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INFLUENCE OF SPARK PLASMA SINTERING TEMPERATURE ON MICROSTRUCTURE AND TTHERMOELECTRIC PROPERTIES OF Cu-DOPED Bi0.5Sb1.495Te3 COMPOUND

  • CHUL-HEE LEE;PEYALA DHARMAIAH;JUN-WOO SONG;KWANG-YONG JEONG;SOON-JIK HONG
    • Archives of Metallurgy and Materials
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    • v.65 no.3
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    • pp.1105-1110
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    • 2020
  • Due to air pollution, global warming and energy shortage demands new clean energy conversion technologies. The conversion of industrial waste heat into useful electricity using thermoelectric (TE) technology is a promising method in recent decades. Still, its applications are limited by the low efficiency of TE materials in the operating range between 400-600 K. In this work, we have fabricated Cu0.005Bi0.5Sb1.495Te3 powder using a single step gas atomization process followed by spark plasma sintering at different temperatures (623, 673, 723, and 773 K), and their thermoelectric properties were investigated. The variation of sintering temperature showed a significant impact on the grain size. The Seebeck coefficient values at room temperature increased significantly from 127 µVK to 151 µV/K with increasing sintering temperature from 623 K to 723 K due to decreased carrier concentration. The maximum Z T values for the four samples were similar in the range between 1.15 to 1.18 at 450 K, which suggest these materials could be used for power generation in the mid-temperature range (400-600 K).

Energy Absorption Mechanism of Glass/Epoxy 3-D braided structure in Low Velocity Impact Test (유리/에폭시 3차원 브레이드 복합재료의 저속 충격 에너지 흡수기구)

  • Joo Ki Ho;Sul In Hwan;Kim Soo Chang;Kang Tae Jin
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2004.10a
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    • pp.167-170
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    • 2004
  • In order to investigate the impact behaviors of 3-D braided glass/epoxy composites, the energy profiles and damage area were compared to the laminates of similar volume fraction and composition. The energy profiles showed different characteristics from each other which indicates they have distict energy absorption mechanisms. The image analysis on the damage projections visualized the crack propagation paths along the fiber direction.

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Induction of Amylase Formation in Barley Seed by Gibberellic Acid (대맥종자의 Amylase 생성에 미치는 Gibberellic Acid의 효과)

  • 채인기
    • Journal of Plant Biology
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    • v.14 no.1
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    • pp.1-4
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    • 1971
  • To determine the amylase fromation mechanism and the effect of GA. in germinating barley seeds, they were divided into embryo-less seed, isolated embryo, aleurone layer and pure endosperm etc., treated with GA, and cultured separately or in mixed lots. The result obtained are as follows. 1) The amylase of barley seed is formed in the aleurone layer under the effect of inducing materials excreted from the embryo. 2) The embryonic materials amylase formation could be substituted for by GA. Therefore it can be presumed that the substance produced by the embryo which induces amylase synthesis is probably GA or material similar to it.

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The Variations of Temperature and Humidity with the Insultor Materials in Wingtering Beehouse (단열재에 따른 저온양봉사 내부의 온.습도변화)

  • 이석건;김란숙;이현우;이종원
    • Proceedings of the Korean Society of Agricultural Engineers Conference
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    • 1999.10c
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    • pp.424-428
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    • 1999
  • The simulation and experiments were conducted to anlayzed the vaiation of the temperature and humicity in the wintering beehouses which had two kinds of the insulator materials of urethane foam and sandwich panel individually . It was found that inside temperature of sandwich panel beehouse was similar to the urethane foam at the same outside temperature by the simulation results. The variation of the inside temperature and humidity for the urethane foam was less than the sandwich panel.

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Low Temperature Cure Film Adhesive

  • Liang, Bin;Zhao, Shenglong
    • Journal of Adhesion and Interface
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    • v.5 no.2
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    • pp.1-7
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    • 2004
  • A novel carboxyl terminated butadiene-acrylonitrile (CTBN) modified, low temperature cure epoxy film adhesive was developed in this paper. It can be cured at as low as $75^{\circ}C$ for 4 hours with a pressure of 0.1MPa. After post cure at $120^{\circ}C$ for 2 hours, the bonding strengths of Phosphoric Acid Anodizing(PAA) surface treated aluminum adherend were similar to those of structural film adhesives curing at $120^{\circ}C$. It is suitable to bond both metal/composite laminate-to-laminate and laminate to honeycomb structure.

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Two-dimensional heterostructures for All-2D Electronics

  • Lee, Gwan-Hyeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.100-100
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    • 2016
  • Among various two-dimensional (2D) materials, 2D semiconductors and insulators have attracted a great deal of interest from nanoscience community beyond graphene, due to their attractive and unique properties. Such excellent characteristics have triggered highly active researches on 2D materials, such as hexagonal boron nitride (hBN), molybdenum disulfide (MoS2), and tungsten diselenide (WSe2). New physics observed in 2D semiconductors allow for development of new-concept devices. Especially, these emerging 2D materials are promising candidates for flexible and transparent electronics. Recently, van der Waals heterostructures (vdWH) have been achieved by putting these 2D materials onto another, in the similar way to build Lego blocks. This enables us to investigate intrinsic physical properties of atomically-sharp heterostructure interfaces and fabricate high performance optoelectronic devices for advanced applications. In this talk, fundamental properties of various 2D materials will be introduced, including growth technique and influence of defects on properties of 2D materials. We also fabricate high performance electronic/optoelectronic devices of vdWH, such as transistors, memories, and solar cells. The device platform based on van der Waals heterostructures show huge improvement of devices performance, high stability and transparency/flexibility due to unique properties of 2D materials and ultra-sharp heterointerfaces. Our work paves a new way toward future advanced electronics based on 2D materials.

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Impact-Response of Floor Construction Materials (바닥건축재료의 충결하중에 대한 반응)

  • Jang, Sang-Sik
    • Journal of the Korean Wood Science and Technology
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    • v.23 no.2
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    • pp.83-87
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    • 1995
  • Impact-bouncing height of steel balls dropped from 1m height on various floor materials were measured to evaluate impact-bouncing characteristics depending on floor materials and the effect of these properties on walkability and fatigue of humanbody. Stone and tile finished concrete floor showed the highest bouncing height of around 70%, and soil showed the lowest bouncing height of around 3%. The second highest bouncing height was about 40% which corresponded to terazo finished concrete floor and about twice as high as the bouncing height on concrete floor without finishing. The impact-bouncing height could be lowered to 15~20% by using gum tile on concrete floor. Steel showed similar bouncing height to concrete floor, and wood-based materials showed the second lowest bouncing height next to soil. Among wood-based materials, hardwood species having higher specific gravities showed relatively high bouncing height of 8~24%, softwood species having low specific gravities showed relatively lower bouncing height of 5~18%, and wood composites showed bouncing height of 8~18%. Among all the materials used in this study, wood-based floor materials corresponded to the bouncing height of 10~15% which is considered to be best for humanbody. Surface painting on wood-based materials increased the bouncing height, and the number of bouncing of steel balls after dropping from 1m height increased as the bouncing height increased.

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Effect of SO42- Ion on Corrosion and Electrochemical Migration Characteristics of Eutectic SnPb Solder Alloy (공정조성 SnPb Solder 합금의 부식 및 Electrochemical Migration 특성에 미치는 SO42- 이온의 영향)

  • Jung, Ja-Young;Yoo, Young-Ran;Lee, Shin-Bok;Kim, Young-Sik;Joo, Young-Chang;Park, Young-Bae
    • Korean Journal of Materials Research
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    • v.17 no.1
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    • pp.43-49
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    • 2007
  • Electrochemical migration phenomenon is correlated with ionization of anode electrode, and ionization of anode metal has similar mechanism with corrosion phenomenon. In this work, in-situ water drop test and evaluation of corrosion characteristics for SnPb solder alloys in $Na_2SO_4$ solutions were carried out to understand the fundamental electrochemical migration characteristics and to correlate each other. It was revealed that electrochemical migration behavior of SnPb solder alloys was closely related to the corrosion characteristics, and Sn Ivas primarily ionized in ${SO_4}{^2-}$ solutions. The quality of passive film formed at film surface seems to be critical not only for corrosion resistance but also for electrochemical migration resistance of solder alloys.

Precipitation Process in Cu-0.2%Cr-0.05%Zr Alloy Studied by the Electrical Resistivity Measurements (전기저항 측정에 의한 Cu-0.2%Cr-0.05%Zr 합금의 시효석출 거동)

  • Koo, B.H.;Lee, C.G.;Kim, C.J.;Bae, D.S.
    • Journal of the Korean Society for Heat Treatment
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    • v.18 no.5
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    • pp.312-317
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    • 2005
  • The precipitation process in Cu-0.2 wt.%Cr-0.05 wt.%Zr alloys has been studied by electrical electrical resistivity measurements. The kinetics of precipitation could be well described by Johnson-Mehl-Avrami equation, $f(t)=1-\exp(-kt^n)$. The values of n were found to be in the range of 0.36~0.42 at first stage and 1.3~1.6 at second stage. The activation energy was determined by cross-cut method and was 80~89 kJ/mol. The value is similar to the energy for the migration of either a vacancy or a vacancy-solute complex through the lattice.

Effects of Ultrasonic Irradiation on Physical Properties of Silica/PEG Hybrids

  • Jung, Hwa-Young;Gupta, Ravindra K.;Lee, Sang-Ki;Whang, Chin-Myung
    • Journal of the Korean Ceramic Society
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    • v.39 no.2
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    • pp.113-119
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    • 2002
  • The effect of ultrasonic radiation is reported for silica-poly(ethylene glycol) system prepared without the solvent using sol-gel processing by varying various parameters such as ultrasonic irradiation time, PEG content and HCl/TEOS molar ratio. The property of sonogel is compared with classic gel which has been prepared with ethanol as a solvent by traditional sol-gel processing. SEM, BET, DTA-TGA, density and Vickers hardness measurements are carried out for analyzing the samples. The gelation time is found strongly dependent on radiation time, PEG content and pH value, and has been discussed on the basis of existing theories. The $SiO_2-10$ & 20 wt% PEG sonogel exhibited superior optical, physical and gel properties as compared to the classic gel, hence, found suitable for device applications. The ultrasonic radiation increased the density and surface area, and also reduced the pore size which is well supported by the shift in the peak of DTA curve. The DTA thermogram was found similar to that of pure silica gel.