• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.8
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• pp.720-727
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• 2004

In the process of ice-slurry making, the phenomenon of ice adhesion influences extremely to ice making system. In this study, the effect on the ice adhesion by thermal storage material with additives is investigated quantitatively. Various solutions of 300 g in a stainless vessel were frozen under stirring. Through the experiment the ice adhesion between cooling wall and ice-slurry was compared with each other by measuring the stirring power. From the experiment, the stirring power in EG, SCA solution was smaller than those in the solution containing functional materials, such as poly-vinyl-alcohol or kitchen detergent.

• Journal of the Korean Ceramic Society
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• v.50 no.6
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• pp.528-532
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• 2013

Well-dispersed slurries of submicron-sized alumina powders were pressure-infiltrated in 3D preforms of mullite fibers and the effects of the particle size and infiltration pressure on the particle packing characteristics were investigated. Infiltration without pressure showed that the packing density increased as the particle size decreased due to the reduction of the friction between the particles and the fibers. The infiltrated preforms contained large pores in the large voids between the fiber tows and small pores in the narrow voids between the individual fibers. Pressure infiltration resulted in a packing density of 77% regardless of the particle size or the infiltration pressure(210 ~ 620 kPa). Pressure infiltration shortened the infiltration time and eliminated the large pores in preforms infiltrated with the slurries of smaller particles. The slurry pressure-infiltration process is thus an efficient method for the packing of matrix materials in various preforms.

• Journal of the Korean Ceramic Society
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• v.54 no.6
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• pp.525-529
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• 2017

To improve the thermal resistance of a porous borosilicate lining block, we prepared and applied polysiloxane-fumed silica-ethanol slurry on top of the block and fired the coating layer using a torch for 5 minutes at $800^{\circ}C$. We conducted magnified characterizations using a microscope and XRD analysis to observe phase transformations, and TGA-DTA analysis to determine the thermal resistance. Thermal characterizations showed improved heat resistance with relatively high polysiloxane content slurry. Cross-sectional optical microscope observation showed less melting near the surface and decreased pore formation area with higher polysiloxane content slurry. XRD analysis revealed that the block and coating layer were amorphous phases. TGA-DTA analysis showed an endothermic reaction at around $550^{\circ}C$ as the polysiloxane in the coating layer reacted to form SiOC. Therefore, coating polysiloxane on a borosilicate block contributes to preventing the melting of the block at temperatures above $800^{\circ}C$.

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.80-80
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• 2001

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.8.2-8.2
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• 2007

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.11a
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• pp.91-91
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• 2001

• Korean Journal of Materials Research
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• v.9 no.9
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• pp.865-871
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• 1999

Effect of sintering condition in mechanical properties of ZrSiO\ulcorner shell molds was investigated. Number of microcrack in primary layer of the mold was maximized after preheating at $1000^{\circ}C$ for 1.5 hours. Yield strength and specific surface area of the mold were inversely proportion to sintering temperature and time. After hot deformation test at $1500^{\circ}C$ for 4 hours, molds were deformed opposite to the loading direction and backup layers were cracked along the interface between stucco and zircon slurry. Reverse deformation of the molds during hot deformation test was considered to be resulted from the difference of thermal expansion coefficient between alumina stucco and zircon slurry in primary coat, and size difference between zircon stucco and zircon slurry in backup coat.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.376-380
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• 2003

The microstructure and the mechanical properties of RS-SiC and RS-$SiC_f/SiC$ materials have been investigated in conjunction with the content of residual silicon and porosity. The mechanical properties of RS-SiC materials suffered from the thermal exposure were also examined. RS-SiC based materials bave been fabricated using the complex matrix slurry with different composition ratios of SiC and C panicles. The characterization of RS-SiC based materials was investigated by means of SEM, EDS ~d three point bending test. Based on the mechanical property-microstructure correlation, the high temperature applicability of RS-SiC based materials was discussed.

• Corrosion Science and Technology
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• v.7 no.6
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• pp.362-369
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• 2008

The impact abrasion behavior of high manganese steel is investigated under three kinds of impact energy in acid hematite ore slurry by using a modified MLD-10 impact abrasion tester. Through the SEM observation of the worn surface and the optical metallographic analysis of the cross-sectional samples, the corrosive impact abrasion mechanisms of the steel under different impact energies are studied. In acid-hematite slurry, the variations of impact energies would result in synchronous transformation of the impact abrasion properties and mechanisms of the high manganese steel in the corrosive condition, as led different corrosive impact abrasion mechanism under different impact energies.

• Korean Journal of Materials Research
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• v.15 no.6
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• pp.426-430
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• 2005

Chemical mechanical polishing (CMP) is an essential process in the production of integrated circuits containing copper interconnects. The effect of alanine in reactive slurries representative of those that might be used in copper CMP was studied with the aim of improving selectivity between copper(Cu) film and tantalum-nitride(TaN) film. We investigated the pH effect of nano-colloidal silica slurry containing alanine through the chemical mechanical polishing test for the 8(inch) blanket wafers as deposited Cu and TaN film, respectively. The copper and tantalum-nitride removal rate decreased with the increase of pH and reaches the neutral at pH 7, then, with the further increase of pH to alkaline, the removal rate rise to increase soddenly. It was found that alkaline slurry has a higher removal rate than acidic and neutral slurries for copper film, but the removal rate of tantalum-nitride does not change much. These tests indicated that alanine may improve the CMP process by controlling the selectivity between Cu and TaN film.