• 한국재료학회지
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• 제8권11호
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• pp.1011-1019
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• 1998

Pb의 환경오염 문제를 발생하지 않는 저농도 Pb 솔도합금을 개발하기 위하여, 새로운 Sn-5%Pb-1.5%Ag-x%In계 합금 조성을 설계하고, 이 합금의 융점, 젖음성, 상분석, 경도, 인장강도, 드로스성을 평가하여, Sn-37%Pb 솔더오 대체 가능성을 타진하였다. Sn-37%Pb 솔도 합금의 Pbdldhs 용출농도는 국제규제치인 3ppm보다 훨씬 적은 0.46ppm이었고, 환경문제를 유발하지 않는 것으로 확인되었다. 이 합금계의 융점은 $183-192^{\circ}C$이고, 응고온도범위도 $5^{\circ}C$내외로 매우 좁았다. 젖음성은 In의 첨가양에 따라 큰 차이가 거의 없었으며, Sn-375Pb와 비슷하였다. 융점 및 젖음성 측면에서 Sn-37%Pb와 대체 가능한 것으로 판단되었다. 경도는 Sn-37%Pb의 약 1.5배이고, 인장강도는 Sn-37%Pb의 것보다 높고, In의 첨가량에 따라 증가하였지만, 연신율은 감소하였다. In이 1% 첨가된 합금에서는 수지 상정 경계에 Ag3Sn과 Pb가 정출되고, 3% 이상에서는 $Ag_3Sn$과 $Ag_3In$ 및 Pb가 정출되었다. 드로스 생성속도는 Sn-37%Pb 합금이 Sn-5%Pb-1.5%Ag 합금보다 빠르고, In을 첨가할수록 느리고 2%의 In을 첨가한 합금은 180분에서도 거의 드로스가 발생하지 않았다.

• Applied Science and Convergence Technology
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• 제23권6호
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• pp.345-350
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• 2014

The surface oxidation mechanism of lead-free solder alloys has been investigated with multiple reflow using X-ray photoelectron spectroscopy. It was found that the solder surface of Sn-Ag-Cu-In solder alloy is surrounded by a thin $InO_x$ layer after reflow process; this coating protects the metallic surface from thermal oxidation. Based on this result, we have performed a wetting balance test at various temperatures. The Sn-Ag-Cu-In solder alloy shows characteristics of both thermal oxidation and wetting balance better than those of Sn-Ag-Cu solder alloy. Therefore, Sn-Ag-Cu-In solder alloy is a good candidate to solve the two problems of easy oxidation and low wettability, which are the most critical problems of Pb-free solders.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 추계학술발표대회 개요집
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• pp.83-85
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• 2003

This paper is investigated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which would be surely applicable to the electronic packages. As a result, in case of Max. shear strength, Sn-4Ag-0.5Cu has the highest value and Sn-37Pb has the lowest value on every condition of experiment temperature. Also, In case of Pb-free solder joint specimens, it was found that Pb-free solder alloys have higher value of shear strength than eutectic Sn-Pb solder alloy and Sn-4Ag-0.5Cu has the highest value.

• 한국재료학회지
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• 제17권1호
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• pp.43-49
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• 2007

Electrochemical migration phenomenon is correlated with ionization of anode electrode, and ionization of anode metal has similar mechanism with corrosion phenomenon. In this work, in-situ water drop test and evaluation of corrosion characteristics for SnPb solder alloys in $Na_2SO_4$ solutions were carried out to understand the fundamental electrochemical migration characteristics and to correlate each other. It was revealed that electrochemical migration behavior of SnPb solder alloys was closely related to the corrosion characteristics, and Sn Ivas primarily ionized in ${SO_4}{^2-}$ solutions. The quality of passive film formed at film surface seems to be critical not only for corrosion resistance but also for electrochemical migration resistance of solder alloys.

• Journal of Welding and Joining
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• 제16권3호
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• pp.157-166
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• 1998

Recently as environmental pollution caused by Pb has posed a serious threat to the global environment, the trend to regulate the usage of Pb in electronic industry is one the rise. Currently, the solder alloy with high Pb content, Sn-37%Pb, is utilized in the electronic assembly therefore, the objective of this study is to develop an alternative solder alloy for the existing Sn-37%Pb solder alloy. First thing, this work choosed Sn-5%Pb-1.5%Ag, Sn-5%Pb-1.5%Ag-x%Bi(x=1~5%) for candidate solder alloys, and examined their properties such as melting range, wettability, microhardness, tensile property, oxidation behavior and microstructure. Wettability was on the same level of Sn-37%Pb. Dissolution of Pb ion in Sn-5%Pb solder was 0.46ppm. This solder alloy revealed cellular dendrite microstructure $\beta$-Sn matrix, Pb-rich phase, Ag/Sn, and Cu/Sn Intermetallic compounds. The range of solidification temperature was within 3$0^{\circ}C$. Also these alloy displayed higher tensile strength and lower elongation than Sn-37%Pb. The resistance of oxidation in Sn-5%Pb-1.5%Ag solder alloy was superior to that of Sn-37%Pb solder alloy. But that of Sn-5%Pb-1.5%Ag-5%Bi solder alloy was equal to that of Sn-37%Pb solder alloy.

• 한국재료학회지
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• 제21권12호
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• pp.673-678
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• 2011

With an increased production of Printed Circuit Boards (PCBs) in electronic equipment, the consumption of solder alloys is growing globally. Recently, increasing importance of recycling solder scrap has been recognized. Generally, solder scrap contains many impurities such as plastics and other metals. Hazardous components must be eliminated for recycling solder scrap. The present work studied pretreatment for reuse of solder scrap alloys. An experiment was conducted to enhance the cleanliness of solder scrap melt and eliminate impurities, especially lead. Physical separation with sieving and magnetic force was made along with pyrometallurgical methods. A small decrease in lead concentration was found by high temperature treatment of solder scrap melt. The impurities were removed by filtration of the solder scrap melt, which resulted in improvement of the melt cleanliness. A very low concentration of lead was achieved by a zone melting treatment with repeated passage. This study reports on a pretreatment process for the reuse of solder scrap that is lead free.

• Journal of Welding and Joining
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• 제33권3호
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1999년도 특별강연 및 추계학술발표대회 개요집
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• pp.251-254
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• 1999

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1999년도 특별강연 및 춘계학술발표대회 개요집
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• pp.61-62
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• 1999

• 한국표면공학회지
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• 제35권4호
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• pp.218-231
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• 2002

As the environmental regulation worldwide emerges, most notably in Europe and Japan, the elimination of Pb usage in electronic assemblies has been an important issue for microelectronics assembly due to the inherent toxicity of Pb. This has provided an impetus towards the development of Pb-free solders. A major factor affecting alloy selection is the melting point, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation. Other important manufacturing issues are cost, availability, and wetting characteristics. Reliability related properties include mechanical strength, fatigue resistance, coefficient of thermal expansion and reactivity with substrate. In this article, Pb-free solder alloys have been proposed so far have been reviewed and are summarized.