• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.9-15
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• 2018

This paper shows the principles and characteristics of the transient liquid phase (TLP) bonding technology for power modules packaging. The power module is semiconductor parts that change and manage power entering electronic devices, and demand is increasing due to the advent of the fourth industrial revolution. Higher operation temperatures and increasing current density are important for the performance of power modules. Conventional power modules using Si chip have reached the limit of theoretical performance development. In addition, their efficiency is reduced at high temperature because of the low properties of Si. Therefore, Si is changed to silicon carbide (SiC) and gallium nitride (GaN). Various methods of bonding have been studied, like Ag sintering and Sn-Au solder, to keep up with the development of chips, one of which is TLP bonding. TLP bonding has the advantages in price and junction temperature over other technologies. In this paper, TLP bonding using various materials and methods is introduced. In addition, new TLP technologies that are combined with other technologies such as metal powder mixing and ultrasonic technology are also reviewed.

• 소성∙가공
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• 제29권6호
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• pp.307-315
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• 2020

The cemented carbide and stainless steel were bonded using a hot-vacuum brazing method to analyze the bonding interface. Since it is suitable for the hot vacuum brazing, nickel metal was used as a binder among the main components of the cemented carbide, and a new cemented carbide material was developed by adjusting the alloy composition. The paste, which is one of the important factors affecting the hot vacuum brazing bonding, was able to improve brazing adhesion by mixing solder as Ni powder and a binder as an organic compound at an appropriate ratio. Division of the stainless steel yielded a dense brazing result. This study elucidated the interfacial characteristics of wear-resistant parts by bonding stainless steel and cemented carbide via hot vacuum brazing.

• 한국초전도ㆍ저온공학회논문지
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• 제14권3호
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• pp.1-4
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• 2012

Effects of artificial holes on the cooling efficiency of single grain YBCO bulk superconductors were studied. Single grain YBCO bulk superconductors without artificial holes, with six 2.4 mm holes and six holes filled with Bi-Pb-Cd-Sn metal solder were fabricated by a top-seeded melt growth process for powder compacts with/without holes. Simulation for the cooling rate to a liquid nitrogen temperature (77 K) of YBCO samples was carried out using a finite element method (FEM) and the results are compared with the actual cooling rates of samples in liquid nitrogen. The simulated cooling times for the YBCO sample without holes, with six holes and with six holes filled with the metal solder were 80, 47 and 75 sec. respectively, which are similar to the actual cooling times of 84, 52 and 78 sec. estimated for the same samples cooled in liquid nitrogen. The shorter cooling time of the sample with artificial holes are attributed to the increased surface areas associated with the presence of artificial holes. The metal filling into the holes did not give any remarkable effect on the cooling efficiency.

• 한국세라믹학회지
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• 제21권4호
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• pp.349-354
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• 1984

The purpose of present study is to find the structure crystallization mechanism and physical properties in $TiO_2$ containing lead zinc borosilicate glass system. The experiments such as differential thermal analysis infrared spectral analysis. X-ray diffraction analysis and thermal expansion measurements have been done. Differential thermal analysis of coarse and fine glass powder showed bulk nucleating mechanism for high $TiO_2$ containing glasses and surface nucleation mechanism for low $TiO_2$ containing glasses. The prepared glasses crystallized to crystalline mixture of PbO.2ZnO. $B_2O_3$ .4PbO.2ZnO.$5B_2O_3$and 2PbO.ZnO.$B_2O_3$ when heat-treated in the range of 480 and 51$0^{\circ}C$ and crystallized to PbTiO3 when heat-treated at $600^{\circ}C$. Obtained crystalline phase of $PbTiO_3$ in glass matrix strongly affects to thermal expansion coefficient and the value of crystallized glass varied 68.0 to $107.1{\times}10-7$/$^{\circ}C$ depending on the amount of $TiO_2$added. Infrared spectral analysis showed that [$BO_3$] triangle and [$BO_3$] tetrahedral units were coexisted in the glass with high content of PbO.

• 한국재료학회지
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• 제11권7호
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• pp.562-568
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• 2001

60ZnO-20B$_2$O$_3$-10SiO$_2$-10PbO의 조성을 가진 결정성 봉착용 유리분말과 ZrB$_2$분말을 출발물질로 사용하여 Na분위기 하에서 소결한 복합소결체를 저항체 후막으로써 사용가능성을 검토하였다. 도전성입자 ZrB$_2$는 소결중 매우 민감한 산화특성을 나타내었으며, 이것은 로내 또는 시편내에 잔류된 미량의 산소 및 유리성분 중 B$_2$O$_3$의 반응에 의한 배위수 변화과정에서 유리되는 산소가 원인으로 될 수 있다는 것을 시편의 밀도 및 부피변화 등을 통해 확인되었다. 각 혼합물의 소결온도와 혼합비 변화에 따라 내부조직의 변화와 함께 10~$10^{5}{\Omega}/cm^2$정도의 제어 가능한 저항값을 얻을 수 있었다. 이러한 결과들로부터 유리기지 중에서 ZrB$_2$입자들의 치밀화 경향을 갖는 복합소성시편들에 대한 거시적인 관점에서 도전성경로형성 및 도전기구를 설명하였다.

• 미래기술융합논문지
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• 제2권4호
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• pp.1-6
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• 2023

파워인덕터 생산용 표면 UV 인쇄장치 성능 연구는 원기둥 자석의 자력 형성이 상, 하로 형성되게 제작함으로써 제품 고정 시 제품이 뒤집히거나, 세워지는 현상을 방지하는 기술을 적용하여 인쇄 진행 시 품질 소모성 자재(제판, Squeegee)의 파손을 방지하고, 인쇄 품질을 향상시킬 수 있다. 자력의 방향을 바꾼 원기둥 자석의 개발로 파우더 압축으로 제작한 메탈 소재 제품에 대한 고정 방법이 안정화 되어 소형 제품에 대한 생산 능력이 증대할 것이다. 최종적으로 원기둥 자석을 활용한 파워인덕터 표면 UV 인쇄 장치를 연구함으로써, 기존 작업 진행하던 스프레이, Deeping 방식과 차별성을 둘 수 있고, 생산량이 크게 향상될 것이며 결과적으로는 인원 감축으로 원가절감 및 경쟁력 있는 제품 생산을 할 수 있을 것이다.