepreg stacking was developed. For obtaining the demanded strength in the circumferencial and axial direction of the involute construction and tile proper processablity of prepreg stacking, the shaped pattern method was established which has a calculated length suitable for stacking. We can obtain the involute construction with clean interface between laminated plies and suitable dimension by using pattern design method developed in this study. Test specimens with varied arc angle were designed to test the structural properties of involute construction. Tensile and compressive strength decreased with the increase of arc angle. Tensile modulus and compressive failure strain were calculated under the conditon of transformation of material properties successfully.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.7
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• pp.759-766
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• 1988

the effect of heat treatment in oxygen ambient on the nucleation and growth of oxidation induced stacking faults(OSF) in n-type(100)silicon wafer has been investigated. The growth of OSF is determind as a function of oxygen concentration in silicon wafer, heat treatment time and temperature, and the activation energy for the growth of OSF can be obtained from the growth kinetics. The activation energies are respectively 2.66 eV for dry oxidation and 2.37 eV for wet oxidation. In this paper, we have also studied the structural feature of OSF with the comparison of optical microscopic morphology and crystalline structure.

• Journal of the Korean Ceramic Society
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• v.36 no.8
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• pp.863-870
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• 1999

SOI(silicon on insulafor) was fabricated through the direct bonding using (100) Si wafer and 4$^{\circ}$off (100) Si wafer to investigate the stacking faults in silicon at the Si/SiO2 oxidized and bonded interface. The treatment time of wafer surface using MSC-1 solution was varied in order to observe the effect of cleaning on bonding characteristics. As the MSC-1 treating time increased surface hydrophilicity was saturated and surface microroughness increased. A comparison of surface hydrophilicity and microroughness with MSC-1 treating time indicates that optimum surface modified condition for time was immersed in MSC-1 for 2 min. The SOI structure directly bonded using (100) Si wafer and 4$^{\circ}$off (100) Si wafer at the room temperature were annealed at 110$0^{\circ}C$ for 30 min. Then the stacking faults at the bonding and oxidation interface were examined after the debonding. The results show that there were anomalies in the gettering of the stacking faults at the bonded region.

• Advances in aircraft and spacecraft science
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• v.7 no.2
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• pp.151-168
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• 2020

The present study deals with the repair of composite structures by bonding composite patches. The composite structure is a carbon/epoxy laminate with stacking sequence [45/-45/0/90]S. The damaged zone is simulated by a central crack and repaired by bonding symmetrical composite patches. The repair is carried out using composite patches laminated from the same elemental folds as those of the cracked specimen. Three-dimensional finite element method is used to determine the energy release rate along the front of repaired crack. The effects of the repair technique used single or double patch, the stacking sequence of the cracked composite patch and the adhesive properties were highlighted on the variations of the fracture energy in mode I and mixed mode I + II loading.

• Proceedings of the KIEE Conference
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• 2004.11a
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• pp.194-196
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• 2004

$BaTiO_3/SrTiO_3$ heterolayered thick films on the $Al_2O_3$ substrate by screen printing method with stacking periodicity. The stacking periodicity of $BaTiO_3/SrTiO_3$ heterolayer structure was varied from $(BaTi_O_3)_1/(SrTiO_3)_1$ to $(BaTi_O_3)_3/(SrTiO_3)_3$. The total thickness of the $BaTiO_3/SrTiO_3$ films was about $120{\mu}m$. There was an interdiffusion at the interface of the $BaTiO_3$ and $SrTiO_3$ layers. The dielectric constant of $BaTiO_3/SrTiO_3$ heterolayered thick films was increased with decreasing stacking periodicity of the $BaTiO_3/SrTiO_3$. The dielectric constant of the ($(BaTi_O_3)_1/(SrTiO_3)_1$ herterolayered thick films was about 1780.

• Journal of the Korean Ceramic Society
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• v.34 no.2
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• pp.181-187
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• 1997

The layered BaTiO3 thin films with a high dielectric constant of polycrystalline BaTiO3 and a good in-sulating property of amorphous BaTiO3 were prepared. And their electrical properties were characterized with stacking methods. The BaTiO3 thin films were prepared by rf-magnetron sputtering technique using a ceramic target on Indium-doped Tin oxide coated glasses. A new stacking method resulted in higher dielec-tric constant, capacitance per unit area, and breakdown strength than those prepared by a conventional stacking method; the new method continuously decrease the substrate temperature after initial deposition of a polycrystalline BaTiO3 layer. The observed high dielectric constant could be explained only by a mul-tilayered amorphous/microcrystalline/polycrystalline structure, which was confirmed indirectly by AES depth profile.

• Composites Research
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• v.29 no.6
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• pp.342-346
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• 2016

Carbon fiber reinforced plastic (CFRP), one of lightweight materials, is the fiber structure using carbon fiber. It is the composite material that has the characteristics of carbon and plastic. As for the fiber structure, it has the great strength due to fiber direction. CFRP for woven type is used mostly as such a CFRP with lightweight. Woven type is more stable when compared with unidirectional type. On the other hand, woven type is highly priced. Therefore, this study aims to analyze the fiber structure of unidirectional CFRP. In this study, as the stacking angle [0/X/-X/0], X is the variable. This is unidirectional CFRP in which the angle phase of X has been reversed and stacked. By using such a unidirectional CFRP, the analysis model which had a crack at the center as the form of panel with the thickness of 2 mm was used. On analysis, the load is applied on the upper and lower parts being connected with a pin. The damage in the area near center crack was investigated. As for the analysis model, 3D surface model was designed by using CATIA. For CFRP stacking, the stacking direction was determined by using ACP in ANSYS program and the analysis model with two stacks was made. Afterwards, the structural analysis was carried out.

• Applied Microscopy
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• v.27 no.3
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• pp.257-263
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• 1997

Microstructural characterizations of II-VI blue laser diodes which consist of quaternary $Zn_{1-x}Mg_xS_ySe_{l-y}$ cladding layer, ternary $ZnS_ySe_{l-y}$ guiding layer and $Zn_{0.8}Cd_{0.2}Se$ quantum well as active layer were carried out using the transmission electron microscope working at 300 kV. Even though the entire structure is pseudomorphic to GaAs substrate, the structure had contained numerous extended stacking faults and dislocations which had created at ZnSe/GaAs interfaces and then further grown to the top of the epilayers. These faults might be expected to cause the degradation and shortening the lifetime of laser devices.