• 제목/요약/키워드: solder joint reliability

검색결과 172건 처리시간 0.023초

친환경 무연솔더를 적용한 수동부품의 솔더 접합부 전단강도 비교 (Shear Strength Comparison of Passive Component Using the Environmental-Friendly Lead-Free Solder)

  • 송병석;조재립
    • 한국품질경영학회:학술대회논문집
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    • 한국품질경영학회 2006년도 춘계학술대회
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    • pp.375-380
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    • 2006
  • Recently European Council(EU) published the RoHS(restriction of the use of certain hazardous substances in electrical and electronic equipment) which is prohibit the use of Pb, Hg, Cd, $Cr^{+6}$, PBB or PBDE in the electrical and electronic equipments. So EU member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain 6 hazardous substances. So many kinds of projects is proceeding to ensure the reliability of Pb-free electronics in the worlds. Especially it is necessary to evaluate of Pb-free solder joints in electronics. Therefore, on this paper, we compared with solder joint strength of chip components, respectively SnPb, Pb-free solder as follows reliability test methods. We also measured the shear strength of solder joint and also compared the effects of environmental test methods. In this results, we analyzed and compared the shear strength variation as follows solder materials and reliability test conditions.

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Low Ag 조성의 Sn-0.3Ag-0.7Cu 및 Sn-3.0Ag-0.5Cu 무연솔더 접합부의 열충격 신뢰성 (Thermal Shock Reliability of Low Ag Composition Sn-0.3Ag-0.7Cu and Near Eutectic Sn-3.0Ag-0.5Cu Pb-free Solder Joints)

  • 홍원식;오철민
    • 대한금속재료학회지
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    • 제47권12호
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    • pp.842-851
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    • 2009
  • The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.

A Study on the/ Correlation Between Board Level Drop Test Experiment and Simulation

  • Kang, Tae-Min;Lee, Dae-Woong;Hwang, You-Kyung;Chung, Qwan-Ho;Yoo, Byun-Kwang
    • 마이크로전자및패키징학회지
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    • 제18권2호
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    • pp.35-41
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    • 2011
  • Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

다층 박막 광학 필터 디바이스의 패키징시 솔더 조인트의 피로파괴 수명 해석 (Fatigue Life Analysis for Solder Joint of Optical Thin Film Filter Device)

  • 김명진;이형만
    • 마이크로전자및패키징학회지
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    • 제10권2호
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    • pp.19-26
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    • 2003
  • 광통신용 광학부품의 신뢰성 특성은 솔더 조인트의 열 사이클에 따른 소성(Plastic)과 크립(Creep) 변형에 가장 큰 영향을 받는다. 열 사이클에 따른 소성과 크립 변형 증가로 인해 정렬 틀어짐이 발생하며 이는 광손실 변화의 주요인이 된다. 또한, 소성과 크립 변형량이 증가 또는 계속 누적이 될 경우 솔더의 피로수명 한계로 인해 제품 불량 발생의 원인이 된다. 이러한 열적 사이클에 따른 광부품의 신뢰성을 확보하기 위해 본 논문에서는 유한요소해석법(FEM)을 적용하였다. 소성과 크립 변형의 변화량을 유한요소해석으로 계산하고 이를 크립 피로 파괴(Creep-Fatigue) 수명 예측 모델에 적용하여 그 수명을 예측하였다. 솔더와 모재와의 계면 또는 솔더 내부에서 생성되는 온도에 따른 소성과 크립 변형을 파악하기 위해 텔코디아(Telcordia)의 광부품 신뢰성 온도 사이클(-40 to 75)을 적용하였다. 승온과 냉각 속도의 변화에 따른 영향을 검토하기 위해 1/min, 10/min 및 50/min으로 변화를 주고 유지 시간을 1시간으로 고정할 경우의 결과를 비교 분석하였다.

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SAC 305솔더와 ENIG 기판의 접합강도에 미치는 저주파 수소라디칼처리의 영향 (Improvement of Solder Joint Strength in SAC 305 Solder Ball to ENIG Substrate Using LF Hydrogen Radical Treatment)

  • 이아름;조승재;박재현;강정윤
    • Journal of Welding and Joining
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    • 제29권1호
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    • pp.99-106
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    • 2011
  • Joint strength between a solder ball and a pad on a substrate is one of the major factors which have effects on electronic device reliability. The effort to improve solder joint strength via surface cleaning, heat treatment and solder composition change have been in progress. This paper will discuss the method of solder ball joint strength improvement using LF hydrogen radical cleaning treatment and focus on the effects of surface treatment condition on the solder ball shear strength and interfacial reactions. In the joint without radical cleaning, voids were observed at the interface. However, the specimens cleaned by hydrogen-radical didn't have voids at the interface regardless of cleaning time. The shear strength between the solder ball and the pad was increased over 120%(about 800gf) when compared to that without the radical treatment (680gf) under the same reflow condition. Especially, at the specimen treated for 5minutes, ball shear strength was considerably increased over 150%(1150gf). Through the observation of fracture surface and cross-section microstructure, the increase of joint strength resulted from the change of fracture mode, that is, from the solder ball fracture to IMC/Ni(P) interfacial fracture. The other cases like radical treated specimen for 1, 3, 7, 9min. showed IMC/solder interfacial fracture rather than fracture in the solder ball.

달 착륙선의 히터 작동온도 설정에 따른 솔더 접합부의 구조적 신뢰성 분석 (Investigation of Structural Reliability on Solder Joint According to Heater Set-point of the Lunar Lander)

  • 전영현;박태용;이장준;김정훈;오현웅
    • 한국항공우주학회지
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    • 제46권2호
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    • pp.167-174
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    • 2018
  • 달 착륙선에는 14일에 이르는 밤 구간동안 극한의 열환경에서 생존하기 위한 열원공급을 목적으로 히터가 적용되며, 이 때 전력생성이 제한되는 착륙선의 소요전력을 최소화하는 히터 작동 온도 설정치가 결정되어야 한다. 또한 상기 온도 설정치에 따른 착륙선의 온도 변화는 탑재 전장품에 적용된 전자소자의 솔더 접합부에 대한 열기계적 신뢰성과 연관되는 중요한 설계인자이다. 본 논문에서는 임무수명이 1년인 달 착륙선의 열해석 결과를 토대로 상용 신뢰성 수명예측도구인 Sherlock을 활용하여 상기의 온도 설정치에 따른 솔더 접합부의 열 기계적 신뢰성을 검토하였다.

자동차 전장제품의 무연솔더 적용기술 및 솔더 접합부 열화거동 (Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics)

  • 홍원식;오철민
    • Journal of Welding and Joining
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    • 제31권3호
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    • pp.22-30
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    • 2013
  • Due to ELV banning, automotive electronics cannot use four kinds of heavy metal element (Pb, Hg, Cd, $Cr^{6+}$) from 2016. Therefore, this study was focused on degradation characteristics of Sn-3.0Ag-0.5Cu Lead-free solder joint with OSP and ENIG finsh under various reliability assessment method, as like to thermal shock test and high temeprature/high humidity test with test duration for cabin electronics. Also, we compared bonding strength degradation to other advanced research results of electronic control unit for engine room because of difference service temperature with mount location in automotive. Whisker growth phenomenon and mitigation method which were essentially consideration items for Pb-free car electronics were examined. Conformal coating is a strong candidate for mitigating whisker growth in automotive electronics. Necessary condition to adapt Pb-free in car electronics was shown.

Highly Reliable Solder ACFs FOB (Flex-on-Board) Interconnection Using Ultrasonic Bonding

  • Kim, Yoo-Sun;Zhang, Shuye;Paik, Kyung-Wook
    • 마이크로전자및패키징학회지
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    • 제22권1호
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    • pp.35-41
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    • 2015
  • In this study, in order to improve the reliability of ACF interconnections, solder ACF joints were investigated interms of solder joint morphology and solder wetting areas, and evaluated the electrical properties of Flex-on-Board (FOB) interconncections. Solder ACF joints with the ultrasonic bonding method showed excellent solder wetting by broken solder oxide layers on solder surfaces compared with solder joints with remaining solder oxide layer bonded by the conventional thermo-compression (TC) bonding method. When higher target temperature was used, Sn58Bi solder joints showed concave shape due to lower degree of cure of resin at solder MP by higher heating rate. ACFs with epoxy resins and SAC305 solders showed lower degree of resin cure at solder MP due to the slow curing rate resulting in concave shaped solder joints. In terms of solder wetting area, solder ACFs with $25-32{\mu}m$ diameters and 30-40 wt% showed highest wetted solder areas. Solder ACF joints with the concave shape and the highest wetting area showed lower contact resistances and higher reliability in PCT results than conventional ACF joints. These results indicate that solder morphologies and wetting areas of solder ACF joints can be controlled by adjustment of bonding conditions and material properties of solder and polymer resin to improve reliability of ACF joints.

INTERFACIAL REACTION AND STRENGTH OF QFP JOINTS USING SN-ZN-BI SOLDER WITH VARYING LEAD PLATING MATERIALS

  • Iwanishi, Hiroaki;Imamura, Takeshi;Hirose, Akio;Ekobayashi, Kojirou;Tateyama, Kazuki;Mori, Ikuo
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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    • pp.481-486
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    • 2002
  • We have investigated the effects of plating materials for Cu lead (Sn-lOPb, AwPdJNi, Sn-3.5Ag, Sn-3Bi and Sn-0.7Cu) on properties of QFP joints using a Sn-8Zn-3Bi solder. The results were compared with the joints using Sn-3. 5Ag-0. 7Cu and Sn-37Pb solders. As a result, the joints with the Sn-3.5Ag, Sn-3Bi and Sn-0.7Cu plated Cu lead had the reliability comparable to those of the Sn-3.5Ag-0.7Cu and Sn-37Pb soldered joints with respect to the joint strength after the high temperature holding tests at 348K to 423k. In particular, the joint with the Sn-3.5Ag plated Cu lead had the best reliability. This is caused by the low growth rate of a Cu-Sn interfacial reaction layer that degrades the joint strength of the soldered joints. Consequently, the Sn-3.5Ag plating was found to be most feasible plating for the Sn-8Zn-3Bi soldered joint.

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무연 솔더바에 대한 신뢰성 평가기준에 관한 연구 (Reliability Appraisal Standard for Lead-free Solder Bar)

  • 최재경;박재현;박화순;안용식
    • 마이크로전자및패키징학회지
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    • 제14권2호
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    • pp.23-33
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    • 2007
  • RoHS, WEEE 등에서의 각종 환경문제에 대한 제약으로 Pb의 사용에 대한 규제가 점차 증가 하고 있다. 따라서 무연 솔더에 대한 관심이 증폭되고 있으며, 마이크로 전자공학 산업에서 무연 솔더를 사용하기 위해서는 여러 가지 새로운 신뢰성 평가기준을 요구한다. 예를 들어 높은 온도공정을 만족하는 패키지, 새로운 솔더가 야기하는 복잡한 기계적 고장, 그리고 제품 수명을 최대한 유지시켜 줄 수 있는 무연 솔더 소재의 선택을 포함한다. 본 연구에서는 국내산 솔더바 소재를 사용하여 접합부의 기계적 특성 및 젖음성, 퍼짐성 등의 품질평가 방법을 해외규격과 비교하여 시험하고 새로운 평가기준을 찾고자 하였다. 젖음성 및 퍼짐성 시험 결과 Sn-0.7Cu 무연 솔더 소재는 평가기준을 충분히 만족하였다. 또한 이 소재를 사용한 솔더 접합부의 전단시험 결과, 열충격 및 고온방치 시험 후에도 솔더링 상태의 초기강도와 비교하여 접합부의 전단강도가 크게 저하하지 않은 상태에서 기준치를 크게 상회하였다.

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