• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.2
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• pp.168-173
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• 2008

In this paper, we have designed transmit/receive Module for X band which can be applied to active phase array radar system. AESA(active electrically beam steered array) is able to transmit high power as like TWTA with composition of TH Module and steer a main beam faster than mechanically steering system. The proposed structure of T/R Module for X band is brick type for physical structure, common leg structure electrically and small size design as MCM(multi chip module). The results show that the characteristic of proposed T/R module can fully cover the specification of required military radar application.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.4
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• pp.885-892
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• 2013

In the model Utilizing the TCP / IP socket communication to transmit and receive data, if the size of data is small and if data-transmission aren't frequently requested, the importance of communication speed between a server and a client isn't emphasized. But nowadays, it has emerged for large amounts of data transfer requests and frequent data transfer request. This paper propose the TCP/IP communication model that can be improved the data transfer rate in multi-core environment by changing the receiving structure of the client to receive large amounts of data and the transmission structure of the server to send large amounts of data.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.342-345
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• 2002

As the size of chip components and module decreases, new patteming method for fine line and geometry is needed. So far, in LTCC(Low Temperature Cofired Ceramic) process, screen printing method has been used generally. But screen printing method has some disadvantages as follows. First, the geometry including line, vias, etc. smaller than $100{\mu}m$ can't be evaluated easily. Second, the patterned dimension is different from designed value, which makes distortion in charactersitics of not only chip components but also modules. Thick film lithography has advantages of thick film screen printing process, low cost and thin film process, fine line feasibility. Using this method, the line with $30{\mu}m$ width and the geometry with expected dimension can be evaluated. In this study, the fine line with $35{\mu}m$ line/space is formed and the embedded capacitor with very small tolerance is developed using thick film lithography.

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.719-720
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• 2006

In the mechanical system, optimization of motion control is very essential in the aspect of automation technique progress. In the servo system, the function of controller is very important but most of the controllers have played only the role of pulse generator because the controller with main function is very expensive. In this thesis, the system was composed of PC, commonly used driver AC servo motor and a produced control board. The PC transmit a gain, a locus data to a driver and controller. At the same time, it converts imformation from the controller and convert them into data and offer an output with graph. The role of a controller is to trasmit a locus data to a driver and counting the pulse on the phase of an encoder to the PC. We have performed the experiment in order to confirm with variable PID parameter capable of the optimization of gain tuning with the counting of feedback control sensor signal with regard to the external interface into the system, such as torque. Based on the experiment result, we have confirmed as follows: First, it was confirmed that we could easily input control factors P.I Gain, constant $K_P,\;K_I$ into PC. Second, not only pulse generator function was possible, but with this pulse it was also possible to count using software with PIC chip. And third, using the multi-purpose PIC micro chip, simple operation and the formation of small size AC Servo Controller was possible.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.39C no.3
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• pp.234-238
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• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.8 no.3
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• pp.586-597
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• 2004

MAC (Medium Access Control) protocol is necessary for a OLT (Optical Line Termination) to allocate bandwidth to ONUs (Optical Network Units) dynamically in ATM PON (Passive Optical Network) operated in a kind of optical subscriber network having tree topology. The OLT collect information about ONUs and provide all permission with each ONU effectively by means of MAC protocol. Major functions of MAC protocol are composed of the algorism for distributing permission demanded by a ONU dynamically and allocation all permission used in APON properly. Sometimes MAC get to be a element of limiting the whole operation speed and occupy a most frequent operation part of the TC (Transmission Convergence) function module so it have to be designed to guarantee the best quality for each traffic. This paper introduce the way of implementation of a algorism which satisfy all of the upper renditions. This MAC algorism allocate bandwidth according to a number of working ONU and the information of the queue length dynamically and distribute permission for same interval to minimize delay variation of each ONU cell. MAC scheduler for the dynamic bandwidth allocation which is introduced in this paper has look-up table structure that makes programming possible. This structure is very suitable for implementation and operated in high speed because it require very simple and small chip size.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.17 no.2
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• pp.353-368
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• 2023

The four wing unmanned aerial vehicle owns the characteristics of small size, light weight, convenient operation and well stability. But it is easily disturbed by external environmental factors during flight with these disadvantages of short endurance and poor attitude solving ability. For solving these problems, a microprocessor based on STM32 chip is designed and the overall development is completed by the resources such as built-in timer and multi-function mode general-purpose input/output provided by the master micro controller unit, together with radio receiver, attitude meter, barometer, electronic speed control and other devices. The unmanned aerial vehicle can be remotely controlled and send radio waves to its corresponding receiver, control the analog level change of its corresponding channel pins. The master control chip can analyze and process the data to send multiple sets pulse signals of pulse width modulation to each electronic speed control. Then the electronic speed control will transform different pulse signals into different sizes of current value to drive the motor located in each direction of the frame to generate different rotational speed and generate lift force. To control the body of the unmanned aerial vehicle, so as to achieve the operator's requirements for attitude control, the PID controller based on Kalman filter is used to achieve quick response time and control accuracy. Test results show that the design is feasible.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.6 s.109
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• pp.511-518
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• 2006

In this paper, a small RFID tag antenna in UHF band which has bandwidth-enhanced characteristic is proposed. The shape of the proposed antenna is a meander antenna to have size-reduced characteristic, and it consists of two radiators which make dual resonance in adjacent frequency to enhance bandwidth. By adjusting length and location of each radiator, the proposed antenna can make dual resonance at arbitrary location on the Smith chart, which is able to make impedance matching with RFID tag chip in wide frequency range. And it is apparent that the proposed antenna can have bandwidth-enhanced characteristic according to the simulated and measured results.

• The Journal of the Convergence on Culture Technology
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• v.6 no.3
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• pp.427-430
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• 2020

The multi-channel analog signal to digital signal conversion is increasing in the field of IoT and medical measurement equipments. It has chip area and power consumption constraints to use a few single or 2_channel ADC for multi_channel application. This paper described to design and implement a proposed comb filter for multi-channel, 24bit ADC. The function of proposed comb filter is verified by matlab simulation and the FPGA test board. It was fabricated using SK Hynix 0.35㎛ CMOS standard process. The performance and chip size is compared with the existing design method that uses integrator/differentiator and FIR construction. The proposed comb filter is expected to use the IoT product and medical measurement equipments that require multi-channel, low power consumption and small hardware size.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.11-19
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• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.