• Environmental Engineering Research
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• v.20 no.2
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• pp.133-140
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• 2015

The aim of this study was to investigate the bacteriophage removal in various clay minerals and clay-amended soils. Batch experiments in kaolinite, montmorillonite, and bentonite showed that kaolinite was far more effective at the MS2 removal than montmorillonite and bentonite. In kaolinite, the log removal increased from 0.046 to 2.18, with an increase in the adsorbent dose from 0.3 to $50g\;L^{-1}$, whereas the log removals in montmorillonite and bentonite increased from 0.007 to 0.40 and from 0.012 to 0.59, respectively. The MS2 removal in kaolinite-amended silt loam soils was examined at three different soil-to-solution (STS) ratios. Results indicated that the log removal of MS2 increased with an increase in the kaolinite content and the STS ratio. At the STS ratio of 1:10, the log removal of MS2 increased from 2.33 to 2.80 with an increase in the kaolinite content from 0% to 10% in kaolinite-amended soils. The log removals of MS2 at the STS ratios of 1:2 and 1:1 increased from 2.84 to 3.47 and from 3.46 to 4.76, respectively, with an increase in the kaolinite content from 0% to 10%. Results also indicated that the log removals of PhiX174 and $Q{\beta}$ in kaolinite-amended soils were similar to each other, but they were far lower than those of MS2 at all the kaolinite contents. The log removal of PhiX174 increased from 0.16 to 0.32, whereas the log removal of $Q{\beta}$ changed from 0.17 to 0.22 with an increase in the kaolinite content from 0% to 10%.

• Economic and Environmental Geology
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• v.32 no.2
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• pp.177-187
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• 1999

Gravity, magnetic and VLF surveys were conducted to investigat the structural stability and hazards associated with the Ubong landfill in Pohang City, which has been built to dump industrial wastes. In 1994, the collapse of a bank happened in the 6th landfill site due to sudden heavy rain, and a large quantity of waste materials flowed out to the nearby landfill sites, factories and roads. We used $10{\times}10m$ resolution DEM data for gravity reductions. The maximum variation of the terrain effect in the survey area is about 0.5 mgal and the terrain effect is large in the vicinity of bank boundary. The Bouguer gravity anomaly map shows the effect due to the variatino of thickness and type of waste materials. The small negative gravity anomaly increases from the 9th site to the 6th site. The small negative gravity anomaly of the 9th site reflects the relatively shallow dumping depth of average 14.5 m in this site and increased density of waste materials by the repeated stabilization process of soil overlaying. The 6th site is located at the center of the former valley and rainfall and groundwater are expected to flow from south-east to north-west. Therefore, considering the previous accident of mixing waste and bank materials at the north-west boundary of the landfill, there may be some environmental problems of leakage of contaminated water and bank stability. The complex inversion technique using Simulated annealing and Marquardt-Levenberg methods was applied to calculate three-dimensional density distribution from gravity data. In the case of 6th site, it is apparent that the landfill had been dumped in four sectors. However, most part of the 9th site and showed that high magnetic industrial wastes were concentrated in the 6th site. The result of magnetic survey showing low magnetic anomalies along the boundaries of two sites is similar to that of gravity data. The VLF data also reveals four divided sectors in the 6th site, and overall anomaly trend indicates the directio of former valley.

• Proceedings of the KOSOMBE Conference
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• v.1998 no.11
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• pp.231-232
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• 1998

The purpose of this study was to examine whether the precipitation of calcium phosphate on titanium surface was affected by surface modification. To improve the bone conductivity, of titanium, samples were devided into 4 groups. Group 1 was immersed in 5M-NaOH solution at $60^{\circ}C$ for 24 hours. Group 2 was immersed in 5M-NaOH solution at $60^{\circ}C $ for 24 hours and heat-treated at $600^{\circ}C$ for 1 hour. Group 3 was anodized in Hanks' solution at 1V, $25^{\circ}C$ for 1 hour. Group 4 was anodized in Hanks' solution at 5V, $80^{\circ}C$ for 5 minutes. And then, all specimens were immersed in the MEM Eagle's medium whose composition was similar to that of extracellular fluid for 30 days. The precipitation of the calcium phosphate on implant surface was increased by the immersion in the NaOH solution, and more highly accelerated by heat treatment at $600^{\circ}C$. The precipitation of the calcium phosphate on titanium implant was increased with the treatment of the anodic oxidation in Hanks' solution at 5V, $80^{\circ}C$.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.53-53
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• 2011

This paper describes results for surface and bulk characterization of the most promising thin film solar cell material for high performance devices, (Ag,Cu) (In,Ga) Se2 (ACIGS). This material in particular exhibits a range of exotic behaviors. The surface and general materials science of the material also has direct implications for the operation of solar cells based upon it. Some of the techniques and results described will include scanning probe (AFM, STM, KPFM) measurements of epitaxial films of different surface orientations, photoelectron spectroscopy and inverse photoemission, Auger electron spectroscopy, and more. Bulk measurements are included as support for the surface measurements such as cathodoluminescence imaging around grain boundaries and showing surface recombination effects, and transmission electron microscopy to verify the surface growth behaviors to be equilibrium rather than kinetic phenomena. The results show that the polar close packed surface of CIGS is the lowest energy surface by far. This surface is expected to be reconstructed to eliminate the surface charge. However, the AgInSe2 compound has yielded excellent atomic-resolution images of the surface with no evidence of surface reconstruction. Similar imaging of CuInSe2 has proven more difficult and no atomic resolution images have been obtained, although current imaging tunneling spectroscopy images show electronic structure variations on the atomic scale. A discussion of the reasons why this may be the case is given. The surface composition and grain boundary compositions match the bulk chemistry exactly in as-grow films. However, the deposition of the heterojunction forming the device alters this chemistry, leading to a strongly n-type surface. This also directly explains unpinning of the Fermi level and the operation of the resulting devices when heterojunctions are formed with the CIGS. These results are linked to device performance through simulation of the characteristic operating behaviors of the cells using models developed in my laboratory.

• Journal of the Korean Society for Heat Treatment
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• v.17 no.6
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• pp.346-355
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• 2004

The flame quenching process has been employed to modify the surfaces of commercial marine propeller material, aluminum bronze alloy (Cu-8.8Al-5Ni-5Fe), and the microstructure, hardness and wear properties of the flame-quenched layers have been studied. The thermal history was accurately monitored during the process with respect to both the designed maximum surface temperature and holding time. The XRD and EDX analyses have shown that at temperatures above $T_{\beta}$, the microstructure consisting of ${\alpha}+{\kappa}$ phases changed into the ${\alpha}+{\beta}^{\prime}$ martensite due to an eutectoid reaction of ${\alpha}+{\kappa}{\rightarrow}{\beta}$ and a martensitic transformation of ${\beta}{\rightarrow}{\beta}^{\prime}$. The ${\beta}^{\prime}$ martensite phase formed showed a face-centered cubic (FCC) crystal structure with the typical twinned structure. The hardness of the flame-quenched layer having the ${\alpha}+{\beta}^{\prime}$ structure was similar to that of the ${\alpha}+{\kappa}$ structure and depended sensitively on the size and distribution of hard ${\kappa}$ and ${\beta}^{\prime}$ phases with depth from the surface. As a result of the sliding wear test, the wear resistance of the flame-quenched layer was markedly enhanced with the formation of the ${\beta}^{\prime}$ martensite.

• Journal of Surface Science and Engineering
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• v.42 no.3
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• pp.133-138
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• 2009

Effects of bipolar pulse driving frequency between 50 kHz and 250 kHz on the discharge shapes were analyzed by measuring plasma characteristics by OES (Optical Emission Spectroscopy) and Langmuir probe. Plasma characteristics were modeled by a simple electric field analysis and fluid plasma modeling. Discharge shapes by a continuous dc and bipolar pulsed dc were different as a dome-type and a vertical column-type at the cathode. From OES, the intensity of 811.5 nm wavelength, the one of the main peaks of Ar, decreased to about 43% from a continuous dc to 100 kHz. For increasing from 100 kHz to 250 kHz, the intensity of 811.5 nm wavelength also decreased by 46%. The electron density decreased by 74% and the electron temperature increased by 36% at the specific position due to the smaller and denser discharge shape for increasing pulse frequency. Through the numerical analysis, the negative glow shape of a continuous dc were similar to the electric potential distribution by FEM (Finite Element Method). For the bipolar pulsed dc, we found that the electron temperature increased to maximum 10 eV due to the voltage spikes by the fast electron acceleration generated in pre-sheath. This may induce the electrons and ions from plasma to increase the energetic substrate bombardment for the dense thin film growth.

• Korean Journal of Materials Research
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• v.28 no.5
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• pp.268-272
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• 2018

An $Al_2O_3/AlN$ bilayer deposited on GaN by atomic layer deposition (ALD) is employed to prepare $Al_2O_3/AlN/GaN$ metal-insulator-semiconductor (MIS) diodes, and their interfacial properties are investigated using X-ray photoelectron spectroscopy (XPS) with sputter etch treatment and current-voltage (I-V) measurements. XPS analyses reveal that the native oxides on the GaN surface are reduced significantly during the early ALD stage, indicating that AlN deposition effectively clelans up the GaN surface. In addition, the suppression of Al-OH bonds is observed through the ALD process. This result may be related to the improved device performance because Al-OH bonds act as interface defects. Finally, temperature dependent I-V analyses show that the barrier height increases and the ideality factor decreases with an increase in temperature, which is associated with the barrier inhomogeneity. A Modified Richardson plot produces the Richardson constant of $A^{**}$ as $30.45Acm^{-2}K^{-2}$, which is similar to the theoretical value of $26.4Acm^{-2}K^{-2}$ for n-GaN. This indicates that the barrier inhomogeneity appropriately explains the forward current transport across the $Au/Al_2O_3/AlN/GaN$ interface.

• Korean Journal of Materials Research
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• v.28 no.2
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• pp.89-94
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• 2018

The properties of 18 K red gold solder alloys were investigated by changing the content of In up to 10.0 wt% in order to replace the hazardous Cd element. Cupellation and energy dispersive X-ray spectroscopy (EDS) were used to check the composition of each alloy, and FE-SEM and UV-VIS-NIR-Colormeter were employed for microstructure and color characterization. The melting temperature, hardness, and wetting angle of the samples were determined by TGA-DTA, the Vickers hardness tester, and the Wetting angle tester. The cupellation result confirmed that all the samples had 18K above 75.0wt%-Au. EDS results showed that Cu and In elements were alloyed with the intended composition without segregation. The microstructure results showed that the amount of In increased, and the grain size became smaller. The color analysis revealed that the proposed solders up to 10.0 wt% In showed a color similar to the reference 18 K substrate like the 10.0 wt% Cd solder with a color difference of less than 7.50. TGA-DTA results confirmed that when more than 5.0 wt% of In was added, the melting temperature decreased enough for the soldering process. The Vickers hardness result revealed that more than 5.0 wt% In solder alloys had greater hardness than 10.0 wt% Cd solder, which suggested that it was more favorable in making a wire type solder. Moreover, all the In solders showed a lower wetting angle than the 10.0 wt% Cd solder. Our results suggested that the In alloyed 18 K red gold solders might replace the conventional 10.0 wt% Cd solder with appropriate properties for red gold jewelry soldering.

• Bulletin of the Korean Chemical Society
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• v.34 no.4
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• pp.1181-1187
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• 2013

Water-dispersible ZnS:Mn nanocrystals were synthesized by capping the surface of the nanocrystal with O-(2-Aminoethyl)polyethylene glycol (PEG-$NH_2$, Mw = 10,000 g/mol) and O-(2-Carboxyethyl)polyethylene glycol (PEG-COOH, Mw = 10,000 g/mol) molecules. The modified PEG capped ZnS:Mn nanocrystal powders were thoroughly characterized by XRD, HR-TEM, EDXS, ICP-AES and FT-IR spectroscopy. The optical properties were also measured by UV/Vis and photoluminescence (PL) spectroscopies. The PL spectra showed broad emission peaks at 600 nm with similar PL efficiencies of 7.68% (ZnS:Mn-PEG-NH2) and 9.18% (ZnS:Mn-PEG-COOH) respectively. The measured average particle sizes for the modified PEG capped ZnS:Mn nanocrystals by HR-TEM images were 5.6 nm (ZnS:Mn-PEG-NH2) and 6.4 nm (ZnS:Mn-PEG-COOH), which were also supported by Debye-Scherrer calculations. In addition, biological toxicity effects of the nanocrystals over the growth of wild type E. coli were investigated. They showed no biological toxicity to E. coli until very high concentration dosage of 1 mg/mL of the both nanocrystal samples.

• Korean Journal of Materials Research
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• v.24 no.3
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• pp.166-173
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• 2014

The effects of printed circuit board electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the electromigration reliability and shear strength of Sn-3.5Ag Pb-free solder bump were systematically investigated. In-situ annealing tests were performed in a scanning electron microscope chamber at 130, 150, and $170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). Electromigration lifetime and failure modes were investigated at $150^{\circ}C$ and $1.5{\times}10^5A/cm^2$, while ball shear tests and failure mode analysis were conducted under the high-speed conditions from 10 mm/s to 3000 mm/s. The activation energy of ENIG and OSP surface finishes during annealing were evaluated as 0.84 eV and 0.94 eV, respectively. The solder bumps with ENIG surface finish showed longer electromigration lifetime than OSP surface finish. Shear strengths between ENIG and OSP were similar, and the shear energies decreased with increasing shear speed. Failure analysis showed that electrical and mechanical reliabilities were very closely related to the interfacial IMC stabilities.