• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.13 no.1
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• pp.31-40
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• 2009

In the present work transformation of dimensionless heat diffusion equation for the solution of moving boundary problems have been formulated. The formulation is based on 1-D, 2-D and 3-D, unsteady heat diffusion equations. These equations are rst turned int dimensionless form by using dimensionless quantities and their transformation was formulated in liquid and solid phases. The salient feature of this work is that during the transformation of dimensionless heat diffusion equation there arises a convective term $\tilde{v}$ which is responsible for the motion of interface in liquid as well as solid phase. In the transformed heat equation, a correction factor $\beta$ also arises naturally which gives the correct transformed flux at interface.

• 한국전산유체공학회:학술대회논문집
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• 2008.03b
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• pp.658-659
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• 2008

Numerical simulation is performed for a microdroplet deposition on the pre-patterned micro-structure. The liquid-air interface is tracked by level set method improved by incorporating the ghost fluid approach based on a sharp-interface representation. The method is further extended to treat the contact angle condition at an immersed solid surface. The present computation of a patterning process using microdroplet ejection demonstrates that the multiphase characteristics between the liquid-gas-solid phases can be used to overcome the patterning error.

• Journal of Korea Foundry Society
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• v.10 no.5
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• pp.426-434
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• 1990

Continuous casting of the Al-Cu-Ni ternary eutectic alloys was carried out by the upward continuous casting process. The morphology of the ternary eutectic growth and the stability of solid-liquid interface were investigated under various growth conditions. It was possible to get the planar solid-liquid interface at the condition of $G_L/R＝3.59{\times}10^3^{\circ}C\;sec/mm^2$ in Al-Cu-Ni ternary eutectic alloys. In Al-rich, Ni-rich and Cu-rich hypereutectics of Al-Cu-Ni ternary alloys, primary ${\alpha},\;{\tau}\;and\;{\theta}$ dendrites have grown as the leading phase ahead of the ternary eutectic composites.

• Journal of Korea Foundry Society
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• v.12 no.3
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• pp.203-209
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• 1992

Directional solidification of Al-Ti peritetic alloys was carried out using Upward Continuous Casting Process. The morphology of a solid-liquid interface and solidification microstructures were investigated under various crystal growing conditions. The experimental results were compared with those attained by the Bridgman method. The cell spacing of the Al-Ti peritetic alloys and the primary dendrite arm spacing of the Al-Ti peritetic alloys decreased with an increase in pulling speed. The primary ${\beta}$ phase of the Al-Cr and Al-Ti peritectic alloys did not appear in solidification microstructures because of the depleted solute contents in the melt ahead of the solid-liquid interface.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.65-66
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• 2002

One aspect of the stiction problem may be explained by the action of capillary forces in conjunction with surface elasticity. In the present work, the interaction between two elastic half-spaces separated by a small liquid bridge is investigated. By minimizing the total free energy stored in the interface (including elastic energy and surface energy), the equilibrium interface geometry is determined analytically in the case where there is no solid-solid contact. A non-dimensional number, $N_c=299\frac{{\gamma}^2_{LA}cos^2{\theta}V_o}{E^{'2}H^5}$ is found to govern the structure stability. When $N_c{\ge}1$, the two surfaces jump into solid-solid contact and, once this occurs, the contact area will continue to expand until the two surfaces are in full contact.

• Journal of Welding and Joining
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• v.19 no.4
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• pp.423-428
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• 2001

The bonding phenomena of Ni base single crystal superalloy. CMSX-4 during transient liquid phase(TLP) bonding was investigated using MBF-80 insert metal. Bonding of CMSX-4 was carried out at 1,373∼1,548K for 0∼19.6ks in vacuum. The (001) orientation of each test specimen was aligned perpendicular to the bonding interface. The dissolution width of base metal was increased when the bonding temperature and holding time were increased. The eutectic width diminished linearly with the square root of holding time during isothermal solidification process. Borides were formed in the bonded layer during TLP bonding operation. The solid phase grew epitaxially into the liquid phase from substrates and single crystallization could be readily achieved during the isothermal solidification.

• 한국전산유체공학회:학술대회논문집
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• 2010.05a
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• pp.548-550
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• 2010

The droplet motion on a flat substrate with contact angle hysteresis is studied by solving the equations governing the conservation of mass and momentum. The liquid- gas interface is determined by an level-set method which is based on a sharp-interface representation for accurately imposing the matching or coupling conditions at the interface. The method is modified to treat the dynamic contact angle at the liquid-gas-solid interface. The computations are performed to investigate a droplet impact and merging pattern on a flat substrate to find a optimal condition in a micro-line patterning process. The effects of dynamic contact angles on droplet motion are quantified.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.1 no.4
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• pp.319-329
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• 1989

Heat transfer phenomena during inward melting and solidification process of the phase change material were studied expertimentally. The phase change medium was 99% pure n-docosane paraffin ($C_{22}H_{46}$). The solid-liquid interface motion during phase change was recorded photographically. Measurements were made on the temperature, the solid-liquid interface, the melted or frozen mass and the various energy components stored or extracted from the cylinder wall. For melting, the experimental results reaffirmed the dominant role played by the conduction at an early stage, by the natural convection at longer time. For solidification, natural convection effects in the superheated liquid were modest and were confined to short freezing time. Although the latent energy is the largest contributor to the total stored or extracted energy, the aggregate sensible energies can make a significant contribution, especially at large cylinder wall superheating or subcooling, large initial phase change material subcooling or superheating.

• Korean Journal of Materials Research
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• v.9 no.4
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• pp.335-340
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• 1999

The hot cracking phenomena and phase behaviors during hot working process of Cu-Ni bearing hot rolled steels were investigated by a $90^{\circ}$bending tests, BSE image analysis and EDS analysis. For aNi-free 1.2% Cu bearing steel, the surface hot cracking occurred about $1100^{\circ}C$ due to a liquid state Cu-enriched phase formed continuously at the interface between oxide scale and matrix. The liquid Cu-enriched phase penetrated into austenite grain boundaries and caused surface cracking during the hot working. In case of 0.6% Ni containing 1.2% Cu-Ni bearing steel, solid state Cu-Ni-riched phase existed at the scale/matrix interface as a discontinuous type. But the higher addition of 1.2% Ni, solid state Ni-Cu-riched phase was formed dominantly in the oxide scale. It was found that the addition of Ni suppressed the surface cracking of 1.2% Cu bearing steel by eliminating the liquid state Cu-enriched phase.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.798-802
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• 2002

Metallurgical studies on the bonded interlayer of directionally solidified Ni-base superalloy GTD111 joints were carried out during transient liquid phase bonding. The formation mechanism of solid during solidification process was also investigated. Microstructures at the bonded interlayer of joints were characterized with bonding temperature. In the bonding process held at 1403K, liquid insert metal was eliminated by well known mechanism of isothermal solidification process and formation of the solid from the liquid at the bonded interlayer were achieved by epitaxial growth. In addition, grain boundary formed at bonded interlayer is consistent with those of base metal. However, in the bonding process held at 1453K, extensive formation of the liquid phase was found to have taken place along dendrite boundaries and grain boundaries adjacent to bonded interlayer. Liquid phases were also observed at grain boundaries far from the bonding interface. This phenomenon results in liquation of grain boundaries. With prolonged holding, liquid phases decreased gradually and changed to isolated granules, but did not disappeared after holding for 7.2ks at 1473K. This isothermal solidification occurs by diffusion of Ti to be result in liquation. In addition, grain boundaries formed at bonded interlayer were corresponded with those of base metal. In the GTD-ll1 alloy, bonding mechanism differs with bonding temperature.