• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.464-466
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• 2009

This study tried to examine the suitability of strip casting process such as PFC (Planar Flow Casting) method for soldering Au-Sn strip. The effect of heat treatment on the tensile behavior and mechanical properties of an Au-Sn strip was investigated through tensile test, micro hardness test, X-ray diffraction (XRD), SEM, and TEM observations. It was apparent that 20-mm width Au-Sn strip could be well produced by using planar flow casting process. Tensile results showed that tensile strength increased from 338.3MPa to 310MPa and plastic strain improved from 0% to 1.5% with heat treatment ($170^{\circ}C$/70 hrs.). The microstructure of Au-Sn strip mainly consisted of two phases; $Au_5Sn(\zeta)$ and AuSn($\sigma$). It was also found that inhomogeneous amorphous local structure continuously changed to the homogeneous two phases microstructure with heat treatment. The fractographical observation after tensile test indicated the cleavage fracture mode of as-casted Au-Sn strip. On the other hand, the heat treated Au-Sn strip showed that fracture propagated along interface between brittle AuSn and ductile $Au_5Sn$ phases. The deformation behavior of strip casted Au-Sn alloy with microstructural evolution and the improve method for ductility of this alloy was also suggested.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.161-162
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• 2005

2G HTS coated conductor wire consists of textured substrate, buffer layer, superconduct layer, Ag cap layer, stabilizer. For practical application filed, coated conductor have mechanical and electrical stability and environment protection properties. This property Cu and stainless steel strip is laminated to Ag cap layer as stabilizer materials. Lamination process join stabilizer material strip and Ag cap layer with soldering method. we have laminated HTS with continuous dipping soldering process different stabilizer Cu and stainless steel strip and changed lamination process condition. The effect of lamination stabilizer and process condition has been investigated mechanical and electrical properties.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.262-263
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• 2005

For mechanical and electrical stability and environment protection, Cu and stainless steel stabilizer is laminated to Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. this architecture allows the wire to meet operational requirements including stresses at cryogenic temperature, winding tensions, mechanical bending requirements thermal and electrical stability under fault conditions. we have experimentally studied mechanical properties of laminated stainless steel stabilizer on YBCO coated conductors. we have laminated YBCO coated conductors by continuous dipping soldering process. we have investigated lamination interface between solder and stabilizer, YBCO coated conductor. we evaluated bonding properties tensile / shear bonding strength, peeling strength laminated YBCO coated conductors.

• 한국초전도ㆍ저온공학회논문지
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• 제8권3호
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• pp.23-26
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• 2006

For mechanical and electrical stability and environment protection. Cu and stainless steel stabilizers are laminated to a Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. This architecture allows the wire to meet operational requirements including stresses at cryogenic temperature. winding tensions as well as mechanical bending requirements including thermal and electrical stability under fault current conditions. We have experimentally studied mechanical properties of the laminated stainless steel and Cu stabilizers on YBCO coated conductors. We have laminated YBCO coated conductors by continuous dipping soldering process. We have investigated lamination interface between solder and stabilizer of the YBCO coated conductor. We evaluated bonding properties. tensile / shear bonding strength. and peeling strength laminated YBCO coated conductors.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.1033-1036
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• 2002

Wafer bonding methods such as fusion and anodic bonding suffer from high temperature treatment, long processing time, and possible damage to the micro-scale sensor or actuators. In the localized bonding process, beating was conducted locally while the whole wafer is maintained at a relatively low temperature. But previous research of localized heating has some problems, such as non-uniform soldering due to non-uniform heating and micro crack formation on the glass capsule by thermal stress effect. To address this non-uniformity problem, a new heater configuration is being proposed. By keeping several points on the heater strip at calculated and constant potential, more uniform heating, hence more reliable wafer bonding could be achieved. The proposed scheme has been successfully demonstrated, and the result shows that it will be very useful in hermetic packaging. Less than 0.2 ㎫ contact Pressure were used for bonding with 150 ㎃ current input for 50${\mu}{\textrm}{m}$ width, 2${\mu}{\textrm}{m}$ height and 8mm $\times$ 8mm, 5mm$\times$5mm, 3mm $\times$ 3mm sized phosphorus-doped poly-silicon micro heater. The temperature can be raised at the bonding region to 80$0^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional micro heaters. For gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for gross leak check. The pass ratio of bonded dies was 70%, for conventional localized heating, and 85% for newly developed FP scheme. The bonding strength was more than 30㎫ for FP scheme packaging, which shows that FP scheme can be a good candidate for micro scale hermetic packaging.

• 대한치과보철학회지
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• 제36권6호
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• pp.858-866
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• 1998

Soldering is the usual method used to correct an unstable fixed partial denture framework at patient's try-in; However, presoldering base metal alloys is technique-sensitve and results are unstable because it is difficult to maintain uniform heat distribution and to prevent oxidation of an alloy. A cast-joining technique has been developed by Weiss and Munyon for repair, correction and addition to base metal framework. This joining technique eliminates the problem with presoldering of non-precious frameworks. The object of this study was to 1) compare the relative flexure strength and the joining effectiveness of Ni-Cr-Be cast in two pieces and 'pre-soldered' versus in two pieces and 'cast-joined'. 2) determine the effect of increasing the number of retentive grooves on the face of the cast and 3) determine the effect of the relative matched position of groove patterns on flexure strength. The joining effectiveness can be expressed by the ratio of the mean flexure stress of soldered or cast-joined specimens to that of one-piece cast. Resin rods 3mm in diameter were used as pattern of specimens for one-piece casted, presoldered, and cast-joined groups. Cast-joined specimens had two different patterns of retentive grooves on the joined faces. Type A had cross-shaped grooves 1mm in depth. 0.6mm in width. Type B was the same except for the addition of one more retentive groove. In the experiment connecting cast-joined specimens, half of specimens with type A pattern had their patterns on the faces of paired casts matched with each other as mirror image. With the rest pairs, it was proceeded that one of paired casts turned 45 degrees so that the patterns crossed. Half of specimens with type B pattern also had the patterns matched as mirror image; However, here, one of paired casts turned 90 degrees with the other pairs. Retentive groove in this study lacked the intentional undercuts, in contrast with the suggestion of Weiss and Munyon. The specimens were subjected to four-point flexural loading in an Instron testing machine. The midspan flexural stress was calculated at the point of initial plastic strain as determined from a strip-chart recorder or at the point of failure if this occured at a lower stress level. Within the scope of this study, the following results were obtained. 1. The presoldered group showed flexural strength at least 2 times higher than the cast-joined groups. Its joining effectiveness was 82%. 2. In cast-joined groups, the flexural strength of joints with type B patterns exhibited 1.5 times that of joints with type A patterns. Joining effectivenesses were 38% for type B patterns, 25-26% for type A patterns. 3. The relative matched position of groove patterns did not have any significant effect on flexural strength of the cast-joined specimens with either type A patterns or type B patterns(p>.05).