• Proceedings of the Korean Information Science Society Conference
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• 2000.04b
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• pp.607-609
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• 2000

본 논문에서는 SVM(Support Vector Machine)과 3단의 칼라 원형 조명장치를 이용한 효율적인 납땜 검사시스템을 제안한다. 원형 조명장치를 이용하여 납땜부의 표면의 경사도에 의해서 생기는 명암의 분포로부터 납땜 검사를 위한 특징값을 추출한다. SVM은 추출된 특징값을 이용하여 납땜 영상을 정의된 타입중의 하나로 분류한다. SBM은 두 부류의경계를 최대로 하는 최적경계를 학습하므로 납땜 영상과 같이 각 부류의 경계가 모호한 문제에 대해서 적은 수의 학습 데이터를 사용해도 우수한 성능을 나타낸다. 제안된 시스템은 현산업에서 사용되고 있는 다양한 표면실장형 부품에 대해서 적용해 본 결과 적은 학습 데이터에도 효율적으로 적용될 수 있음을 보였다.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.13-19
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• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.