• Advances in materials Research
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• 제2권4호
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• pp.195-208
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• 2013

A comprehensive theory of the spin coating technique has been reviewed and the basic principles and parameters controlling the process are clearly highlighted, which include spin speed, spin time, acceleration and fume exhaust. The process generally involves four stages: a dispense stage, substrate acceleration stage, a stage of substrate spinning at a constant rate and fluid viscous forces dominate fluid thinning behaviour and a stage of substrate spinning at a constant rate and solvent evaporation dominates the coating thinning behaviour. The study also considered some common thin film defects associated with this technique, which include comet, striation, chucks marks environmental sensitivity and edge effect and possible remedies.

• 반도체디스플레이기술학회지
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• 제2권1호
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• pp.25-29
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• 2003

The fluid flow, mass transfer, heat transfer and film thickness variation during the spin coating process are numerically studied. The model is said to be I-dimensional because radial variations in film thickness, concentration and temperature are ignored. The finite difference method is employed to solve the equations that are simplified using the similarity transformation. In early time, the film thinning is due to the radial convective outflow. However that slows during the first seconds of spinning so the film thinning due to evaporation of solvent becomes sole. The time varing film thickness is analyzed according to the wafer spin speed, the various solvent fraction in the coating liquid, and the various solvent vapor fraction in the bulk of the overlying gas during the spin coating is estimated.

• 한국전기전자재료학회논문지
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• 제35권1호
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• pp.58-65
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• 2022

The field of liquid crystal display (LCD) is constantly in the spotlight and the process of depositing an alignment layer in the LCD manufacturing process is very important to obtain excellent performance such as low-power driving and high-speed response to improve LCD performance. Therefore, research on liquid crystal (LC) alignment is being actively conducted. When manufacturing LCD, it is necessary to consider the effect of the alignment layer thickness as one of the factors affecting various LCD performances. In addition, previous studies confirmed the LC alignment characteristics correlate with the rotation speed in the spin coating process. Therefore, the electro-optical properties of the LCD were investigated by manufacturing a polyimide alignment layer by varying the rotation speed in the spin coating process in this study. It was confirmed that the thickness of the polyimide alignment layer was controlled according to the spin coating conditions. The average transmittances of anti-parallel LC cells at the spin coating speed of 2,500 rpm and 3,000 rpm are about 60%, which indicates that the LC cell has relatively higher performance. At the spin coating speed of 3,000 rpm, the voltage-transmittance curve of twisted nematic (TN) LC cell was below 1.5 V, which means that the TN LC cell operated at a low power. In addition, high-speed operating characteristics were confirmed with a response time of less than 30 ms. From these derived data, we confirmed that the ideal spin coating speed is 3,000 rpm. And these results provide an optimized polyimide alignment layer process when considering enhanced future LCD manufacturing.

• 한국소음진동공학회논문집
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• 제11권4호
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• pp.31-36
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• 2001

A spin coater is a machine to coat wafer or LCD display with thin film. Vibration in the spin coater may be one of main troubles in the coating process. In this paper, we focus on the difference between two spin coaters. Vibration sources are identified by experimental approach and are compared to find the difference between the two spin coaters. Also, the particle concentration is observed by laser particle counter (LPC) for the two spin coaters, when the spin coaxers are working. It is also considered whether the defect rate is proportional to the particle concentration. The result shows that particle generation in the coating process is related to excessive vibration of the spin coater shaft and the particles influence the defect rate of the thin film product.

• Advances in materials Research
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• 제2권4호
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• pp.181-193
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• 2013

Description and theory of spin coating technique has been elaborately outlined and a spin coating machine designed and fabricated using affordable components. The system was easily built with interdisciplinary knowledge of mechanics, fluid mechanics and electronics. This equipment employs majorly three basic components and two circuit units in its operation. These include a high speed dc motor, a proximity sensor mounted at a distance of about 15 mm from a reflective metal attached to the spindle of the motor to detect every passage of the reflective metal at its front and generate pulses. The pulses are transmitted to a micro-controller which process them into rotational speed (revolution per minute) and displays it on a lead crystal display (LCD) which is also a component of the micro-controller. The circuit units are a dc power supply unit and a PWM motor speed controlling unit. The various components and circuit units of this equipment are housed in a metal casing made of an 18 gauge black metal sheet designed with a total area of 1, $529.2cm^2$. To illustrate the use of the spin-coating system, ZnO sol-gel films were prepared and characterized using SEM, XRD, UV-vis, FT-IR and RBS and the result agrees well with that obtained from standard equipment and a speed of up to 9000 RPM has been achieved.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.115-116
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• 2008

The ferroelectric vinylidene fluoride-trifluoroethylene ($VF_2$-TrFE) and $Al_2O_3$ passivation layer for the Metal/Insulator/Ferroelectric/Semiconductor (MIFS) structure were deposited using spin coating and remote plasma atomic layer deposition (RPALD), respectively. A 2.5 ~ 3 wt % diluted solution of purified vinylidene fluoride-trifluoroethylene ($VF_2$: TrFE=70:30) in a DMF solution were prepared and deposited on silicon wafer at a optimized spin speed. After annealing in a vacuum ambient at 150 ~ $200^{\circ}C$ for 60 min, upper insulator layer were deposited at temperature ranging from 100 ~ $150^{\circ}C$ by RPALD. We described electrical and structural properties of MIFS fabricated by spin coating and RPALD methods.

• 한국생산제조학회지
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• 제9권6호
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• pp.96-102
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• 2000

Spinning mechanism is generally used in coasting process on grass plates. Rebounding PR(Photo Resist) which leads to occur inferiority of coating process is caused by vibrational energy of whole coating system. In this study, the sensitivity analysis is performed to analyze and reduce vibrational terms in the spin coating system. The sensitivity analysis is bared on the numerical expression of this system. By the bond graph method. power flow of each system is represented by some basic bond graph elements. Any energy domain system is modeled using the unified elements. The modelled spin coater system is verified with power spectrum data measured by FFT analyzer. As the results of verifying model parameters and sensitivity analysis, principal factors causing vibration phenomenon are mentioned. A study on vibration method in the spin coating system is discussed.

• 한국세라믹학회지
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• 제44권12호
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• pp.733-739
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• 2007

NiO-YSZ anode-supported single cell was prepared by spin-coating YSZ and LSM slurries as electrolyte and cathode, respectively. Dense YSZ electrolyte film was successfully prepared on the porous NiO-YSZ anode substrate by tuning pre-sintering temperature of NiO-YSZ and co-firing temperature. The thickness of YSZ film was controlled by the solid content of slurry and coating cycles. The experimental conditions affecting on the thickness of YSZ film was discussed. Single cells with the active electrode area ${\sim}0.8\;cm^2$ were prepared by spin-coating the cathode layers of LSM-YSZ mixture and LSM consequently as well. The effects of the pre-sintering temperature and thus the microstructure of NiO-YSZ substrate on the current-voltage characteristics of co-fired cell were investigated.

• Environmental Engineering Research
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• 제24권4호
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• pp.646-653
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• 2019

Recovery of valuable metals in the industrial wastewater and sludge has attracted an attention owing to limited metallic resources in the earth. In this study, we firstly fabricated Ti/Ir-Ru electrodes by spin coating technique for effective recovery of Cu in electrowinning process. Two different Ti/Ir-Ru electrodes were fabricated using 100 and 500 mM of precursors (i.e., Ir-Ru). SEM-EDX and AFM revealed that Ir and Ru were homogenously distributed on the surface of Ti plate by the spin coating, in particular the electrode prepared by 500 mM showed distinct boundary line between Ir-Ru layer and Ti substrate. XRD, XPS, and cyclic voltammetry also revealed that characteristics of IrO₂, RuO₂, and TiO₂ and its electrocatalytic property increased as the concentration of coating precursor increased. Finally, we carried out Cu recovery experiments using two Ti/Ir-Ru as anodes in electrowinning process, showing that both anodes showed a complete removal of Cu (1 and 10 g/L) within 6 h reaction, but much higher kinetic rate constant was obtained by the anode prepared by 500 mM. The findings in this study can provide a fundamental knowledge for surface characteristics of Ti/Ir-Ru electrode prepared by spin coating method and its potential feasibility for effective electrowinning process.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집B
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• pp.59-64
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• 2001

The fluid flow, mass transfer and film thickness variation during a wafer spin coating process are numerically studied. Governing equations for the cylindrical coordinates are simplified using the similarity transformation and solved efficiently using the finite difference method. Concentration dependent viscosity and the binary diffusivity of the coating liquid are used in the analysis. The time variational velocity components of the coating liquid and the film thickness are analyzed according to the various spin speed. When the evaporation is considered, the flow decease in the early times due to the increase of the viscosity and the resultant flow resistance. Effects of the two film thinning mechanism, the flow-out and evaporation are also considered in the analysis.